专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPS592364B2 JPS592364B2 - 失效
公开(公告)号：JPS592364B2
公开(公告)日：1984-01-18
申请号：JP5212279
申请日：1979-04-27
申请人： Fujitsu Ltd
发明人： TANAKA KATSUO
IPC分类号： H01C1/14 , H01C1/04 , H01C1/16 , H01C13/02 , H01C17/00 , H01G4/40 , H01L27/01 , H05K1/02 , H05K1/14 , H05K1/16 , H05K3/22 , H05K3/34 , H05K3/36
CPC分类号： H05K1/141 , H01C1/04 , H01C1/16 , H01C13/02 , H01C17/006 , H05K1/0263 , H05K1/167 , H05K3/222 , H05K3/3421 , H05K3/368 , H05K2201/10015 , H05K2201/10045 , H05K2201/10272 , H05K2201/10386 , H05K2201/10477 , H05K2201/10636 , H05K2201/10946 , Y02P70/611

2. 发明专利

JPS5821401B2 失效
公开(公告)号：JPS5821401B2
公开(公告)日：1983-04-30
申请号：JP15834678
申请日：1978-12-19
申请人： FUJITSU LTD
发明人： TANAKA KATSUO , MURASE TERUO , NISHIHARA MIKIO , HIWATARI MASABUMI
IPC分类号： H01C1/01 , H01C7/00 , H01G4/40 , H01L27/01 , H05K1/16

3. 发明专利

JPS55145362A BUNCHING RESISTOR MODULE 失效
公开(公告)号：JPS55145362A
公开(公告)日：1980-11-12
申请号：JP5212279
申请日：1979-04-27
申请人： FUJITSU LTD
发明人： TANAKA KATSUO
IPC分类号： H01C1/14 , H01C1/04 , H01C1/16 , H01C13/02 , H01C17/00 , H01G4/40 , H01L27/01 , H05K1/02 , H05K1/14 , H05K1/16 , H05K3/22 , H05K3/34 , H05K3/36
摘要： PURPOSE:To reduce the entire size of a bunching resistor module by three-dimensionally superimposing conductive bars connected through an insulating layer to a power supply pattern on resistors or wiring pattern to the resistors. CONSTITUTION:A plurality of resistors 5 are formed on the surface of an insulating substrate 1, power supply lead wires 2, 3 and a signal lead wire 4 are formed thereat, and the respective lead wires 2, 3 and the resistors 5 are connected via wiring pattern of respective connecting pads 7, 8, 6. Then, an insulating layer is formed on the resistors 5 or the wiring pattern to the resistors 5, and conductive bars 9 are three-dimensionally superimpsoed as connected to the lead wire 2 on the insulating layer.

4. 发明专利

JPH053391A CONNECTION STRUCTURE FOR MOTHER BOARDS 失效
公开(公告)号：JPH053391A
公开(公告)日：1993-01-08
申请号：JP15304491
申请日：1991-06-25
申请人： FUJITSU LTD
发明人： TANAKA KATSUO , KOSUGE MAYUMI
IPC分类号： H05K7/02 , H05K7/14
摘要： PURPOSE:To improve the economical efficiency and the reliability by improving the connection structure for mother boards which operate being coupled in the sense of circuits, concerning the improvement of connection structure for electrically and mechanically connecting two mother boards. CONSTITUTION:This is constituted such that patterns 5a and 5b for connection contact with each other and that continuity comes about between them by providing pattern formation faces 2a and 2b where patterns 5a and 5b for connection are made in the shapes of being opposed to each other on the faces of two mother boards 1A and 1B, and laying these pattern formation faces 2a and 2b on top of each other.

5. 发明专利

JPS5583201A ASSOCIATED RESISTOR MODULE 失效
公开(公告)号：JPS5583201A
公开(公告)日：1980-06-23
申请号：JP15834678
申请日：1978-12-19
申请人： FUJITSU LTD
发明人： TANAKA KATSUO , MURASE TERUO , NISHIHARA MIKIO , HIWATARI MASABUMI
IPC分类号： H01C1/01 , H01C7/00 , H01G4/40 , H01L27/01 , H05K1/16

6. 发明专利

JPH05343109A 失效
公开(公告)号：JPH05343109A
公开(公告)日：1993-12-24
申请号：JP14737292
申请日：1992-06-08
申请人： FUJITSU LTD
发明人： TANAKA KATSUO
IPC分类号： H01R4/18 , H01R13/04
摘要： PURPOSE:To firmly connect a wire rod to a terminal of a connector with ease in terminal structure for the connector, which is used for connecting a plurality of electric wires in various kinds of electronic equipments. CONSTITUTION:Terminal structure for a connector made of a metal thin plate excellent in conductivity is constituted of a cylindrical contact portion 3a having locking projections 3d projected from the peripheral portion thereof on one side; a large-diameter portion 3e stepped from the contact portion 3a; a covered press-fitting portion 3b having a U-shaped cross section at the tip on the other side; and a core wire press-fitting portion 3c having a U-shaped cross section via a cut portion in the center. A wire rod inserting hole 13a, into which a single wire 1 is inserted, is formed between the covered press-fitting portion 3b and the core wire press-fitting portion 3c, and another core wire inserting hole 13b, into which a core wire 1-1 of the single wire 1 can be inserted, is formed between the core wire press-fitting portion 3c and the large-diameter portion 3e.

7. 发明专利

JPH05304348A 失效
公开(公告)号：JPH05304348A
公开(公告)日：1993-11-16
申请号：JP10816592
申请日：1992-04-27
申请人： FUJITSU LTD
发明人： TANAKA KATSUO
IPC分类号： H05K1/14 , H05K3/28 , H05K3/36
摘要： PURPOSE:To visually confirm the joint of a printed board and a flexible printed board by providing a base film having an opening in the same manner at the position corresponding to the opening of a cover film that is subject to soldering. CONSTITUTION:After forming copper patterns 2 on both sides of a board, a cover film 4 is formed on one side thereof in such a way that it will have an opening 4a in which a part of the copper patterns 2 on one side thereof. An opening 3a is formed on the other side thereof in same manner corresponding to the rear side of the opening 4a formed on the cover film 4. In such a formed flexible printed board 1, the pattern 2 exposed from the film 4 is aligned with the pattern 2 exposed from a base film 3 in wiring position on both sides. Thus, the patterns 2 that are formed as similarly on both rear and front sides can be positioned by using the base film 3 exposed on the opening 3a.

8. 发明专利

JPS5846510A METHOD OF SUPPLYING POWER SOURCE 失效
公开(公告)号：JPS5846510A
公开(公告)日：1983-03-18
申请号：JP14531981
申请日：1981-09-14
申请人： FUJITSU LTD
发明人： TANAKA KATSUO
IPC分类号： H05K7/02 , H01B5/00

9. 发明专利

JPS5749255A Package with external terminating circuit 失效
标题翻译：外部终端电路封装
公开(公告)号：JPS5749255A
公开(公告)日：1982-03-23
申请号：JP12482180
申请日：1980-09-09
申请人： Fujitsu Ltd
发明人： NISHIHARA MIKIO , TANAKA KATSUO , HAMADA KATSUYUKI
IPC分类号： H01L23/12 , H01L23/64 , H01L25/00
CPC分类号： H01L23/647 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To increase the universality and the integration of a package and to improve the characteristics of the package by forming a terminating circuit made of a plurality of resistance circuits, for example, at the desired positions of the package carrying elements and connecting the pads of the elements to the pads of the terminating circuit. CONSTITUTION:An LSI chip 2 is carried on a package 1, and the terminal 4 of the chip 2 is connected via a wire 15 to the pad 5 of the package 1 (as enlargedly shown). The pad 6 connected to the pad 5 is connected to the I/O terminal 10 via the internal pattern 17 of the package. A plurality of resistance elements 7 are formed by deposition and photoetching instead of the conventional associated resistance package on the package 1, the pad 8 of the resistance element 7 is connected via the I/O terminal to the power source, and one pad 6' is connected to the pad 6 as required to be operated as the terminal of the circuit. Thus, the package 1 can be commonly used as the chips of various types, and another resistance package is not necessarily carried, thereby reducing the size and increasing the performance of the package.
摘要翻译：目的：为了增加封装的普遍性和集成度，并且通过形成由多个电阻电路制成的端接电路，例如在封装承载元件的期望位置并连接元件到终端电路的焊盘。构成：在芯片2上承载LSI芯片2，芯片2的端子4经由导线15连接到封装1的焊盘5（如放大示出）。连接到焊盘5的焊盘6经由封装的内部图案17连接到I / O端子10。多个电阻元件7通过沉积和光刻而不是传统的相关的电阻封装形成在封装1上，电阻元件7的焊盘8通过I / O端子连接到电源，一个焊盘6' 根据需要连接到焊盘6作为电路的端子。因此，封装1可以通常用作各种芯片，并且不一定承载另一个电阻封装，从而减小封装的尺寸和性能。

10. 发明专利

JPS55102293A METHOD OF FIXING COMPONENT 失效
公开(公告)号：JPS55102293A
公开(公告)日：1980-08-05
申请号：JP1003479
申请日：1979-01-31
申请人： FUJITSU LTD
发明人： TANAKA KATSUO , SUGANO HIROAKI , SHIROTSUKI TSUNEO
IPC分类号： F16B13/00 , H05K1/18

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式