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    • 2. 发明专利
    • Method of manufacturing coil device
    • 制造线圈装置的方法
    • JP2013106011A
    • 2013-05-30
    • JP2011251128
    • 2011-11-16
    • Fujitsu Ltd富士通株式会社
    • KUROSAWA YUITO MASAYUKI
    • H01F41/12
    • H01F41/06H01F41/122Y10T29/49071Y10T29/49073Y10T29/49075
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a coil device which reduces deterioration of an insulator during the manufacture of the coil device while facilitating the manufacture.SOLUTION: Planar insulating sheets 3 are inserted into a single conductor 2 formed in a solenoidal coil shape from a direction intersecting with the direction of a winding axis A of the conductor 2. In this process of inserting the insulating sheets, the insulating sheets 3 may be inserted from both sides opposing across the winding axis of the conductor 2. In addition, the method may include stretching the conductor 2 in the winding axis direction, inserting the insulating sheets 3 into the conductor 2 in the stretched state, and releasing the conductor 2 from the stretched state. The insulating sheets 3 may have a semicircular or approximately semicircular shape having a radius greater than or equal to the radius of the conductor.
    • 要解决的问题:提供一种线圈装置的制造方法,其在制造线圈装置的同时减少绝缘体的劣化,同时有利于制造。 解决方案:将平面绝缘片3从与导体2的卷绕轴线A的方向相交的方向插入到形成为螺线管线圈形状的单个导体2中。在插入绝缘片的过程中,绝缘 片材3可以从导体2的缠绕轴线相对的两侧插入。此外,该方法可以包括在卷绕轴线方向拉伸导体2,将绝缘片3以拉伸状态插入导体2中,以及 将导体2从拉伸状态释放。 绝缘片3可以具有半径大于或等于导体半径的半圆形或近似半圆形。 版权所有(C)2013,JPO&INPIT
    • 3. 发明专利
    • Electronic component and mounting method thereof
    • 电子元件及其安装方法
    • JP2010092998A
    • 2010-04-22
    • JP2008260213
    • 2008-10-07
    • Fujitsu Ltd富士通株式会社
    • KUROSAWA YUITO MASAYUKI
    • H05K1/18H05K3/34
    • PROBLEM TO BE SOLVED: To provide an electronic component having a lower surface electrode structure, in particular the one allowing solder joint to be easily confirmed.
      SOLUTION: The electronic component 100 has electrodes 200 and 210 for connection to the terminal of an element on the lower surface of a package. It includes through-holes 300 and 310 that penetrate the package vertically. The entire or a part of an opening part at the lower part of each through-hole is arranged in the region occupied by the electrodes 200 and 210 and is formed by penetrating the electrode 200 and 210.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供具有下表面电极结构的电子部件,特别是允许容易地确认焊接接头的电子部件。 解决方案:电子部件100具有用于连接到封装的下表面上的元件的端子的电极200和210。 它包括垂直穿透包装的通孔300和310。 每个通孔的下部的开口部分的全部或一部分被布置在由电极200和210占据的区域中,并且通过穿透电极200和210形成。版权所有(C)2010 ,JPO&INPIT