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    • 1. 发明专利
    • CONNECTION MEMBER
    • JPH08148210A
    • 1996-06-07
    • JP29027394
    • 1994-11-25
    • HITACHI CHEMICAL CO LTD
    • TSUKAGOSHI ISAOHIROZAWA YUKIHISAKOBAYASHI KOJINAKAJIMA ATSUOMATSUOKA HIROSHI
    • H01R11/01
    • PURPOSE: To provide a material capable of providing high resolution and excellent connection reliability by forming an adhesive layer containing insulation particles each smaller than an electrically conductive material in one surface of an adhesive layer constituted of the electrically conductive material and a binder having electric conductivity in a pressurizing direction. CONSTITUTION: An adhesive layer 2 containing insulation particles 5 smaller than an electrically conductive material is formed in at least one surface of an adhesive layer 1 constituted of an electrically conductive material 3 and a binder having electrical conductivity in a pressurizing direction. The particle diameter of the insulated particle 5 is smaller than that of a material 3. The material 3 is provided with electric conductivity by pressurizing or pressurizing the binder by heat so as to reduce the thickness thereof. Thus, a gap with a connected electrode can be adjusted keeping good insulation with an adjacent electrode 12 and a material can be provided, allowing easy electrode connection and providing excellent connection reliability.
    • 3. 发明专利
    • MANUFACTURE OF MULTI-LAYER CONNECTING MEMBER
    • JPH07245165A
    • 1995-09-19
    • JP3689794
    • 1994-03-08
    • HITACHI CHEMICAL CO LTD
    • ITO TATSUOKOBAYASHI KOJINAKAJIMA ATSUOMATSUOKA HIROSHI
    • H01R43/00H05K3/32
    • PURPOSE:To establish a manufacturing method for a multi-layer connecting member which suits connection of a micro-circuit by using a solvent, in which the adhesive in the under-layer is not dissolved easily, to prepare the varnish constituting the adhesive in the over-layer when a multi-layer adhesive layer is formed, or using a material not easily soluble in the solvent of the over-layer to prepare the adhesive for the under-layer. CONSTITUTION:When a multi-layer adhesive layer is to be formed, a solvent in which at least the adhesive in the under-layer is not easily dissolved, is used to prepare a varnish constituting the adhesive for the over-layer-otherwise, a material not easily soluble in the solvent for the over-layer is used to prepare the adhesive for the under- layer. For the under-layer, concretely, a material which is soluble in methyl-ethyl ketone, acetone, ethyl acetate, etc., and not soluble in toluene, alcohol, n-hexane, etc., is used as adhesive, for example highpolymer rubber or highpolymer epoxy-for the over-layer, adhesive is used such as rubber of relatively low molecular weight, epoxy of middle molecular weight, etc., which is soluble in toluene, alcohol, n-hexane, etc. The intended multi-layer connecting member is fabricated by applying adhesive varnish one coat over another upon a base film followed by a drying process so that an adhesive layer of two or more plies is formed, wherein conductive particles should exist at least in one of the layers.
    • 4. 发明专利
    • ANISOTROPICALLY CONDUCTIVE AND ADHESIVE FILM
    • JPH07140480A
    • 1995-06-02
    • JP31284693
    • 1993-11-19
    • HITACHI CHEMICAL CO LTD
    • HIROZAWA YUKIHISAMATSUOKA HIROSHIKOBAYASHI KOJI
    • G02F1/1345H05K3/32
    • PURPOSE:To enhance a resolving power and to improve reliability of connection by uniformly dispersing conductive particulates formed by coating the surfaces of spherical polymer particulates having rugged shapes on surfaces with a metal and specifying the average grain size thereof to a specific range into an insulating adhesive. CONSTITUTION:The conductive particulates 5 having an average grain size of 2 to 20mum formed by coating the spherical polymer particulates having the rugged shapes on the surfaces with the metal are used for the anisotropically conductive and adhesive film formed by uniformly dispersing the conductive particulates 5 into the insulating adhesive 6. The rugged shapes on the surfaces of the particles are preferably such that the specific surface area of these spherical particles is about 1.3 to 5 times the truly spherical particles having the same average grain size. The film of 0.05 to 0.5mum of nickel, etc., is formed by an electroless plating method on such spherical polymer particles. The conductive particulates 5 formed in such a manner are added at 0.1 to 15 pts.wt. to 100 pts.wt. insulating adhesive. As a result, the reliability of connection to counter electrodes 2, 4 per 1 piece of the conductive particulate is enhanced and the anisotropically conductive and adhesive film having high fineness is obtd.
    • 6. 发明专利
    • ELECTROPHORECTIC DISPLAY DEVICE
    • JPH0535188A
    • 1993-02-12
    • JP19150991
    • 1991-07-31
    • HITACHI CHEMICAL CO LTD
    • MATSUZAWA JUNMATSUOKA HIROSHIUCHIDA TAKESHISUZUKI KAZUKOYAMAGUCHI MASANORI
    • G09F9/37
    • PURPOSE:To provide the electrophoretic display device which can maintain display quality excellent over a long period of time. CONSTITUTION:A transparent substrate 1 is a glass plate and a transparent conductive film 2 is formed over the entire surface thereof. A polyethylene terephthalate film having 100mum thickness is used as a rear substrate 4 and is disposed to face the transparent substrate 1 by adhering and fixing via a spacer 3, by which a space is formed. A film-like migrating body 5 contg. fine particles and liquid varying in color from the color of the fine particles are packed in this space and thereafter, the space is hermetically sealed by an adhesive 6, by which the electrophoretic display device is constituted. The film formed of a dispersion prepd. by dispersing the fine particles treated with a coupling agent having a vinyl group into a vinyl compd. having a vinyl group at its terminal or the film formed from a dispersion prepd. by dispersing the fine particles treated with a coupling agent having an amino group or glycidy group into an epoxy resin is used as the film-like migrating body 5 contg. the fine particles.