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1. 发明专利

JP2005347488A Semiconductor apparatus 有权
标题翻译： SEMICONDUCTOR APPARATUS
公开(公告)号：JP2005347488A
公开(公告)日：2005-12-15
申请号：JP2004164857
申请日：2004-06-02
申请人： Fujitsu Ltd , 富士通株式会社
发明人： HOSOYAMADA SUMIKAZU , TSUJI KAZUTO , KUBOTA YOSHIHIRO
IPC分类号： H01L21/3205 , H01L21/60 , H01L21/768 , H01L21/822 , H01L23/52 , H01L23/528 , H01L23/538 , H01L27/04 , H01L27/10
CPC分类号： H01L23/5286 , H01L24/03 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which can stably operate a semiconductor device by improving a structure of a power supply line, and is handled simply at a low cost. SOLUTION: The semiconductor apparatus comprises the semiconductor device in which a circuit provided at the center is connected to an electrode for a power supply for supplying a power supply from an outside by the power supply line; a substrate on which the semiconductor device is mounted, and also a first connection terminal arranged in an area surrounding the semiconductor device is electrically joined to the electrode for the power supply; a first opening formed on the power supply line disposed at the center of the circuit; a second opening formed on the power supply line disposed in an outer peripheral part of the circuit; and a conductor layer which is electrically joined to a second connection terminal arranged in the area surrounding the semiconductor device on the substrate, and also in which the power supply line in the first opening is connected to the power supply line in the second opening. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种通过改善电源线的结构来稳定地操作半导体器件的半导体装置，并且以简单的低成本处理。解决方案：半导体装置包括半导体装置，其中设置在中心的电路连接到用于从电源线从外部供应电源的电源的电极; 其上安装有半导体器件的衬底，并且布置在半导体器件周围的区域中的第一连接端子电连接到用于电源的电极; 形成在设置在电路中心的电源线上的第一开口; 形成在设置在电路的外周部分的电源线上的第二开口; 以及导体层，其电连接到布置在基板上的半导体器件周围的区域中的第二连接端子，并且其中第一开口中的电源线连接到第二开口中的电源线。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2008235576A Heat dissipation structure of electronic component and semiconductor device 审中-公开
标题翻译：电子元件和半导体器件的散热结构
公开(公告)号：JP2008235576A
公开(公告)日：2008-10-02
申请号：JP2007073100
申请日：2007-03-20
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YOTA SHIRO , KUBOTA YOSHIHIRO , TSUJI KAZUTO
IPC分类号： H01L23/34
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a versatile heat dissipation structure of electronic components of improved heat dissipation characteristics, as well as a semiconductor device. SOLUTION: Relating to the heat dissipation structure of an electronic component 35 that is mounted on a wiring substrate 31, a heat insulating material 33 is provided on the upper part of the wiring substrate 31, and a first heatsink 34 is provided on the upper part of the heat insulating material 33. The electronic component 35 is placed on the upper part of the first heatsink 34. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有改善的散热特性的电子部件的多功能散热结构以及半导体器件。解决方案：关于安装在布线基板31上的电子部件35的散热结构，在布线基板31的上部设置隔热材料33，在第一散热片34上设置有第一散热器34 绝热材料33的上部。电子部件35放置在第一散热器34的上部。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2007180777A Wireless transmission apparatus 审中-公开
标题翻译：无线传输设备
公开(公告)号：JP2007180777A
公开(公告)日：2007-07-12
申请号：JP2005375451
申请日：2005-12-27
申请人： Fujitsu Ltd , 富士通株式会社
发明人： ANDO TATSUHIRO , KUBOTA YOSHIHIRO , SUZUKI HIDEHIKO , OYAMA TAKUJI
IPC分类号： H04L12/28 , H04W8/08 , H04W8/26 , H04W36/00 , H04W36/14 , H04W48/08 , H04W80/00
CPC分类号： H04L29/12311 , H04L61/2015 , H04L61/2084 , H04W8/087 , H04W80/00
摘要： PROBLEM TO BE SOLVED: To provide a wireless transmission apparatus capable of achieving high-speed handover processing. SOLUTION: The wireless transmission apparatus connected to a plurality of subnetworks constituting an IP network including a server for managing IP addresses and connecting a mobile terminal to any one of the plurality of subnetworks is provided with: an address storage part for storing identification information indicating a mobile terminal to be a message transmission source and an IP address allocated from the server to the mobile terminal in the case of mutually transferring a message concerned with IP address allocation to be transferred between the mobile terminal and the server; a notification part for notifying other wireless transmission apparatus of the stored information; and a proxy response part for responding a message including the IP address already allocated to the mobile terminal to be the transmitting source of the received message as an allocated IP address instead of the server when the message transmitted from the mobile terminal and handovered from the other wireless transmission apparatus connected to a different subnetwork is received. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供能够实现高速切换处理的无线发送装置。解决方案：连接到构成包括用于管理IP地址并且将移动终端连接到多个子网中的任一个的服务器的IP网络的多个子网络的无线传输装置设置有：用于存储标识的地址存储部件指示移动终端成为消息发送源的信息，以及在相互传送涉及IP地址分配的消息的情况下从移动终端分配给移动终端的IP地址，以便在移动终端和服务器之间传送; 通知部件，用于通知其他无线发送装置所存储的信息; 以及代理响应部分，用于响应包括已经分配给移动终端的IP地址的消息作为所接收消息的发送源的消息作为分配的IP地址而不是服务器，当从移动终端发送并从另一个发送的消息连接到不同子网络的无线传输设备被接收。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2008181977A Package, manufacturing method thereof, semiconductor device using the same, and manufacturing method of semiconductor device using the same 有权
标题翻译：封装及其制造方法，使用该半导体器件的半导体器件及其使用的半导体器件的制造方法
公开(公告)号：JP2008181977A
公开(公告)日：2008-08-07
申请号：JP2007013159
申请日：2007-01-23
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KUBOTA YOSHIHIRO , YOTA SHIRO , TSUJI KAZUTO
IPC分类号： H01L23/12
CPC分类号： H05K3/0052 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05624 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48744 , H01L2224/48824 , H01L2224/48844 , H01L2224/73265 , H01L2224/85444 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20753 , H05K3/242 , H05K3/28 , H05K3/284 , H05K2201/0909 , H01L2924/00014 , H01L2924/0665 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： PROBLEM TO BE SOLVED: To provide a package structure, along with a semiconductor device, capable of preventing disconnection of a surface layer wiring, relating to a manufacturing process.
SOLUTION: There are provided a substrate 2 which is enclosed with a first side 12A, bored before a mounting process, and a second side 13, cut after the mounting process, and comprises a plurality of wiring layers, a sealing member 10 formed on one surface of the substrate 2, and a surface layer wiring 4 formed in the wiring layer closest to the sealing member 10. The surface wiring 4 is formed in a wiring implementing permission region comprising a sealing member formation region 300, in which the sealing member 10 is formed, and a region between the first side 12A and a part 10A of the outside edge of the sealing member formation region 300, facing the first side 12A.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供与制造过程相关的能够防止表面层布线断开的封装结构以及半导体器件。解决方案：提供了在安装过程之前被钻孔的第一侧面12A封闭的基板2和在安装过程之后切割的第二侧面13，并且包括多个布线层，密封构件10 形成在基板2的一个表面上，以及形成在最接近密封部件10的布线层中的表面层布线4.表面布线4形成在包括密封部件形成区域300的布线实施允许区域中，其中形成密封构件10，并且密封构件形成区域300的外边缘的第一侧面12A和部分10A之间的区域面向第一侧面12A。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2005347489A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2005347489A
公开(公告)日：2005-12-15
申请号：JP2004164858
申请日：2004-06-02
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TSUJI KAZUTO , KUBOTA YOSHIHIRO , ASADA KENJI , HOSOYAMADA SUMIKAZU
IPC分类号： H01L23/12 , H01L21/60 , H01L21/607 , H01L23/48 , H01L23/552 , H01L23/66
CPC分类号： H01L23/66 , H01L23/13 , H01L23/49838 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/451 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/4912 , H01L2224/49171 , H01L2224/49175 , H01L2224/85051 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19011 , H01L2924/1903 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having such a structure that, when a semiconductor element of a high density is mounted on a low-cost substrate, a bonding wire can be extended parallel to an electrode of a high speed signal line, and the bonding wire can be shortened. SOLUTION: In the vicinity of a semiconductor element 4 mounted on the substrate, an impedance matching substrate 6 is disposed with a wiring which is impedance-matched with the circuit of the semiconductor element. A plurality of bonding wires 14 which are connected between an electrode 4b of the semiconductor element and an electrode 6a of the impedance matching substrate are extended parallel to each other, and also bonding wires 16 which are connected between the electrode 6b of the impedance matching substrate and the electrode 2a of a substrate 2 are extended parallel to each other. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有这样的结构的半导体器件，即当将低密度的半导体元件安装在低成本的衬底上时，接合线可以平行于高速电极而延伸信号线，可以缩短接合线。解决方案：在安装在基板上的半导体元件4附近，阻抗匹配基板6配置有与半导体元件的电路阻抗匹配的布线。连接在半导体元件的电极4b和阻抗匹配基板的电极6a之间的多个接合线14彼此平行地延伸，并且还连接在阻抗匹配衬底的电极6b之间的接合线16 并且基板2的电极2a彼此平行地延伸。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005109147A Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2005109147A
公开(公告)日：2005-04-21
申请号：JP2003340642
申请日：2003-09-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KATO SADATANE , TSUJI KAZUTO , KUBOTA YOSHIHIRO , WATABE KAZUHIRO
IPC分类号： H01L23/12 , H01L23/34
CPC分类号： H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To surely and stably weld a heat radiating plate to the weld zone of a semiconductor device even when a small energy laser is used. SOLUTION: The semiconductor device comprises a semiconductor element 11, a circuit board 12 to which the semiconductor device is electrically connected, and a metal heat spreader 30 joined to the semiconductor element. The circuit board 12 has metal weld zones 22, and the heat spreader 30 is welded to the weld zones 22 of the circuit board 12. Recesses 30a are formed in the surface of the heat spreader 30 opposite to the surface thereof facing the weld zones 22. The heat spreader 30 is welded to the weld zones 22 within the recesses 30a by the laser. The recesses 30a are formed by etching. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使使用小能量激光器，也可以将热辐射板可靠且稳定地焊接到半导体器件的焊接区域。解决方案：半导体器件包括半导体元件11，与半导体器件电连接的电路板12和与半导体元件接合的金属散热器30。电路板12具有金属焊接区22，散热器30焊接到电路板12的焊接区22.凹部30a形成在散热器30的与面对焊接区22的表面相对的表面中散热器30通过激光焊接在凹部30a内的焊接区22。凹部30a通过蚀刻形成。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2007208695A Call control system 审中-公开
标题翻译：呼叫控制系统
公开(公告)号：JP2007208695A
公开(公告)日：2007-08-16
申请号：JP2006025651
申请日：2006-02-02
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OYAMA TAKUJI , SUZUKI HIDEHIKO , ANDO TATSUHIRO , KUBOTA YOSHIHIRO
IPC分类号： H04M3/00 , H04L12/66 , H04L12/70 , H04W4/02 , H04W28/00 , H04W40/34
CPC分类号： H04L65/1046 , H04L29/12094 , H04L61/1529 , H04L65/1006 , H04L65/1069 , H04W4/02
摘要： PROBLEM TO BE SOLVED: To provide technology for efficiently setting a call by informing a call controller corresponding to the position of a destination side communication device of a setting request of the call by a position management device. SOLUTION: The call controller which is connected to the position management device via a network receives the setting request of the call, retrieves positional information of the destination side communication device from a position data table in response to the setting request of the call, when the positional information is retrieved as the result of retrieval, sets the call on the basis of the positional information, and when the positional information is not retrieved as the result of retrieval, informs the position management device of the setting request of the call. The position management device receives information of the setting request of the call from the call controller, refers to a storage part which stores management information indicating which one of the call controllers controls call addressed to each communication device and informs the call controller which controls the call to the destination side communication device of the setting request of the setting request of the call on the basis of the referred management information. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供通过由位置管理装置通知通知目的地侧通信装置对呼叫的设置请求的位置的呼叫控制器来有效地设置呼叫的技术。解决方案：通过网络连接到位置管理装置的呼叫控制器接收呼叫的设置请求，响应于呼叫的设置请求，从位置数据表中检索目的地侧通信设备的位置信息当作为检索结果检索位置信息时，基于位置信息设置呼叫，并且当作为检索结果没有检索到位置信息时，向位置管理装置通知呼叫的设置请求。位置管理装置从呼叫控制器接收呼叫设定请求的信息，是指存储管理信息的存储部分，其存储指示呼叫控制器中哪一个控制呼叫寻址到每个通信装置的信息，并通知控制呼叫的呼叫控制器基于所引用的管理信息，向目的地侧通信设备发送呼叫的设置请求的设置请求。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007208595A Large-scale wide area network system having position information managing function 审中-公开
标题翻译：具有位置信息管理功能的大规模宽域网络系统
公开(公告)号：JP2007208595A
公开(公告)日：2007-08-16
申请号：JP2006024278
申请日：2006-02-01
申请人： Fujitsu Ltd , 富士通株式会社
发明人： ANDO TATSUHIRO , KUBOTA YOSHIHIRO , SUZUKI HIDEHIKO , OYAMA TAKUJI
IPC分类号： H04W60/00 , H04L12/70 , H04W8/02 , H04W8/26 , H04W80/00 , H04W84/04 , H04W88/08 , H04W88/12
CPC分类号： H04W8/26 , H04W8/02 , H04W80/00 , H04W84/04 , H04W88/08 , H04W88/12
摘要： PROBLEM TO BE SOLVED: To provide a technology capable of improving the efficiency of the position information management of a mobile terminal. SOLUTION: This large-scale wide area network system is provided with: a plurality of radio communication base devices constituting a plurality of access points having a subordinate radio zone, respectively; a plurality of radio communication base controllers for centralizedly controlling a plurality of corresponding radio communication base devices and managing the IP addresses of the radio communication base controllers of a movement source and a movement destination as the position information of mobile terminals; a plurality of local position information managing devices connected to a plurality of corresponding radio communication base controllers, respectively, through each local IP network corresponding to regions operated by one and the same communication provider to manage the IP addresses of the radio communication base controllers of movement sources as the position information of the mobile terminals; and a wide area position information managing device connected hierarchically to a plurality of local position information managing devices through a wide area IP network corresponding to a wide area operated by the communication provider to manage the IP addresses of corresponding local position information managing devices as the position information of the mobile terminals. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够提高移动终端的位置信息管理的效率的技术。解决方案：该大型广域网系统具有分别构成具有下级无线电区域的多个接入点的多个无线电通信基站装置。多个无线电通信基站控制器，用于集中控制多个对应的无线电通信基站装置，并且管理移动源和移动目的地的无线电通信基地控制器的IP地址作为移动终端的位置信息; 分别通过与由同一通信提供商操作的区域对应的每个本地IP网络分别连接到多个对应的无线电通信基站控制器的多个本地位置信息管理设备来管理移动的无线电通信基地控制器的IP地址来源作为移动终端的位置信息; 以及广域位置信息管理装置，通过与由通信提供者操作的广域对应的广域IP网络分层连接到多个本地位置信息管理装置，以管理对应的本地位置信息管理装置的IP地址作为位置移动终端的信息。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007180998A Wireless network controller, and wireless network control system 有权
标题翻译：无线网络控制器和无线网络控制系统
公开(公告)号：JP2007180998A
公开(公告)日：2007-07-12
申请号：JP2005378195
申请日：2005-12-28
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SUZUKI HIDEHIKO , KUBOTA YOSHIHIRO , ANDO TATSUHIRO , OYAMA TAKUJI
IPC分类号： G09C1/00 , H04L9/32 , H04W12/06
CPC分类号： H04W12/06 , H04L63/104 , H04W12/08 , H04W84/12
摘要： PROBLEM TO BE SOLVED: To provide a technology capable of parallelly accommodating a plurality of user group wireless networks with different authentication policies and providing a proper communication service to access from a user of each user group.
SOLUTION: A wireless LAN controller 3 includes a transmitting and receiving part for communicating with a plurality of wireless LAN access points 4 belonging to different user groups, and a wireless LAN connection control part for performing control to transfer a user authentication request from a wireless LAN terminal 5 belonging to one of the user groups, received by the transmitting and receiving part through one of the plurality of wireless LAN access points 4 to an authentication server 2 that should perform authentication processing of the user authentication request and transmit an authentication result from the authentication server 2 in response to the user authentication request to the wireless LAN terminal 5 through one of the plurality of wireless LAN access points 4.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够并行地容纳具有不同认证策略的多个用户组无线网络并提供适当的通信服务以从每个用户组的用户进行访问的技术。解决方案：无线LAN控制器3包括用于与属于不同用户组的多个无线LAN接入点4进行通信的发送和接收部分，以及无线LAN连接控制部分，用于执行控制以将用户认证请求从属于一个用户组的无线LAN终端5，由发送和接收部分通过多个无线LAN接入点4之一接收到认证服务器2，认证服务器2应执行用户认证请求的认证处理，并发送认证响应于通过多个无线LAN接入点4之一向无线LAN终端5的用户认证请求，来自认证服务器2的结果。（C）2007年，JPO＆INPIT

10. 发明专利

JP2007027804A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2007027804A
公开(公告)日：2007-02-01
申请号：JP2006300768
申请日：2006-11-06
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKADA AKIRA , KUBOTA YOSHIHIRO , ABE MITSUO
IPC分类号： H01L23/12 , H01L23/36
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents bleeding of a die attaching material from reaching bonding leads for grounding. SOLUTION: The semiconductor device includes: a substrate 12; a semiconductor element mounted on the substrate by the die attaching material; thermal vias 30 and 30a; bonding leads 24 and 24a for signals and grounding; wires extending between the semiconductor element and the bonding leads; a loop plating bonding part 32 provided on the substrate in a loop between the semiconductor element and the bonding leads and connected to the bonding leads for grounding; and plating leading wires 34 for connecting at least one 30a of the thermal vias and the loop plating bonding part. A solder resist 36 is coated on the substrate around the semiconductor element in a loop. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体装置，其防止管芯安装材料的渗出到达接地用的接合引线。解决方案：半导体器件包括：衬底12; 半导体元件，通过芯片安装材料安装在基板上; 热通孔30和30a; 接合引线24和24a用于信号和接地; 在半导体元件和接合引线之间延伸的导线; 环状电镀接合部32，其设置在半导体元件与接合引线之间的环路的基板上，并与接合引线相连接。以及电镀导线34，用于连接热通孔和回路电镀接合部分中的至少一个30a。阻焊层36以循环涂覆在半导体元件周围的基板上。版权所有（C）2007，JPO＆INPIT

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