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    • 2. 发明专利
    • Electroforming method
    • 电化学方法
    • JPS5953691A
    • 1984-03-28
    • JP16385082
    • 1982-09-22
    • Hitachi Ltd
    • OKUDAIRA HIROAKIKOBAYASHI TOSHIOFUKAGAWA TAKEOOKA HITOSHI
    • C25D1/00C25D1/10
    • PURPOSE: To decrease the stress over the entire part of an electroforming film and to transfer the reversal shape of a matrix exactly to the electroforming film in the stage of forming the electroforming on the matrix, by forming alternately the electroforming film having a compressive stress value and the electroforming film having a tensile stress value.
      CONSTITUTION: A current density resulting compressive electrodeposition stress and a current density resulting tensile electrodeposition stress are alternately applied and an electroforming film having a compressive stress value and an electroforming film having a tensile stress value are alternately formed on a matrix of a prescribed shape by electroforming. It is preferred that the total sum of the product of the product of the tensile stress value and the thickness of the electroforming film having tensile stress and the total sum of the product of the compressive stress value and the thickness of the electroforming film having compressive stress are equal but about within 10kg/mm
      2 difference between both may be permitted practically.
      COPYRIGHT: (C)1984,JPO&Japio
    • 目的:为了在电铸薄膜的整个部分上减小应力,并在基体上形成电铸阶段将矩阵的反转形状精确地转移到电铸薄膜上,通过交替地形成具有压缩应力值的电铸薄膜 电铸薄膜具有拉伸应力值。 构成:交替施加导致压电电沉积应力的电流密度和导致拉伸电沉积应力的电流密度,并且具有压应力值的电铸膜和具有拉伸应力值的电铸膜通过电铸交替形成在规定形状的基体上 。 优选拉伸应力值的乘积与具有拉伸应力的电铸膜的厚度的乘积与压缩应力值的乘积与具有压应力的电铸膜的厚度的总和的总和 相等但约在10kg / mm以内。实际上可能允许两者之间的差异。
    • 7. 发明专利
    • Stamper and its production
    • 冲压及其生产
    • JPS58185049A
    • 1983-10-28
    • JP6637582
    • 1982-04-22
    • Hitachi Ltd
    • OKUDAIRA HIROAKIFUKAGAWA TAKEOKOBAYASHI TOSHIOGOUHARA YOSHIO
    • G11B7/26B29C33/00B29C61/00B29D17/00G11B3/70G11B9/06G11B23/00
    • G11B23/0057
    • PURPOSE:To eliminate the separation of a metallic layer from a substrate, by forming a metallic layer having high coupling force with an adhesive on a metallic film to which a recording track pattern is formed and then adhering the metallic layer to the substrate. CONSTITUTION:A metallic film 1 uses nickel, and a metallic layer 8 has high coupling force with nickel and high affinity to an adhesive 4. The film 1 is adhered to a substrate 3 with the adhesive 4 and via the layer 8. Copper is suited to the layer 8. It is effective to use zinc, tin, iron, brass, etc. in place of copper in terms of easiness of plating. Furthermore, a metallic oxide film is formed on the layer 8 to increase the coupling force.
    • 目的:为了消除金属层与基板的分离,通过在形成有记录轨迹图案的金属膜上形成具有高粘合力的金属层与粘合剂,然后将金属层粘合到基底上。 构成:金属膜1使用镍,金属层8与镍具有高的耦合力并且对粘合剂4具有高亲和力。膜1通过粘合剂4并通过层8粘合到基底3上。铜适合 在镀层的容易性方面,使用锌,锡,铁,黄铜等代替铜是有效的。 此外,在层8上形成金属氧化物膜以增加耦合力。
    • 9. 发明专利
    • CHEMICAL NICKEL PLATING LIQUID AND METHOD OF USING SAID LIQUID
    • JPH01201484A
    • 1989-08-14
    • JP15231088
    • 1988-06-22
    • HITACHI LTD
    • NAKAGAWA YOSHIOOKA HITOSHIFUJISAWA MASAKOFUKAGAWA TAKEOGOHARA YOSHIO
    • C23C18/18C23C18/31C23C18/36
    • PURPOSE:To obtain a stable chemical plating liquid which can form a specific excellent plating film by dissolving hypophosphorous acid or the salt thereof as a reducing agent into an aq. nickel salt soln. and further combining and selecting complexing agents and adding the same thereto to prevent precipitation. CONSTITUTION:The hypophosphorous acid or the salt thereof is dissolved at 0.10-0.45mol./l as the reducing agent into the aq. nickel salt soln. contg. 0.09-0.20mol./l Ni and the complexing agents are so combined and selected as to prevent generation of the precipitation of nickel hypophosphite and nickel hydroxide equilibriously in the entire regions of the pH at the time of plating and the pH of an alkaline replenishing liquid, then said complexing agents are added to the soln. The complexing agents consist of 0.18-0.75mol./l malic acid, 0.14-0.50mol./l glycine, 0.09-0.30mol./l gluconic acid or ammonium and the pH of the aq. soln. is preferably adjusted to 4.0-7.0. The anionic surfactant of 1-200mg/l is preferably added further to this aq. soln. to obtain the stable chemical plating liquid. A nonmagnetic substrate consisting of an Al alloy, etc. is immersed in this plating liquid, by which the plating film having excellent heat resistant nonmagnetic characteristics is obtd. at a high plating speed.