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1. 发明专利

JPH0468777B2 失效
公开(公告)号：JPH0468777B2
公开(公告)日：1992-11-04
申请号：JP8475887
申请日：1987-04-08
申请人： HITACHI LTD
发明人： OONUKI HITOSHI , KOIZUMI MASAHIRO , SUZUKI HITOSHI , ARAKI ISAO , OKIKAWA SUSUMU
IPC分类号： H01L21/60
摘要： PURPOSE:To make it possible to bond a Cu ball to a reliable IC or LSI by a method wherein the copper ball is deformed in such a way that one of crystal grains on the peripheral part of the copper ball right over the interface of a joint part makes an angle of 30 degrees or less with a semiconductor integrated circuit chip and is bonded to the IC or LSI. CONSTITUTION:In the joint part between a Cu ball and an Al electrode on an Si chip, the Cu ball is deformed in such a way that at least one of crystal grains 2 on the peripheral part of the Cu ball 1 right over the interface of the joint part makes an angle theta of 30 degrees or less with the Si chip and is bonded. After the texture of the Cu ball on the bonding interface of the Cu ball is polished in parallel to the chip, the crystal grains are contrived in such a way that their average crystal grain diameter becomes 15 mum or less. In such a way, when the ball is formed by short-circuit discharge using a Cu wire of a high purity of 99.999 % or more in the mixed inert gas of Ar and H2 gases, the rate of solidification is controlled. Thereby, the texture is controlled and the ball is softened to prevent a failure of bonding.

2. 发明专利

JPH0282541A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0282541A
公开(公告)日：1990-03-23
申请号：JP23421888
申请日：1988-09-19
申请人： HITACHI LTD
发明人： HATORI KAZUO , ARAKI ISAO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To enable bonding of wire material with good bondability to an inner section of a lead consisting of copper material even at a low temperature which can avoid fusion of a solder coating by using an aluminum material as a material to form a wire. CONSTITUTION:A silicon semiconductor pellet 12, a plurality of leads 9 arranged around the pellet, a wire 13 whose both ends are bonded to each bonding and 12a of the pellet and an inner section 9a of each lead 9 for bridging, and a package 14 for resin sealing are provided. A group of leads 9 are formed by using a copper material and a wire 13 is formed by using an aluminum material. One end of the wire is bonded to an electrode of the pellet through ball bonding. The other end is bonded to a base material surface which consists of copper material in an inner section of each lead.

3. 发明专利

JPH01280326A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01280326A
公开(公告)日：1989-11-10
申请号：JP11009188
申请日：1988-05-06
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： ARAI KATSUO , ARAKI ISAO , FURUI TAKAFUMI , SATO HITOHISA
IPC分类号： H01L21/60 , H01L23/28
摘要： PURPOSE:To eliminate a pellet bonding process as well as to avoid shortcircuit defects caused by contacts of wires with one another, by using insulating coating covered wires and by holding a semiconductor pellet inside a package by the wires. CONSTITUTION:A semiconductor device 70 is provided with a semiconductor pellet 8, a plural number of leads 7 arranged around the semiconductor pellet 8, bridged wires 9 with both ends bonded to electrodes 8a of the semiconductor pellet 8 and each lead 7 and a package 10 for plastic seal of the semiconductor pellet 8, a part of the leads 7 and the wires 9. In this device, the wires 9 should be coated with insulating coating 9b and the pellet 8 should be held inside the package 10 by the coated wires 9. For example, the coated wires 9a are formed so as to have a rigidity to resist the resin flow at the time of formation of the plastic seal package 10. And, the insulating coating 9b is made of resin having insulation.

4. 发明专利

JPH01100950A CERAMIC-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01100950A
公开(公告)日：1989-04-19
申请号：JP25711287
申请日：1987-10-14
申请人： HITACHI LTD
发明人： ARAKI ISAO
IPC分类号： H01L23/04 , H01L23/08 , H01L23/50
摘要： PURPOSE:To improve positional and dimensional accuracy of leads in a pad-lead- type ceramic package, by arranging leads in a groove provided on the side faces of the package and serving as a lead guide. CONSTITUTION:A lead guide groove 7 is provided on the side faces of a ceramic cap 6. During a lead formation process for bending leads to make a right angle, the lead guide groove 7 effectively prevent positional deviation or dimensional defects of the leads. If the guide groove is formed deep enough so that the leads are buried in the guide groove of the ceramic during the lead bending process, a pad-lead-type ceramic package can be obtained without causing stress to concentrate in the sealing glass to make cracks therein.

5. 发明专利

JPS63293929A WIRE BONDING EQUIPMENT 失效
公开(公告)号：JPS63293929A
公开(公告)日：1988-11-30
申请号：JP12824587
申请日：1987-05-27
申请人： HITACHI LTD
发明人： NAKAJIMA MAKOTO , CHUMA TOSHIO , OHASHI YOSHIO , HATORI KAZUO , ARAKI ISAO , KOIZUMI MASAHIRO , ONUKI HITOSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To obtain excellent bondability and safety of working, by supplying a mixed gas containing less than 4% hydrogen, around an object to be processed. CONSTITUTION:During a process of bonding, a reducing gas 22 to protect a lead frame from oxidizing is always gushed out from a spurting vent 24 arranged on the upper surface of a feeder 6. As the reducing gas atmosphere is closed by a cover 27 arranged on the feeder 6, the reducing gas 22 effectively surrounds a lead frame 3 and a pellet 2, and the oxidation of the lead frame 3 and the like are surely prevented. The gas 22 to protect a lead frame from oxidizing is so controlled that the content of hydrogen is less than 4%, and therefore, hydrogen in the gas 22 is prevented from burning. Consequently, the bondability is stably maintained. Further, the content of hydrogen contained in a ball forming gas may be less than 3%.

6. 发明专利

JPS63199436A ELECTRONIC DEVICE 失效
公开(公告)号：JPS63199436A
公开(公告)日：1988-08-17
申请号：JP3145487
申请日：1987-02-16
申请人： HITACHI LTD
发明人： TSURUMARU KAZUHIRO , ARAKI ISAO , HATORI KAZUO
IPC分类号： H01L21/60
摘要： PURPOSE:To improve bondability and the reliability of a bonding connecting section even when a copper wire is used by forming the surface of at least a bonding pad in an electrical wiring for a pellet by employing the same material as the copper group bonding wire. CONSTITUTION:The surface of at least a bonding pad 16 in an electrical wiring 10 for a pellet 8 is shaped by a copper group material, and a wire 17 consisting of the copper group material is bonded onto the surface of the bonding pad 16. The electrical wiring 10 with a lower layer wiring 11 and an upper layer wiring 13 is formed to the upper layer section of the pellet 8, into which an integrated circuit 9 is assembled, through an under-cloth wiring method through an inter-layer insulating film 13, and the wiring 10 is shaped through an evaporation method, etc. by employing the copper group material wholly. One ends of the bonding wires 17 composed of the copper group material are each bonded onto the bonding pad 16 made up of the copper group material in the pellet 8, and the other ends of the wires 17 are each bonded onto a section 5a to be bonded for an inner lead 5.

7. 发明专利

JPS62128159A HIGH INTEGRATION LSI PLASTIC PACKAGE 失效
公开(公告)号：JPS62128159A
公开(公告)日：1987-06-10
申请号：JP26712685
申请日：1985-11-29
申请人： HITACHI LTD
发明人： SASAKI SHIGERU , KANEDA AIZO , NISHI KUNIHIKO , NAKAMURA ATSUSHI , ARAKI ISAO
IPC分类号： H01L23/29 , H01L23/31 , H01L23/30
摘要： PURPOSE:To reduce the damage generating on the IC element such as passivation cracks, interlayer dielectric breakdown and the like while the moldability such as burrs and the like is not sacrificed by a method wherein fillers having grain diameter of 80mum or more which are liable to damage the surface of IC chips are removed, the fillers having the grain diameter of 30-80mum are brought into a globular form, and then 10% or more of the fillers having the grain diameter of 10mum or less are contained therein. CONSTITUTION:The fillers of sealing resin are composed of the grains having the diameter of 80mum or less. Among these fillers, the grains having the diameter of 30mum or more are brought into granular form by performing a treatment. Besides, 10% or more of the total quantity of the fillers having the grain diameter of 10mum or less are contained therein. When the relation between the grain diameter and the shape of the fillers and the compressive force given to IC elements by the fillers is investigated by performing a stress analysis, the compressive stress comes down below the insulating film strength of chips even when the angle of the IC chip part of the fillers comes close to 180 deg., namely, the fillers approximate to globular shape, in the case where grain diameter is 80mum or above. On the other hand, when the grain diameter becomes small to 30mum or thereabout, the value of the compressive stress becomes less than the strength of the insulating film, thereby causing no trouble.

8. 发明专利

JPS60128631A ADHESIVE TAPE 失效
公开(公告)号：JPS60128631A
公开(公告)日：1985-07-09
申请号：JP23614783
申请日：1983-12-16
申请人： HITACHI LTD
发明人： ARAKI ISAO , ARAI SHIGERU , HAYASHI SHIYOUJI , GOUMA TAKESHI , TAKANAMI TAIJI
IPC分类号： H01L21/67 , H01L21/52 , H01L21/58
摘要： PURPOSE:To enable to easily and completely identify the presence or not of the residual of an adhesive tape and an adhesive material after the adhesive tape has been exfoliated by a method wherein the adhesive material which is used to stick the adhesive tape to a base material tape is colored in such a manner that the adhesive tape and the base material tape can be identified easily. CONSTITUTION:An adhesive material 8 consists of acryl resin, for example, a crosslinking agent consists of isocyanate resin, and a colorant consists of blue- color pigment with which a base material tape 2 can be identified easily. An adhesive tape 3 is adhered to the back side of the base material tape 2 through the intermediary of the adhesive material 8. At this time, the adhesive tape 3 is formed in the width narrower than that of the base material tape 2, and it is adhered is such a manner that a through hole 1 is closed up, but a hole 7 is not closed up. As a result, the through hole 1 is closed up by the adhesive tape 3 whereon the adhesive material 8 is exposed at the lower part of the through hole 1, and a storing hole 5 is formed. Accordingly, a chip 4 is supplied to and placed in the storing hole 5, and it is adhered and retained by the adhesive material 8 on the bottom of the storing hole.

9. 发明专利

JPS5936842B2 JPS5936842B2 - 失效
公开(公告)号：JPS5936842B2
公开(公告)日：1984-09-06
申请号：JP8425677
申请日：1977-07-15
申请人： Hitachi Ltd
发明人： WAKASHIMA YOSHIAKI , ARAKI ISAO
IPC分类号： B29C45/00 , B29B13/00 , B29C33/00 , B29C33/38 , B29C33/44 , B29C43/00 , B29C45/02 , B29C45/26 , H01L21/56

10. 发明专利

JPH04107941A WIRE-BONDING APPARATUS 失效
公开(公告)号：JPH04107941A
公开(公告)日：1992-04-09
申请号：JP22505990
申请日：1990-08-29
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： SATO HITOHISA , ARAKI ISAO
IPC分类号： H01L21/603 , H01L21/60
摘要： PURPOSE:To avoid the fusion of a solder film on the outer part of a lead frame by constituting the lead frame so that the outer part is relatively cooled with respect to the inner part of the lead frame. CONSTITUTION:Heating of a lead 9 by a heat block 22 is set to a temperature, where a satisfactory bondability can be ensured, so that the intermediate part of a wire material 38 is connected onto the inner part 9b of the material with a sufficient bonding strength. On the other hand, because the outer part 9b of a lead frame 9 is provided via an escape recess 48 and heat insulator layer 49, it is thermally separated from the heat block 22 and its temperature is lower than that of the inner part 9a of the lead frame 9. Further, a low- temperature reducing gas 53 blown from a blow-off port 50 is blown against the outer part 9b of the lead frame 9 so that the outer part of the lead frame 9 is cooled forcibly.

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