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1. 发明专利

JPS63121692A METHOD FOR ACTIVATING BASE MATERIAL OF IC LEAD FRAME 失效
公开(公告)号：JPS63121692A
公开(公告)日：1988-05-25
申请号：JP26704086
申请日：1986-11-10
申请人： HITACHI CABLE
发明人： AOKI KATSUHIRO
IPC分类号： C25D5/36 , H01L21/48
摘要： PURPOSE:To activate the surface of a base material of an IC lead frame consisting of a 42 alloy material by subjecting said base material to a cathodic electrolysis treatment in an aq. soln. contg. potassium cyanide, etc. CONSTITUTION:The 42 alloy material (for example, Fe-42% Ni alloy) is cut to the shape of the IC lead frame and is degreased by cathodically electrolyzing said material in about 50g/l aq. soln. of caustic soda, etc. The material is then chemically polished by immersing the same into an acid soln. such as hydrogen peroxide soln.; thereafter, the material is neutralized with an alkali by immersing the same with about 1% aq. soln. of an alkali such as caustic potash. The pretreated base material is subjected to the cathodic electrolysis treatment for about 1-300sec at about 1-30 deg.C and about 0.1-10A/dm current density in the aq. soln. contg. about 1.0-300g/l at least one of the potassium cyanide, caustic potash, sodium EDTA and sodium gluconate in the above-mentioned manner. The IC lead frame having high cleanliness is thus produced without polluting the working environment.

2. 发明专利

JPS62277755A MANUFACTURE OF LEAD FRAME 失效
公开(公告)号：JPS62277755A
公开(公告)日：1987-12-02
申请号：JP12074886
申请日：1986-05-26
申请人： HITACHI CABLE
发明人： CHINDA SATOSHI , YOSHIOKA OSAMU , YAMAGISHI RYOZO , OKABE NORIO , AOKI KATSUHIRO
IPC分类号： H01L23/50 , H01L21/48
摘要： PURPOSE:To prevent the generation of defects, such as the stains, discoloration, etc. of a plating surface or the discoloration (unevenness of baking) of a lead frame blank due to heating by executing noble-metal plating and washing a lead frame by a washing by the aqueous solution of a weak acid. CONSTITUTION:Noble-metal plating is executed, and a lead frame is washed by a washing by the aqueous solution of a weak acid. That is, alkaline dust, mists, etc., causing the stains and discoloration of a plating surface and discoloration in case of the heating of a lead frame blank are neutralized by the action of the weak acid and removed, and the whole lead frame is etched extremely slightly, and impurities such as plating-liquid residue are removed. A substance containing one kind or two kinds or more of tartaric acid, citric acid, succinic acid, maleic acid, malic acid, oxalic acid, formic acid, acetic acid, propionic acid, lactic acid, boric acid and potassium hydrogen phthalate is preferable as the weak acid in the washing. It is desirable that the pH of the washing is kept within a range of 2-5. 40-50 deg.C are preferable as the temperature of the washing on washing.

3. 发明专利

JPS61133390A Stripping method of plated gold 失效
标题翻译：镀金的剥离方法
公开(公告)号：JPS61133390A
公开(公告)日：1986-06-20
申请号：JP25523584
申请日：1984-12-03
申请人： Hitachi Cable Ltd
发明人： AOKI KATSUHIRO
IPC分类号： C23F1/40 , C23F1/44
摘要： PURPOSE: To control easily the capacity to strip gold plating without adding an accelerator to an aq. potassium cyanide soln. in the stage of stripping the gold plated to a metallic base body by dipping the metallic base body into said aq. soln. and injecting an oxygen-contg. gas thereto then stirring the soln.
CONSTITUTION: A lead frame 2 to which the gold to be stripped is plated is dipped into a treating vessel 3 contg. a treating liquid 1 consisting of an aq. KCN or NaCN soln. Air is then injected in the form of foam 5 from an air injecting pipe 4 provided to the bottom of the vessel 3 into said vessel to stir the soln. and to dissolve away the gold. KOH or NaOH may be added to the above-mentioned aq. soln. The concn. of KCN is made about 1.0W200g/l and the concn. of NaCN about 1.0g/l. The air or the like is injected to the soln. at about 1W500l/min rate and the stirring is executed at about 10W80°C. The control of the quantity of the gold to be stripped is thus made considerably easy.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：为了轻松控制镀金的能力，而不需要添加加速器到水箱。氰化钾溶液在通过将金属基体浸入所述水中来剥离镀金属于金属基体的阶段。索恩并注射氧气。气体，然后搅拌溶胶。构成：将待剥离的金的引线框架2浸入处理容器3中。由水溶液组成的处理液1， KCN或NaCN溶液。然后将空气以泡沫5的形式从设置在容器3的底部的空气注入管4注入到容器中以搅拌溶胶。并解散掉黄金。可以将KOH或NaOH加入到上述水溶液中。索恩浓浓的的KCN约为1.0-200g / l，的NaCN约为1.0g / l。空气等被注入到溶胶中。以约1-500l / min的速率进行，并且在约10-80℃下进行搅拌。因此，要剥离的金的量的控制变得相当容易。

4. 发明专利

JPH02182886A METHOD FOR REMOVING SILVER PLATING 失效
公开(公告)号：JPH02182886A
公开(公告)日：1990-07-17
申请号：JP234789
申请日：1989-01-09
申请人： HITACHI CABLE
发明人： CHINDA SATOSHI , AOKI KATSUHIRO
IPC分类号： C23F17/00 , C25F5/00 , H01L23/50
摘要： PURPOSE:To remove silver plating from the side of a silver plated lead frame for IC without deteriorating the characteristics of the silver surfaces of the parts requiring silver plating and aging a removing soln. by successively subjecting the lead frame to electrolytic stripping and chemical finish removal. CONSTITUTION:A silver plated lead frame for IC is successively subjected to electrolytic stripping and chemical finish removal. By this two-stage method, silver plating is removed from the side of the lead frame not requiring silver plating without deteriorating the characteristics of the silver surfaces of the IC chip setting part and the tip of the inner lead and the aging of a removing soln. contg. cyanogen, etc., can be prevented.

5. 发明专利

JPS63287046A LEAD FRAME 失效
公开(公告)号：JPS63287046A
公开(公告)日：1988-11-24
申请号：JP12188187
申请日：1987-05-19
申请人： HITACHI CABLE
发明人： AOKI KATSUHIRO
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent outflow of plating liquid when a frame is mounted on a rubber mask and plating is performed, in a lead frame, which has an IC mounting stage at the central part and a plurality of lead parts at a surrounding part of said stage, by providing a step on the rear side of the plate treating part of each lead part with a coining punch. CONSTITUTION:A lead frame 1 made of copper alloy has an IC mounting stage 2 at the central part and a plurality of pin shaped lead parts 3 in a surrounding pattern for the stage 2 at the outside. In this lead frame 1, a plated layer 6 at the tip of each lead part and a layer 31, where plating is not required, are set so that they are separated with plating boundary 4 on the surface of each lead part 3. Thereafter, a piece of bonding wire 7 is bonded to the plated layer 6. At this time, a step 5 of about 20 mum is formed on the rear surface of a lower surface 30 of the plated layer 6 of the lead part 3 by using a coining punch and a die. In this constitution, adhesion becomes excellent when a soft mask such as a rubber mask is mounted on the frame 1 and partial plating is performed. Plating liquid does not flow beyond the boundary 4.

6. 发明专利

JPS62151592A PRODUCTION OF GOLD PLATED LEAD FRAME 失效
公开(公告)号：JPS62151592A
公开(公告)日：1987-07-06
申请号：JP29612585
申请日：1985-12-25
申请人： HITACHI CABLE
发明人： CHINDA SATOSHI , YOSHIOKA OSAMU , AOKI KATSUHIRO
IPC分类号： H01L23/50 , C25D3/48 , C25D5/18 , C25D7/00 , H01L23/48
摘要： PURPOSE:To obtain gold plating having fine appearance even in a high current density range by carrying out gold plating with a pulsating current having a prescribed pulse wave in a gold plating bath contg. Tl as a crystallization regulator. CONSTITUTION:A gold plating bath contg. Tl as a crystallization regulator is prepd. A lead frame substrate is immersed in the plating bath optionally after it is plated to form an underlayer. A pulsating current having 1-10msec ON time and 1-5msec OFF time in 1-10 ratio of ON time/OFF time is then supplied to carry out gold plating.

7. 发明专利

JPS59205743A Electrode lead for semiconductor device 失效
标题翻译：电极引线用于半导体器件
公开(公告)号：JPS59205743A
公开(公告)日：1984-11-21
申请号：JP8059683
申请日：1983-05-09
申请人： Hitachi Cable Ltd
发明人： SANKI SADAHIKO , TAMURA KOUICHI , YOSHIDA HIROMICHI , OOTAKE HIROO , AOKI KATSUHIRO , NAKAGAWA KUNIO
IPC分类号： H01L23/48 , H01L23/49
CPC分类号： H01L24/01 , H01L2224/4554 , H01L2924/00011 , H01L2924/00014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0104 , H01L2924/01042 , H01L2924/01082 , H01L2224/48 , H01L2924/01015
摘要： PURPOSE:To facilitate with high reliability of the junction with supporting electrode by providing an Ni-Co-Fe alloy layer of the predetermined composition over the whole side plane of the front end of a copper or copper alloy wire comprising a copper part in its front end. CONSTITUTION:A complex chip in which a Fe-29% Ni-18% Co alloy layer 3 of about 2mm.phi outer diameter and about 1mm. length is attached to the side plane of a copper core 2 of 1.26mm.phi diameter along the axis direction is welded to the front end of a copper wire 1 of 0.8mm.phi diameter including Zr, as a supporting electrode material 4 to fabricate an electrode lead 5. In this constitution, as the lead wire 1 and the supporting electrode material 4 joined together are both copper, a low-cost electrode lead with high reliability and ease of junction can be obtained and still the electric characteristics is equal to the conventional supporting electrode material of Mo.
摘要翻译：目的：通过在铜或铜合金线的前端的整个侧面上提供具有预定组成的Ni-Co-Fe合金层，以便在与其辅助电极的接合处具有高可靠性，从而在其前面包括铜部分结束。构成：一种复合芯片，其中Fe-29％Ni-18％Co合金层3的外径约为2mm。长度附着在1.26mm的铜芯2的侧面上，沿着轴线方向的直径焊接到包括Zr的0.8mm.φ直径的铜线1的前端，作为辅助电极材料4制造在这种结构中，由于引线1和连接在一起的辅助电极材料4都是铜，所以可以获得具有高可靠性和易于连接的低成本电极引线，并且电特性等于常规的Mo的辅助电极材料

8. 发明专利

JPS63101031A POSITIONING METHOD FOR LONG-SIZED BODY 失效
公开(公告)号：JPS63101031A
公开(公告)日：1988-05-06
申请号：JP24723786
申请日：1986-10-17
申请人： HITACHI CABLE
发明人： SUZUMURA TAKASHI , HAGITANI SHIGEO , WADA HIDEO , AOKI KATSUHIRO
IPC分类号： B21D43/04 , B21D43/00
摘要： PURPOSE:To align a thin long-sized body like a leak frame with high accuracy by hanging a positioning member with its pressing at near necessary position onto the positioning means for a long-sized body and after positioning the long- sized body to the necessary position with moving it by a trace amount transferring the long-sized body. CONSTITUTION:A lead frame 4 is intermittently transferred until the distance B slightly shorter than the regulated transfer distance by a transfer means 9. The space from B up the regulated transfer distance point A is taken as the position where the tip of a pilot 1 is caught by the tip of a pilot hole 2 by descending the pilot pin 1 with a micro-aircylinder 5 and the lead frame 4 is transferred for trace distance with pressing the tip of the pilot pin 1 to the lead frame 4. When transferred up to the regulated transfer distance point A, the pilot pin 1 comes completely into the pilot hole 2 and further comes in the escape hole 3 of a load frame supporting base. In this case the invagination of the pilot pin 1 is detected by a photoelectric switch 7 and the alignment is completed.

9. 发明专利

JPH0582973B2 失效
公开(公告)号：JPH0582973B2
公开(公告)日：1993-11-24
申请号：JP12074886
申请日：1986-05-26
申请人： HITACHI CABLE
发明人： CHINDA SATOSHI , YOSHIOKA OSAMU , YAMAGISHI RYOZO , OKABE NORIO , AOKI KATSUHIRO
IPC分类号： H01L23/50 , H01L21/48

10. 发明专利

JPH0553879B2 失效
公开(公告)号：JPH0553879B2
公开(公告)日：1993-08-11
申请号：JP29612585
申请日：1985-12-25
申请人： HITACHI CABLE
发明人： CHINDA SATOSHI , YOSHIOKA OSAMU , AOKI KATSUHIRO
IPC分类号： H01L23/50 , C25D3/48 , C25D5/18 , C25D7/00 , H01L23/48

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