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1. 发明专利

JP2008229741A Polishing amount measuring method 审中-公开
标题翻译：抛光量测量方法
公开(公告)号：JP2008229741A
公开(公告)日：2008-10-02
申请号：JP2007069143
申请日：2007-03-16
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TACHIBANA MASANORI , MIYAZAWA HIROYUKI
IPC分类号： B24B37/013 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing amount measuring method capable of easily and surely measuring the polishing amount of a thin layer formed by patterning on a substrate and of achieving polishing with high accuracy. SOLUTION: This polishing amount measuring method includes: a step for forming the thin layer 30 by patterning on the substrate 20 and a dummy thin layer 32 with the same thickness as that of the thin layer 30; a step for forming a stopper layer 40 on the dummy thin layer 32; a step for forming an insulating layer 50 on the substrate 20, the thin layer 30 and the dummy thin layer 32; a polishing step for polishing the insulating layer 50 and the thin layer 30; a step for removing the stopper layer 40 from the dummy thin layer 32; and a step for measuring the polishing amount (D) of the thin layer 30 in the polishing step by measuring a step height between the polished thin layer 30 and the dummy thin layer 32. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种抛光量测量方法，其能够容易且可靠地测量通过在基板上图案化而形成的薄层的抛光量并且以高精度实现抛光。解决方案：该抛光量测量方法包括：通过在基板20上图案化形成薄层30的步骤和具有与薄层30相同厚度的虚设薄层32; 在虚设薄层32上形成止挡层40的工序; 在基板20，薄层30和虚设薄层32上形成绝缘层50的工序; 用于抛光绝缘层50和薄层30的抛光步骤; 从虚设薄层32去除阻挡层40的步骤; 以及通过测量抛光薄层30和虚拟薄层32之间的台阶高度来测量研磨步骤中的薄层30的抛光量（D）的步骤。（C）2009，JPO＆INPIT

2. 发明专利

JP2008068350A Facing tool for lap surface plate, facing method of lap surface plate, and facing device for lap surface plate 审中-公开
标题翻译：拉面板的制作工具，拉面表面的方法以及拉面表面的装置
公开(公告)号：JP2008068350A
公开(公告)日：2008-03-27
申请号：JP2006248687
申请日：2006-09-13
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MIYAZAWA HIROYUKI
IPC分类号： B24B53/017 , B24B53/02 , B24B53/12 , G11B5/39
摘要： PROBLEM TO BE SOLVED: To provide a facing tool for facing a lapping plate, more specifically, a facing tool supporting an annular cut ring having a blade at its end on a supporting base via an elastic material, a facing method using the facing tool, and a facing device. SOLUTION: The facing tool for facing the lap surface plate comprises the cut ring having ends of an annular outer peripheral surface and a surface in contact with a lap surface plate as blades and having a plurality of radial grooves formed on the surface in contact with the lap surface plate, and a supporting base having a plurality of holes bored to open toward the lap surface plate for supporting the cut ring in the respective holes via the elastic material so that the rings are vertically movable with respect to the lap surface plate for transmitting pressing force. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种面向研磨盘的面对工具，更具体地说，一种面向工具，其支撑环形切割环，该环形切割环的端部通过弹性材料在其底部具有叶片，面向方法使用面向工具和面向设备。解决方案：面向工作台面的工具包括具有环形外周面的端部和与搭接表面板作为叶片接触的表面的切割环，并且具有形成在表面上的多个径向槽与搭接表面板接触的支撑基座和具有多个孔的支撑基座，该多个孔被钻孔以朝向搭接表面板开口，用于经由弹性材料将切割环支撑在相应的孔中，使得环可相对于搭接表面垂直移动用于传递按压力的板。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2009301672A Method for manufacturing magnetic head 审中-公开
标题翻译：制造磁头的方法
公开(公告)号：JP2009301672A
公开(公告)日：2009-12-24
申请号：JP2008157138
申请日：2008-06-16
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YAMAMOTO TAMOTSU , NAGANUMA YASUO , SHIRATAKI HIROSHI , MIYAZAWA HIROYUKI
IPC分类号： G11B5/31
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a magnetic head for uniformizing the height of a side shield composed of a main magnetic pole and a soft magnetic film.
SOLUTION: The method includes the steps for: forming a plating seed film 21 on a substrate; patterning a first magnetic film; forming a non-magnetic film 24 on the substrate having the first magnetic film; forming a stopper film 26 acting as a stopper during polishing on the substrate with the non-magnetic film 24 formed thereon; leaving the stopper film 26 on a portion of the non-magnetic film 24; eliminating a portion of the non-magnetic film 24 around the first magnetic film to form a groove 22a with the plating seed film 21 exposing; forming a second magnetic film on the groove 22a; and polishing the surface of the substrate to the stopper film 26.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种用于形成用于使由主磁极和软磁膜构成的侧屏的高度均匀化的磁头的方法。解决方案：该方法包括以下步骤：在基板上形成电镀种子膜21; 图案化第一磁性膜; 在具有第一磁性膜的基板上形成非磁性膜24; 在其上形成有非磁性膜24的基板上形成在抛光期间用作止动器的止动膜26; 将止动膜26留在非磁性膜24的一部分上; 除去第一磁性膜周围的非磁性膜24的一部分，以形成镀覆种子膜21露出的槽22a; 在槽22a上形成第二磁性膜; 并将衬底的表面抛光到阻挡膜26上。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009277314A Method for manufacturing thin film magnetic head 审中-公开
标题翻译：制造薄膜磁头的方法
公开(公告)号：JP2009277314A
公开(公告)日：2009-11-26
申请号：JP2008129338
申请日：2008-05-16
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MIYAZAWA HIROYUKI , KATO MASAYA , TACHIBANA MASANORI
IPC分类号： G11B5/31
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/3116 , G11B5/3146 , G11B5/315
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film magnetic head, which can achieve planarization and high precision of the upper surface of a main magnetic pole, high precision shaping of a trailing gap, and efficient formation and high precision of a side shield and trailing shield.
SOLUTION: The method for manufacturing the thin film magnetic head includes steps of: forming a stopper layer which covers the magnetic poles and whose thickness of its lateral position becomes a predetermined width of the side shield gap; forming a resist layer for a thickness of the lateral position of the magnetic pole to become the width of the side shield; forming an insulating layer on that; polishing until the upper surface of the stopper layer comes out by a CMP process; removing the stopper layer until the upper surface of the magnetic pole comes out by dry etching; polishing the upper surface of the magnetic pole by the CMP process until the planarization is completed; removing the resist layer, removing the stopper layer coming out due to the preceding process; and forming the trailing shield and side shield.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：为了提供能够实现主磁极的上表面的平坦化和高精度的薄膜磁头的制造方法，拖尾间隙的高精度成形，高效的形成和高侧屏和后盾的精度。解决方案：薄膜磁头的制造方法包括以下步骤：形成覆盖磁极并且其横向位置的厚度变成侧屏蔽间隙的预定宽度的阻挡层; 形成用于所述磁极的横向位置的厚度的抗蚀剂层以变成所述侧屏蔽的宽度; 形成绝缘层; 抛光直到通过CMP工艺出现止挡层的上表面; 去除阻挡层，直到磁极的上表面通过干蚀刻出来; 通过CMP工艺抛光磁极的上表面直到平坦化完成; 去除抗蚀剂层，除去由于前述工艺而出来的止动层; 并形成后挡板和侧护罩。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009146504A Method for manufacturing magnetic head 审中-公开
标题翻译：制造磁头的方法
公开(公告)号：JP2009146504A
公开(公告)日：2009-07-02
申请号：JP2007322674
申请日：2007-12-14
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TACHIBANA MASANORI , KATO MASAYA , ITO TAKASHI , MIYAZAWA HIROYUKI
IPC分类号： G11B5/31
CPC分类号： C25D5/52 , C23C28/023 , C25D5/022 , C25D5/12 , G11B5/1278 , G11B5/315 , G11B5/3163
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a magnetic head, with which a magnetic pole for recording provided with a side shield can be highly accurately formed.
SOLUTION: The method includes: a step of forming a first magnetic layer 23 on the surface of a workpiece; a step of functioning the top part and side part of the first magnetic layer 23 as stoppers when performing polishing and covering the top part and side part of the first magnetic layer by a stopper layer 24 constituting a side gap; a step of making an area covering the top part of the first magnetic layer 23 of the stopper layer 24 thin; a step of forming a resist pattern 26 in which the side of the first magnetic layer 23 becomes a recessed part 26a; a step of forming a second magnetic layer 27 which becomes a side shield in the recessed part 26a; a step of covering the surface of the workpiece on which the second magnetic layer is formed, with an insulating layer of a polishing rate higher than the stopper layer; a step of polishing the surface of the work until the stopper layer is exposed from the second magnetic layer; and a step of removing the stopper layer exposed on the surface of the second magnetic layer.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造磁头的方法，通过该方法可以高精度地形成具有侧屏蔽的用于记录的磁极。解决方案：该方法包括：在工件表面上形成第一磁性层23的步骤; 使第一磁性层23的顶部和侧面部分作为阻挡件进行抛光并通过构成侧面间隙的阻挡层24覆盖第一磁性层的顶部和侧部的步骤; 使覆盖止挡层24的第一磁性层23的顶部的区域变薄的步骤; 形成其中第一磁性层23的侧面成为凹部26a的抗蚀剂图案26的步骤; 在凹部26a中形成成为侧面罩的第二磁性层27的工序; 利用抛光速度高于阻挡层的绝缘层覆盖其上形成有第二磁性层的工件的表面的步骤; 抛光工件的表面直到阻挡层从第二磁性层露出的步骤; 以及去除暴露在第二磁性层表面上的阻挡层的步骤。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2010120101A Apparatus and method for polishing work 审中-公开
标题翻译：抛光工具的装置和方法
公开(公告)号：JP2010120101A
公开(公告)日：2010-06-03
申请号：JP2008294534
申请日：2008-11-18
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MATSUURA YUJI , SUZUKI KENTARO , MIYAZAWA HIROYUKI , TACHIBANA MASANORI
IPC分类号： B24B37/013 , B24B37/04 , B24B37/24 , B24B37/30 , G11B5/31
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and method for polishing work, performing efficient and exact polishing work by controlling a film thickness of a metallic layer or an insulation layer formed on a substrate. SOLUTION: The apparatus for polishing work is provided with: a polishing head 20 having a head body 21 and a retainer ring 23; and a surface plate 12 having the polishing pad 10. The retainer ring 23 is provided with a first electrode 26 coming into contact with the polishing pad 10, and the head body 21 is provided with a second electrode 27 bringing electrical conduction into a rear face of a substrate 40. A control part 32 is provided which monitors a conductivity between the first electrode 26 and the second electrode 27 through a conduction portion 43 for a film thickness monitor formed on the substrate 40 with electrical conduction brought into the substrate 40 and the substrate 40, detects a final-point position of polishing work based on the progress of the conductivity, and controls a film thickness of a film-formed layer 42 formed on the substrate 40, when performing polishing work with the substrate 40 supported by the polishing head 20. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于抛光工作的装置和方法，通过控制形成在基板上的金属层或绝缘层的膜厚度来进行高效精确的抛光工作。解决方案：用于抛光工作的装置设置有：具有头主体21和保持环23的抛光头20; 以及具有抛光垫10的表面板12.保持环23设置有与抛光垫10接触的第一电极26，并且头主体21设置有第二电极27，该第二电极27将导电引入后表面设置有控制部分32，其通过导电部分43监测第一电极26和第二电极27之间的电导率，用于在基板40上形成的膜导电部分，导电被引入到基板40中，基板40基于导电性的进行来检测抛光工作的终点位置，并且在与由抛光支撑的基板40进行抛光加工时，控制形成在基板40上的薄膜形成层42的膜厚度 20.版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2002008218A METHOD AND DEVICE FOR ALIGNING ROW BAR IN LAPPING OF ROW BAR FOR MAGNETIC THIN FILM HEAD SLIDER, AND METHOD FOR LAPPING 失效
公开(公告)号：JP2002008218A
公开(公告)日：2002-01-11
申请号：JP2000186727
申请日：2000-06-21
申请人： FUJITSU LTD
发明人： SAWADA SHIGETOMO , OTSUKA MASAHIRO , MIYAZAWA HIROYUKI , AOKI TATSUYA
IPC分类号： B24B37/013 , B24B49/06 , B24B49/12 , G11B5/187 , G11B5/31 , G11B5/39 , G11B5/60 , G11B21/21 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a device for aligning a row bar in lapping of the row bar for a magnetic thin film head slider, with which readjustment of a monitor is easy and lapping of the row bar can be efficiently and precisely performed. SOLUTION: A lapping jig 14 which is provided with stoppers 18 provided in the same arrangement with the arrangement of footers 24 and having lower and surfaces which are flat and lying on the same plane and to which a supporting body 12 having the row bar 10 stuck to its lower surface is attached so that up-down movement can be freely adjusted is placed by abutting the stoppers 18 against the footers 24 and the position of a marker 32 beforehand provided on the row bar 10 can be made coincide with a first standard line 42 set on the screen of the monitor 26 by the up-down movement of the supporting body 12.

8. 发明专利

JP2000334658A LAPPING DEVICE 失效
公开(公告)号：JP2000334658A
公开(公告)日：2000-12-05
申请号：JP14900399
申请日：1999-05-28
申请人： FUJITSU LTD
发明人： TERAJIMA SHIGEO , MIYAZAWA HIROYUKI
IPC分类号： B24B37/10 , B24B49/14 , B24B53/007 , G11B5/127 , G11B5/187 , G11B5/31 , G11B5/39 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To surely and efficiently remove foreign matter such as abrasive grain during lapping, and to lap a MR head or the like with a high degree of accuracy. SOLUTION: A lapping device comprises a surface plate 12 adapted to be rotated around a rotary shaft, and a movable member 22 having a surface upstanding from the surface of the surface plate 12, and adapted to move in a direction substantially perpendicular to a line which is parallel with the surface of the surface plate and along which the upstanding surface crosses the surface of the surface plate. The movable member 22 is rotated on the surface plate 12 around an axis, as a center, which is located outside of the surface plate 12, and accordingly, foreign matter such as abrasive grain can be removed from a lapped surface.

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