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    • 2. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH02270367A
    • 1990-11-05
    • JP9057989
    • 1989-04-12
    • HITACHI LTD
    • MIZOGUCHI TETSUROMORI MUTSUHIRO
    • H01L21/762H01L21/76H01L21/8234H01L27/088H01L29/78
    • PURPOSE:To obtain an integrated circuit device improved in degree of integration and provided with an inverter circuit capable of dealing with a large current by a method wherein a dielectric isolating substrate provided with a single crystal region which penetrates through it is used, and a high power element is formed on the single crystal region. CONSTITUTION:In a semiconductor integrated circuit device formed on a dielectric isolation substrate composed of a first single crystal region 5 penetrating through a substrate 7, a second single crystal region 10 exposed only at the first primary face of the substrate 7 and covered with an insulating film 9 except its exposed part and a polycrystalline region serving as the substrate 7, high power elements 1 and 2 are formed on the single crystal regions 5 and 10 respectively. For instance, an N-MOSFET 1 serving as an upper arm element of an inverter circuit is formed in the single crystal region 5 which penetrates through the substrate 7, and a drain electrode is formed on the rear side of the substrate 7. An N-MOSFET 2 serving as a lower arm is formed inside the single crystal region 10 whose bottom and side face are surrounded with an SiO2 film 9 through the same way as a conventional technique.
    • 5. 发明专利
    • GATE TURN-OFF THYRISTOR AND ITS MANUFACTURE
    • JPH0722607A
    • 1995-01-24
    • JP14327793
    • 1993-06-15
    • HITACHI LTD
    • MIZOGUCHI TETSUROKAWAKAMI SUMIOKOBAYASHI HIDEO
    • H01L29/744H01L29/74
    • PURPOSE:To enhance gate breakdown strength and an anode maximum blocking voltage without raising an on-voltage by a method wherein impurity concentration of an n-type layer separated from a p base layer and an n emitter layer is lowered to have concentration the same as or lower than an n layer. CONSTITUTION:A Si nitride film 15 is formed in an n-type Si substrate 7 and a groove 4 is formed and a Si oxide film 10 is formed within the groove 4 and a Si oxide film 11 is formed by etching. Next, the Si oxide film 11 is used as a mask to diffuse p-type impurity to form a p base layer 1. A diffusion depth of the p base layer 1 is regulated to form an n layer 6 having lower concentration. Next, a p layer 5 having higher concentration is formed near an exposure part of a p base layer surface, and a Si oxide film is again formed to remove a Si nitride film 15 and an n emitter layer 2 is further formed by an impurity diffusion. Thus, breakdown strength between the gate and cathode in a connection part J3 is enhanced, and also concentration of the p base layer 1 in a connection part J2 is enhanced, so that an anode maximum blocking voltage can be enhanced.
    • 6. 发明专利
    • DIELECTRIC ISOLATED SUBSTRATE AND MANUFACTURE THEREOF
    • JPH02135755A
    • 1990-05-24
    • JP28895588
    • 1988-11-17
    • HITACHI LTD
    • MIZOGUCHI TETSUROSHIRASAWA TOSHIKATSUSEKINE SHIGEKIISHIKAWA TORU
    • H01L21/762H01L21/76H01L27/088H01L29/739H01L29/78
    • PURPOSE:To reduce the thickness of an island while maintaining the pressure resistance of a high pressure resistance element and to improve integration of a circuit by forming a supporting substrate material in a multilayer structure of a high concentration impurity region and a low concentration impurity region, and forming a layer in contact with an oxide film to become an insulating film in the low concentration impurity region. CONSTITUTION:When an IGBT is formed in a second n-type single crystalline region 1 at the first main face 8 side of a dielectric isolated substrate, an N-type low concentration grown layer 6 is diffused with impurity from a P type high concentration grown layer 7 during a heat treating step to become a P-type transition region. Impurity such as boron, etc., is diffused from the layer 7 into an island through a high concentration impurity buried layer 4 at the time of high temperature heat treatment for a long period of time at the time of formation of an element, but it can be prevented by the layer 6 to become the P-type transition region. Thus, the thickness of an I-type layer in an island necessary for pressure resistance can be reduced to approx. 80% of that of a conventional one, and the whole chip area of a semiconductor integrated circuit can be reduced to 90%.
    • 7. 发明专利
    • MEMORY CELL
    • JPS6445179A
    • 1989-02-17
    • JP20173187
    • 1987-08-14
    • HITACHI LTD
    • MIZOGUCHI TETSURO
    • G11C11/44H01L27/10H01L39/22
    • PURPOSE:To contrive an increase in the degree of integration of a closed circuit by a method wherein a memory cell is provided with an inductance using a superconductive material, three-terminal type superconducting switching elements and the closed circuit constituted of a superconductive wiring material. CONSTITUTION:Three-terminal type superconducting switching elements 2, superconducting coils 1 and a closed circuit constituted of a superconductive material are used for a memory cell. That is, the elements 2 are turned-ON and a state that a circulating current is made to flow in the closed circuit brought into a superconductive state is assumed to be a storage state of 1 and a state that the current is not made to flow is assumed to be a storage state of 0. Accordingly, so long as an action is not given to the closed circuit from the exterior, this state is sustained semipermanently. Therefore, information is stored statically. Moreover, by controlling the circulating current by a minority of pieces of the elements 2 in the closed circuit, a writing and a readout can be performed. Thereby, the totaled occupation area of all the elements including the coils 1 can be reduced and the improvement of the integration degree of the closed circuit can be contrived.
    • 10. 发明专利
    • GATE TURN-OFF THYRISTOR
    • JPH10290001A
    • 1998-10-27
    • JP9554797
    • 1997-04-14
    • HITACHI LTD
    • MIZOGUCHI TETSUROKIMURA ARATAYAO TSUTOMU
    • H01L29/744H01L29/74
    • PROBLEM TO BE SOLVED: To suppress the increase in processing cost and to obtain a large capacitance element having large interruption strength by a method wherein the region where an N-emitter region, which comes in contact with a cathode electrode, is projected on anode surface, is prevented from overlapping on a P-emitter region which comes in contact with an anode electrode. SOLUTION: The ninth ring segment 49 has a P-emitter layer 11 overlapping on the region where an N-emitter layer 8 is projected on anode surface, and the region other than the tenth ring has the same structure as the ninth ring. On the other hand, in the tenth ring segment 410, an N layer 12 is provided instead of having no P-emitter layer on the region where the N-emitter layer 8 is projected on the anode surface. In this element, the P-emitter layer is not provided, and the tenth ring is not thyristor-operated. As a result, current concentration is not generated on the tenth ring even when the difference in pressure in the ring is large. As the difference in pressure is small in the ninth ring, the degree of current concentration becomes small, and an operation locus comes to a standstil in a safety region, and the element is not broken.