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1. 发明专利

JPH11344319A PATTERN INSPECTION DEVICE, METHOD AND SYSTEM 失效
公开(公告)号：JPH11344319A
公开(公告)日：1999-12-14
申请号：JP15309798
申请日：1998-06-02
申请人： HITACHI LTD
发明人： OKUDA HIROTO , KOSHISHIBA HIROYA , ISOBE MITSUNOBU , KOBAYASHI IRARIOHARUOMI , IRIE YOKO , NINOMIYA TAKANORI , DOI HIDEAKI
IPC分类号： G01B11/24 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To inspect with a simple device constitution even if the sizes of defects in a pattern differ at every location and data quantity of reference images becomes enormous. SOLUTION: A reference binary image S having no defect in an inspecting binary image D and a binary image M for judging defect which a minimum tolerance pattern binary image set at the lower limit value is taken off from a maximum tolerance pattern binary image set at the upper limit value which the dimension at each part of the pattern is tolerable are prepared in advance. The minimum tolerance pattern binary image Ms is formed by making AND 1 with the reference binary image and reversed binary image M for judging defect and the maximum tolerance pattern binary image ML is formed by making OR with the reference binary image and the reversed binary image M for judging defect. Recess defects binary information RS are obtained by making AND 2 with the minimum tolerance pattern binary image MS and the reversed inspected image D. Dent defects binary information RL are obtained by making AND 3 with the reversed maximum tolerance pattern binary image ML and the inspected image D.

2. 发明专利

JPH11211423A MEASUREMENT OF SUBSTRATE 失效
公开(公告)号：JPH11211423A
公开(公告)日：1999-08-06
申请号：JP1956398
申请日：1998-01-30
申请人： HITACHI LTD
发明人： IRIE YOKO , KOSHISHIBA HIROYA
IPC分类号： G01B11/06 , H01L21/027 , H05K3/00 , H05K3/06 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To nondestructively measure the thickness of a transparent or translucent object layer such as a resist film formed on a substrate with high precision. SOLUTION: A printed board 1 having a transparent resist film 3 formed on a base material 2 is placed on a Z-stage 4, and an illuminating light L is irradiated thereto from the resist film 3 side. The height of the Z-stage 4 is set so that the focal position S of the illuminating light L is situated within the base material 2, and the Z-stage 4 is sequentially lowered from this position by a pitch Δz. Therefore, the focal position S of the illuminating light L is sequentially raised at the pitch Δz to the printed board 1. The illuminating light L from the printed board 1 is received by a CCD camera 10 every pitch Δz height position of the Z-stage 4, the visibility of image is detected every resulting image data, two height positions of the Z-stage 4 where the visibility is maximum are found from this distribution of visibility, and the thickness of the resist film 3 is found from these height positions.

3. 发明专利

JPH1019807A X-RAY IMAGE PICK UP METHOD 失效
公开(公告)号：JPH1019807A
公开(公告)日：1998-01-23
申请号：JP17329496
申请日：1996-07-03
申请人： HITACHI LTD
发明人： IRIE YOKO , DOI HIDEAKI , HARA YASUHIKO , IIDA TADASHI , FUJISHITA YASUHIRO
IPC分类号： G01N23/04 , G01N29/06 , H01L21/3205 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for testing wiring patterns and its device, capable of testing solid shape defects including internal defects of wiring patterns in a wiring circuit board and of obtaining data on which face the detected defects exist in the board. SOLUTION: Between an X-ray source 2 and a printed board 3 being a test object, a visual light image obtained from reflected lights of a mirror 35 inclined at 45 deg. is imaged by a CCD camera 36. On the other hand, the X rays 2 transmit the mirror 35 and are emitted on the printed board 3 being a test object, and the transmitted image is converted into a visual light image by an image intensifier to be imaged by another CCD camera.

4. 发明专利

JP2000046748A METHOD AND APPARATUS FOR INSPECTING CONDUCTOR PATTERN AND PRODUCTION OF MULTILAYERED SUBSTRATE 失效
公开(公告)号：JP2000046748A
公开(公告)日：2000-02-18
申请号：JP21155998
申请日：1998-07-27
申请人： HITACHI LTD
发明人： KOSHISHIBA HIROYA , ISOBE MITSUNOBU , NOMOTO MINEO , KOBAYASHI HARUOMI , IRIE YOKO , OKUDA HIROTO , SENGOKU NORIO , MIO SHIGEMI
IPC分类号： G01B11/30 , G01N21/88 , G01N21/956 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a conductor pattern inspecting method and apparatus capable of performing inspection certainly at a high speed, and a method for producing a multilayered substrate. SOLUTION: A circuit board 51 to be inspected is illuminated by polarized illumination light having a wavelength of 300-550 nm, and the optical image based on reflected light blocking the polarizing component of the polarized illumination light from the illuminated circuit board to be inspected is detected by a detector to be converted to an optical image signal. The converted optical image signal is binarized on the basis of a predetermined threshold value to be converted to a binary image signal showing a conductor pattern, the positional shift quantity of the conductor pattern is calculated on the basis of the binary image signal showing the converted conductor pattern, and alignment is performed on the basis of the positional shift quantity of the conductor pattern to be compared to extract the defect of the conductor pattern.

5. 发明专利

JPH10267628A METHOD AND APPARATUS FOR DETECTION OF THREE-DIMENSIONAL SHAPE AS WELL AS MANUFACTURE OF BOARD 失效
公开(公告)号：JPH10267628A
公开(公告)日：1998-10-09
申请号：JP13834197
申请日：1997-05-28
申请人： HITACHI LTD
发明人： IRIE YOKO , KOSHISHIBA HIROYA , DOI HIDEAKI , NOMOTO MINEO
IPC分类号： G01B11/24 , G06T1/00 , G06T7/00 , H05K3/00 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To realize a three-dimensional inspection by the high-accuracy detection of a three- dimensional shape even by a sort-time inspection by a method wherein the three-dimensional shape is detected, a region which is required for the detection of the three-dimensional shape is cut off and the three-dimensional inspection is performed to a cut-off region with desired two-dimensional resolution and with desired height resolution. SOLUTION: Reflected light 22 from a printed-circuit board 11 is transmitted through a dichroic mirror 12, and its is condensed in a focus 23 via a lens 13 so as to be detected by a sensor 15a. The sensor 15a is moved to the up-sand-down direction 24 by a movement mechanism 32, and a detection signal 34 is input to a computer 31. A CPU 35 detects the position of the focus 23 in which a quantity of detection light becomes maximum and which is detected on the basis of a displacement-amount detection means 33, and it finds the height of the three-dimensional shape of an object to be detected so as to be stored on a memory 37. The CPU 35 obtained information on the two-dimensional shape of a wiring pattern 9 on the basis of a two-dimensional fluorescent image signal 50, by a fluorescence detecting system, which is input from a CCD sensor 19, and it stores the information on the memory 37. The CPU 35 detects a three-dimensional shape composed of the two-dimensional shape and the height which are required for the wiring pattern 9.

6. 发明专利

JPH11250253A METHOD AND DEVICE FOR INSPECTING DEFECT OF WIRING PATTERN, AND METHOD AND SYSTEM FOR CORRECTING DEFECT OF WIRDING PATTERN 失效
公开(公告)号：JPH11250253A
公开(公告)日：1999-09-17
申请号：JP4991198
申请日：1998-03-03
申请人： HITACHI LTD
发明人： KOSHISHIBA HIROYA , IRIE YOKO , OKUDA HIROTO , ISOBE MITSUNOBU , KOBAYASHI HARUOMI , DOI HIDEAKI , NINOMIYA TAKANORI
IPC分类号： H05K3/00 , G06T1/00 , G06T7/00 , H05K3/22
摘要： PROBLEM TO BE SOLVED: To improve the yield of a multilayer wiring board by providing a binary signal pattern by performing conversion to a binary image signal with a threshold value a little higher than the surface height of a wiring pattern, extracting a projecting defect existent on the surface of the wiring pattern based on this binary pattern signal and specifying the position of the defect. SOLUTION: Detected height image signals Zr (x, y) are converted into binarized image signals by binarizing circuits 51a and 51b. The threshold value of the binarizing circuit 51a is set a little higher than the surface of the wiring pattern so as to detect the inclined tower shaped projecting defect and sheet chips. Thus, the binary pattern signal of '1' showing the inclined tower shaped projecting defect and sheet chips protruded from the wiring pattern in height direction is extracted from the binarizing circuit 51a. Then, a defect position detecting circuit 52 finds a position coordinate (x, y) showing the centroid position or center position, for example, of the binary pattern signal of '1' showing the extracted defect and sends these data to a PC 42 for defect analysis.

7. 发明专利

JPH11132748A MULTI-FOCAL POINT CONCURRENT DETECTING DEVICE, STEREOSCOPIC SHAPE DETECTING DEVICE, EXTERNAL APPEARANCE INSPECTING DEVICE, AND ITS METHOD 失效
公开(公告)号：JPH11132748A
公开(公告)日：1999-05-21
申请号：JP29269197
申请日：1997-10-24
申请人： HITACHI LTD
发明人： KOSHISHIBA HIROYA , IRIE YOKO
IPC分类号： G01B11/30
摘要： PROBLEM TO BE SOLVED: To make detectable multiple images with different focal positions at a high speed without vertically moving an object or an optical system by changing the focal positions of detection picture elements of a linear image sensors continuously or in steps. SOLUTION: The optical image of an object 1 on an X-Y stage 2 is formed on a linear image sensor 4 via a step-like glass sheet 5 and a lens 3. The detection visual field is N×p and the detection visual field at the same focal position is N×p/k, where N is the number of total picture elements of the linear image sensor 4, (p) is the size of detection picture elements, and (k) is the number of steps of the glass sheet 5. When images are detected while moving at the constant speed in the X direction on the X-Y stage 2, (k) images of picture elements having different focal positions and the width N/k can be detected. Images are detected while moving at the constant speed in the X direction after moving by N×p/k in the Y direction. When these actions are repeated, (k) images with different focal positions are obtained on the whole face, thus the detecting speed can be improved.

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