会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明专利
    • LASER SOLDERING METHOD
    • JPS60111767A
    • 1985-06-18
    • JP21790583
    • 1983-11-21
    • OKI ELECTRIC IND CO LTD
    • TAYAMA MASASHIKASAHARA HIROAKI
    • H05K3/34B23K1/005
    • PURPOSE:To perform satisfactory and stable connection of mounting parts by determining the space between a condenser lens and leads in such a way that the beam diameter of laser light has the diameter equal to the diameter of the lead width of the mounting parts and irradiating the soldering parts of the leads over the entire part. CONSTITUTION:Such a condenser lens 8 with which the beam diameter phi of laser light is made equal to the width (d) of the leads 11 of a mounting part is selected and the space between the leads 11 and the lens 8 is so determined that the beam diameter phi of the laser light is made equal to the width (d) of the leads 11 at the distance f-h shorter than the focal length (f) of the lens 8 in a laser soldering method for soldering the mounting part to a packaging board 10 by the laser light. The laser light is then irradiated to the soldering parts of the leads 11 over the entire surface thereof, thereby soldering the mounting part and the board 10.