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1. 发明专利

JP2003141101A ANALYSIS INFORMATION MANAGEMENT SYSTEM 审中-公开
公开(公告)号：JP2003141101A
公开(公告)日：2003-05-16
申请号：JP2001340132
申请日：2001-11-06
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： KOBAYASHI HARUOMI , KOSHISHIBA HIROYA , FUKUDA KAZUYUKI , WAKABAYASHI AYAKO , OTSUKA KAZUE
IPC分类号： G01N33/48 , C12M1/00 , C12Q1/68 , G06F17/18 , G06F17/30
摘要： PROBLEM TO BE SOLVED: To provide an analysis information management system, capable of efficiently and easily managing an enormous amount of analysis information. SOLUTION: When an analysis sample is supplied 1, sample registration and contents are made anonymous by an anonymity means 2. A bar code input IF 10 is disposed in each step of the process 1 to N of an analysis flow, thereby inputting the identification information of the sample. According to the input identification information, SOP of the work process and the next process name are displayed to confirm the work procedure. After the analysis result is passed through a precision check means 14 and a quality determining part 15 on a server 3 by a data transfer part 13, non-defective is registered in a data base 11, and a re-reaction instruction 16 is issued for an NG article. The time-series characteristic change of the quality determination result registered in the data base is monitored by a device monitoring means 17. Thus, large-scale analysis information can be efficiently managed.

2. 发明专利

JPH11250253A METHOD AND DEVICE FOR INSPECTING DEFECT OF WIRING PATTERN, AND METHOD AND SYSTEM FOR CORRECTING DEFECT OF WIRDING PATTERN 失效
公开(公告)号：JPH11250253A
公开(公告)日：1999-09-17
申请号：JP4991198
申请日：1998-03-03
申请人： HITACHI LTD
发明人： KOSHISHIBA HIROYA , IRIE YOKO , OKUDA HIROTO , ISOBE MITSUNOBU , KOBAYASHI HARUOMI , DOI HIDEAKI , NINOMIYA TAKANORI
IPC分类号： H05K3/00 , G06T1/00 , G06T7/00 , H05K3/22
摘要： PROBLEM TO BE SOLVED: To improve the yield of a multilayer wiring board by providing a binary signal pattern by performing conversion to a binary image signal with a threshold value a little higher than the surface height of a wiring pattern, extracting a projecting defect existent on the surface of the wiring pattern based on this binary pattern signal and specifying the position of the defect. SOLUTION: Detected height image signals Zr (x, y) are converted into binarized image signals by binarizing circuits 51a and 51b. The threshold value of the binarizing circuit 51a is set a little higher than the surface of the wiring pattern so as to detect the inclined tower shaped projecting defect and sheet chips. Thus, the binary pattern signal of '1' showing the inclined tower shaped projecting defect and sheet chips protruded from the wiring pattern in height direction is extracted from the binarizing circuit 51a. Then, a defect position detecting circuit 52 finds a position coordinate (x, y) showing the centroid position or center position, for example, of the binary pattern signal of '1' showing the extracted defect and sends these data to a PC 42 for defect analysis.

3. 发明专利

JP2001124530A METHOD AND APPARATUS FOR DETECTING SOLID SHAPE AND METHOD AND APPARATUS FOR INSPECTION 失效
公开(公告)号：JP2001124530A
公开(公告)日：2001-05-11
申请号：JP30561499
申请日：1999-10-27
申请人： HITACHI LTD
发明人： KOSHISHIBA HIROYA , OKUDA HIROTO , HONDA TOSHIFUMI , ISOBE MITSUNOBU , YOSHIMURA KAZUSHI , KOBAYASHI HARUOMI
IPC分类号： G01B11/24 , G01B11/06 , G01B11/245
摘要： PROBLEM TO BE SOLVED: To inspect the solid shape of an object under inspection with high accuracy and at high speed. SOLUTION: A slit light illuminates an object 1 under inspection through an objective 15, a reflected light from the irradiated region is reflected by a perforated mirror 14 and branched by beam splitters 18a, 18b on three optical paths, after passing through an aperture restriction 16 and an image-forming lens 17. Line sensors 7a, 7b are provided for each branch optical path, the line sensor 7a is disposed in front of the focal plane, the line sensor 7b is disposed behind the focal plane, the line sensors 7a, 7b are positionally adjusted so that n-th detection pixels of the sensors 7a, 7b receive the image of n-th unit regions on the slit light irradiated region of the object 1, the defocus quantity of the images on the planes of the light sensors 7a, 7b differs, depending on the unit region height on the slit light irradiated region of the object 1 and cells of the light sensors 7a, 7b detect the light quantity, corresponding to the defocus quantity.

4. 发明专利

JP2000356512A VISUAL INSPECTION SYSTEM AND VISUAL INSPECTION METHOD 失效
公开(公告)号：JP2000356512A
公开(公告)日：2000-12-26
申请号：JP16715499
申请日：1999-06-14
申请人： HITACHI LTD
发明人： KOSHISHIBA HIROYA , DOI HIDEAKI , ISOBE MITSUNOBU , YOSHIMURA KAZUSHI , KOBAYASHI HARUOMI , SHISHIDO CHIE
IPC分类号： G01B11/24 , G01B11/245 , G01N21/88 , G01N21/94 , G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To reduce costs and shorten a development period by taking images by a line image sensor, and extracting defects by a software process at plurality of personal computers connected by a communication network. SOLUTION: The visual inspection system for inspecting patterns of electronic circuit boards or the like has a group of personal computers 18a-18n connected, e.g. by a local area network 17. For example, the optical image of an object 1 to be inspected by an optical system 4 which moves on an XY stage 3 is taken into a line image sensor 5 of, e.g. a multi-tap output delay integration type or the like and inputted as a digital image signal to a personal computer 6 for image input, or the like. The image data is appropriately selected and distributed from the personal computer 6 and sent to each of personal computers 18a-18n for image processing, where the predetermined process of extracting defects from the detected image data is carried out. A required capability for the processing can be easily changed by increasing, decreasing the number of personal computers or the like manner.

5. 发明专利

JP2000046748A METHOD AND APPARATUS FOR INSPECTING CONDUCTOR PATTERN AND PRODUCTION OF MULTILAYERED SUBSTRATE 失效
公开(公告)号：JP2000046748A
公开(公告)日：2000-02-18
申请号：JP21155998
申请日：1998-07-27
申请人： HITACHI LTD
发明人： KOSHISHIBA HIROYA , ISOBE MITSUNOBU , NOMOTO MINEO , KOBAYASHI HARUOMI , IRIE YOKO , OKUDA HIROTO , SENGOKU NORIO , MIO SHIGEMI
IPC分类号： G01B11/30 , G01N21/88 , G01N21/956 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a conductor pattern inspecting method and apparatus capable of performing inspection certainly at a high speed, and a method for producing a multilayered substrate. SOLUTION: A circuit board 51 to be inspected is illuminated by polarized illumination light having a wavelength of 300-550 nm, and the optical image based on reflected light blocking the polarizing component of the polarized illumination light from the illuminated circuit board to be inspected is detected by a detector to be converted to an optical image signal. The converted optical image signal is binarized on the basis of a predetermined threshold value to be converted to a binary image signal showing a conductor pattern, the positional shift quantity of the conductor pattern is calculated on the basis of the binary image signal showing the converted conductor pattern, and alignment is performed on the basis of the positional shift quantity of the conductor pattern to be compared to extract the defect of the conductor pattern.

6. 发明专利

JPH08235543A METHOD AND DEVICE FOR DETECTING DEFECT, SUCH AS STAIN 失效
公开(公告)号：JPH08235543A
公开(公告)日：1996-09-13
申请号：JP6527895
申请日：1995-03-01
申请人： HITACHI LTD
发明人： KAWAGUCHI HIROSHI , KOBAYASHI HARUOMI , HARA YASUHIKO , DOI HIDEAKI , MATSUDO RYUICHI , SASAKI TAMOTSU
IPC分类号： G11B5/455 , G11B5/84
摘要： PURPOSE: To detect the defects of a low contrast on a sample without receiving the influence of unequal lighting, etc., by determining differential values between the average of plural proximate pixels and a notice point from the television image signals formed by picking up the image of an object to be inspected and comparing these differential values and reference values. CONSTITUTION: A halogen lamp is used for an illuminating light source 37. Illuminating light turns back at a half mirror 38 via a condenser lens and illuminates the sample 34, for example, a magnetic head, on a stage 36 by Kohler's illumination. The reflected light from the sample 34 passes an objective lens 34 then the half mirror 38. This light is detected by a detector 42, for example, a TV camera. The respective focal lengths at the three points at which an arbitrary triangle shape is formable or the four points at which a rectangular shape is formable on the magnetic head are detected by a focus detector 33 when the sample 34 is mounted at a spring-like head arm as with the magnetic head. The magnetic head is leveled by moving a shifting stage toward θx and θy directions according to the deviation rates of the respective points to the focal positions. The deviation rates in the X, Y direction by the shifting are determined from the shifting rates and the distances between the focus detection positions of the sample and are corrected by moving the X-Y stage. Next, the detected image data are subjected to image processing by an image processing section 31.

7. 发明专利

JP2000028334A METHOD AND APPARATUS FOR INSPECTING PATTERN FAULT 失效
公开(公告)号：JP2000028334A
公开(公告)日：2000-01-28
申请号：JP20004298
申请日：1998-07-15
申请人： HITACHI LTD
发明人： KOBAYASHI HARUOMI , HARA YASUHIKO , DOI HIDEAKI , TAKAI KAZUO , KADOYA AKIYOSHI
IPC分类号： G01B11/24 , G01B11/30
摘要： PROBLEM TO BE SOLVED: To inspect a multilayer pattern with different inspecting references at respective layers by providing an illuminating means for illuminating an exciting light and a reference light on a pattern to be inspected formed on a printed circuit board. SOLUTION: An illuminating means illuminates an exciting light and a reference light (red light) on a pattern 1 (a resist pattern, a wiring pattern or a printing pattern) to be inspected formed on a printed circuit board. An image detecting means detects reflected images of a fluorescent image generated from a resist by illuminating the exciting light and the light by separating their wavelengths. The detected image is binarized by an image processing means, and separated and extracted into the resist pattern or the wiring pattern and the printing pattern by image processing. A fault deciding means inspects the separated layer patterns according to predetermined inspecting references. Thus, the fault can be stably and accurately inspected by cooperation of a feature amount comparing method and a length measuring method of a size or the like of the pattern.

8. 发明专利

JPH1140307A INSPECTION METHOD FOR PIN TERMINAL BEND AND ITS DEVICE, AND CORRECTING DEVICE FOR PIN TERMINAL BEND AND AUTOMATIC COMPONENT INSERTION SYSTEM 失效
公开(公告)号：JPH1140307A
公开(公告)日：1999-02-12
申请号：JP5832398
申请日：1998-03-10
申请人： HITACHI LTD
发明人： YOSHIDA ATSUSHI , HARA YASUHIKO , KOBAYASHI HARUOMI , NUMAZAWA TAKESHI , OGAWARA TOSHIYUKI , KIKUCHI MASAHIRO , KOJIMA HISASHI
IPC分类号： G01B11/24 , H01R43/00 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To detect a bend amount of each pin terminal with high accuracy by sensing the tip of each pin as an image in spite of the presence of surround ing obstacles. SOLUTION: When the bend amount of each pin terminal 1 is detected by sensing the pin terminal 1 as an image so as to be processed as an image, and the determination of whether each terminal 1 is acceptable or not is performed, even if a housing 10 is present as an obstacle around it, every pin 1 is detected as an image having low distortion and a wide visual field at the same time in the condition where at least one pin end is diagonally illuminated by slit-like illumination light from light sources 2, each having an optical axis different from that of the other.

9. 发明专利

JPH1114324A PATTERN DEFECT INSPECTION METHOD AND DEVICE THEREFOR 失效
公开(公告)号：JPH1114324A
公开(公告)日：1999-01-22
申请号：JP17145397
申请日：1997-06-27
申请人： HITACHI LTD
发明人： HARA YASUHIKO , KOBAYASHI HARUOMI , INOUE MITSUHIRO , SASADA MASATO
IPC分类号： G01B11/00 , G01B11/24 , G01N21/88 , G01N21/93 , G01N21/956 , G06T1/00 , G06T7/00
摘要： PROBLEM TO BE SOLVED: To provide an inspection method by which such an error is not judged as a defect even if there are deformation, strain of patterns and a positioning error between a standard pattern and an inspection object detecting pattern in a wiring board by applying a different inspection standard to patterns or respective layers in an inspection of a multilayer pattern on a multilayer wiring board to which a solder resist is applied. SOLUTION: Inspection object patterns are detected, and labeled with respective patterns mutually separated in the detected patterns, and a feature quantity of the labeled individual patterns is calculated, and a table relating this feature quantity to positions of the labeled patterns is made. Meanwhile, a pattern being a standard for these inspection object patterns is prepared, and a feature quantity of a standard pattern is also similarly calculated, and a table releated to coordinates is made. In a pattern inspection, feature quantities of nearby patterns equivalent to corresponding coordinates of the table are compared with each other, and feature quantites of the inspection object patterns and the standard pattern are compared with each other, and a defect is detected.

10. 发明专利

JPH08241127A METHOD AND DEVICE FOR POSITIONING SAMPLE TO BE INSPECTED 失效
公开(公告)号：JPH08241127A
公开(公告)日：1996-09-17
申请号：JP6528395
申请日：1995-03-01
申请人： HITACHI LTD
发明人： KOBAYASHI HARUOMI , KAWAGUCHI HIROSHI , HARA YASUHIKO , DOI HIDEAKI , MATSUDO RYUICHI , SASAKI TAMOTSU
IPC分类号： G01B11/00 , G01B11/30 , G01N21/88 , G01N21/956 , G05D3/12 , G11B5/455
摘要： PURPOSE: To provide the method and device for stably position the sample to be inspected with high precision through image processing as to an automatic inspecting and measuring instrument. CONSTITUTION: The automatic inspecting device inputs an image of the mounted sample to be inspected at its initial position, passes the image signal through a low-pass filter 1 for subtraction from an original image, and then passes the resulting signal through a nonlinear filter to separate an area to be inspected and a background image. On the basis of the separated inspection area image, a position shift from an image pickup visual field is detected and reflected on positioning. The method and device enable the stable, high-precision specification and positioning of an inspection area without being affected by variation of the background of an inspected sample and give large effect such as the actualization of automatic inspection.

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