专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013102195A Surface protective tape used for semiconductor wafer backgrinding and base film for surface protective tape 有权
标题翻译：用于表面保护带的半导体波形贴片和基膜的表面保护带
公开(公告)号：JP2013102195A
公开(公告)日：2013-05-23
申请号：JP2013003821
申请日：2013-01-11
申请人： Gunze Ltd , グンゼ株式会社 , Nitto Denko Corp , 日東電工株式会社
发明人： FUNAZAKI KOJI , KOJIMA HISATOMI , HAYASHI NAOYA , YOKOI MASAYUKI
IPC分类号： H01L21/304 , C09J7/02
CPC分类号： H01L21/304 , B32B27/32 , C09J7/243 , C09J7/29 , C09J2201/162 , C09J2201/622 , C09J2203/326 , C09J2205/114 , C09J2423/046 , C09J2431/006 , C09J2433/006 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T428/24355
摘要： PROBLEM TO BE SOLVED: To provide a surface protective tape for a semiconductor wafer, which has uniform thickness tolerance, which is excellent in surface smoothness without blocking and the like, and provide a base film for the surface protective tape.SOLUTION: A base film of a surface protective tape of a semiconductor wafer comprises at least one layer of a layer including a polyethylene resin and satisfying the following requirements: (1) surface roughness (Ra) of both surfaces of the base film measured with reference to JIS B0601 is 0.8 μm and less, and surface roughness (Ra) of at least one surface is 0.05 μm and over; and (2) a difference between a maximum value and a minimum value of a thickness of the base film is 4 μm and less. And a surface protective tape of the semiconductor wafer, which includes the base film and an adhesive layer is provided.
摘要翻译：要解决的问题：为了提供具有均匀厚度公差的半导体晶片的表面保护带，其表面平滑度优异而没有阻塞等，并且提供了用于表面保护带的基膜。解决方案：半导体晶片的表面保护带的基膜包括至少一层包括聚乙烯树脂的层，并且满足以下要求：（1）基膜的两个表面的表面粗糙度（Ra）参照JIS B0601测定的值为0.8μm以下，至少一面的表面粗糙度（Ra）为0.05μm以上; 和（2）基膜的厚度的最大值和最小值之间的差为4μm以下。并且提供了包括基膜和粘合剂层的半导体晶片的表面保护带。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2006165000A Film for dicing 审中-公开
标题翻译：电影片
公开(公告)号：JP2006165000A
公开(公告)日：2006-06-22
申请号：JP2004349325
申请日：2004-12-02
申请人： Gunze Ltd , グンゼ株式会社
发明人： YOKOI MASAYUKI , FUNAZAKI KOJI , MITA AKIRA , YAGI MUNEHARU , TONOI KAZUTO
IPC分类号： H01L21/301 , B32B27/30 , C08L25/00 , C08L51/06 , C08L65/00
摘要： PROBLEM TO BE SOLVED: To provide a single-layer or a three-layer dicing film having more excellent expandability and property for accommodating/collecting the used sheet to a rack. SOLUTION: The dicing film is provided with following three means: a first means ; a second means ; and a third means . COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有更好的可扩展性和用于将所使用的片材收纳/收集到机架的性能的单层或三层切割膜。解决方案：切割膜具有以下三种装置：第一种方法<由90至97质量％的热塑性丙烯酸树脂颗粒（PAA树脂颗粒）的共混树脂A组成的非取向膜A，其中软质丙烯酸酯树脂形成芯层，半硬质或硬质甲基丙烯酸酯树脂形成壳层，10〜3质量％的由苯乙烯和脂肪族二烯构成的共聚物软性树脂的氢化树脂（氢化SD软树脂） >; 另外，在共混树脂中，由100质量份的80〜90质量％的PAA树脂粒子构成的含有5〜23质量份的萜烯树脂的混合树脂B形成的非取向膜B和氢化SD 软质树脂20〜10质量％第三装置<由作为中间层的非取向膜B和作为前后表面层的非取向膜A形成的三层膜>。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006116891A Polyolefin based laminated film for packaging 有权
标题翻译：用于包装的基于聚亚菲基的层压膜
公开(公告)号：JP2006116891A
公开(公告)日：2006-05-11
申请号：JP2004309228
申请日：2004-10-25
申请人： Gunze Ltd , グンゼ株式会社
发明人： KURIYAMA TAKAHIRO , TANAKA HIROYUKI , FUNAZAKI KOJI , KAYAHARA MITSUTAKA
IPC分类号： B32B27/32 , B65D30/02 , B65D65/40 , B65D81/34
摘要： PROBLEM TO BE SOLVED: To provide a laminated film which has a lower temperature heat seal property, and can safely perform the direct heating cooking in the state a pillow type bag of the film containing fresh vegetables by a microwave oven or the like. SOLUTION: The polyolefin based laminated film for package is produced by laminating a layer (C), a layer (B), and a layer (A) which are layers of the following resins on one surface of a lengthwise and crosswise stretched substrate layer (D) by a crystalline propylene: the layer (C) is a three-base copolymer resin consisting primarily of propylene and consisting of ethylene and a 4C-6C olefine (the olefine is abbreviated to Of); the layer (B) is a blend resin in which low density polyethylene of 15-40 pts.mass is blended into a two-base copolymer resin of ethylene and Of of 100 pts.mass; and the layer (A) is a blend resin of a noncrystalline two-base copolymer resin by propylene and Of of 50-75 mass% and a crystalline two-base copolymer resin of propylene and Of of 50-25 mass%. In addition, a single resin of Of of 5-45 pts.mass is blended into the layer (A). COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种具有较低温度热封性能的层压膜，并且可以通过微波炉等将含有新鲜蔬菜的膜的枕头型袋安全地进行直接加热烹饪。解决方案：用于包装的聚烯烃基层压膜通过在纵向和横向拉伸的一个表面上层压层（C），层（B）和层（A）而制成，层是以下树脂层基底层（D）：层（C）是主要由丙烯组成的由乙烯和4C-6C烯烃（烯烃缩写为Of）组成的三基共聚物树脂; 层（B）是共混树脂，其中将15-40重量份的低密度聚乙烯混合到乙烯的双碱共聚物树脂中，并且100重量份的共聚树脂; 层（A）是非结晶性二基共聚物树脂的丙烯和50〜75质量％的共混树脂和丙烯的结晶性2-碱共聚物树脂和50〜25质量％的混合树脂。另外，单层树脂中的5-45个聚苯并咪唑共混到层（A）中。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004017545A Low temperature shrinkable multilayered polyolefinic film and manufacturing method therefor 审中-公开
公开(公告)号：JP2004017545A
公开(公告)日：2004-01-22
申请号：JP2002177854
申请日：2002-06-19
申请人： Gunze Ltd , グンゼ株式会社
发明人： FUNAZAKI KOJI , KUBO SHINICHI , YOSHIDA SHOJI
IPC分类号： B32B27/32
摘要： PROBLEM TO BE SOLVED: To provide a multilayered film more improved in commodity function, protective function or the like along with heat skrinkability at a lower temperature and enabling low temperature heat shrink packaging.
SOLUTION: Surface layers (2) are laminated on both surfaces of a core layer (1) which is a layer mainly comprising either one of binary-ternary copolymers with a melting point of 100-140°C based on propylene and containing ethylene or butene -1 or ethylene and butene -1. Further, each of the surface layer (2) is a layer mainly comprising a copolymer having a melting point higher than that of the copolymer of the core layer and based on propylene and contains a 4-8C α-olefin. Further preferably, an intermediate layer (3), which comprises a blend of a polybutene resin and linear low density polyethylene being a main component obtained by the copolymerization of ethylene and a 4-8C α-olefin, is laminated.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2007280976A Base film for surface protection tape used for grinding rear face of semiconductor wafer 有权
标题翻译：用于研磨半导体晶片表面的表面保护带的基膜
公开(公告)号：JP2007280976A
公开(公告)日：2007-10-25
申请号：JP2006101333
申请日：2006-04-03
申请人： Gunze Ltd , グンゼ株式会社
发明人： FUNAZAKI KOJI , KOJIMA HISATOMI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To prevent the warpage of a semiconductor wafer after a grinding process, and to improve thickness precision.
SOLUTION: In a surface protection tape used when grinding the rear face of a semiconductor wafer, a base film for surface protection tape satisfying the following requirements (1), (2) has a center layer containing an annular olefin-based resin, and front/rear layers containing a branch-like low-density polyethylene resin. In measurement conforming to JIS B 0601, surface roughness Ra of both the front and rear of the base film is not more than 0.8 μm and that Ra of at least one surface is not less than 0.05 μm (1). The value of thickness (maximum-minimum) per 12 inches in diameter is not more than 4 μm (2).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止研磨过程之后的半导体晶片的翘曲，并提高厚度精度。解决方案：在研磨半导体晶片的背面时使用的表面保护带中，满足以下要求（1），（2）的表面保护带用基膜具有含有环状烯烃系树脂的中心层，以及包含支链状低密度聚乙烯树脂的前/后层。在符合JIS B 0601的测量中，基膜的前后的表面粗糙度Ra不大于0.8μm，并且至少一个表面的Ra不小于0.05μm（1）。每12英寸直径的厚度（最大 - 最小值）不超过4μm（2）。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007085913A Inspection data processing device, method, and program, and computer-readable storage medium for storing inspection data processing program 有权
标题翻译：检验数据处理设备，方法和程序以及用于存储检查数据处理程序的计算机可读存储介质
公开(公告)号：JP2007085913A
公开(公告)日：2007-04-05
申请号：JP2005275574
申请日：2005-09-22
申请人： Gunze Ltd , グンゼ株式会社
发明人： HORI KATSUHIRO , UEHARA OSAMU , FUNAZAKI KOJI
IPC分类号： G01N21/892
摘要： PROBLEM TO BE SOLVED: To provide an inspection data processor capable of processing inspection data obtained from an inspection device for a film, into more convenient one.
SOLUTION: This inspection data processor is displayed with a defect map 19 indicating a position of a defect on a film, and a defect histogram 21 indicating a distribution of the defects on the film. The inspection data of an optional area 31 is extracted out of the inspection data, when the optional area 31 is assigned by an input of an operator. The defect map 19 and the defect histogram 21 are displayed, based on the extracted inspection data.
COPYRIGHT: (C)2007,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式