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1. 发明专利

JP2006173535A Flexible substrate and its connecting method 审中-公开
标题翻译：柔性基板及其连接方法
公开(公告)号：JP2006173535A
公开(公告)日：2006-06-29
申请号：JP2004367770
申请日：2004-12-20
申请人： Fujikura Ltd , Sony Corp , ソニー株式会社 , 株式会社フジクラ
发明人： OKAJI AKIMASA , KOIKE TOSHIHIKO , HYODO SACHIKO , SHIOZAWA KOJI , MASUDA YUSUKE , HORII ATSUHIRO , TOZAWA MASARU
IPC分类号： H05K1/02 , H01R43/00 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a flexible substrate and its connecting method that can achieve high mounting quality.
SOLUTION: The flexible substrate 10 having a reinforcing plate 1 stuck on the back of a connection part connected to a rigid substrate is mounted at a designated position on the rigid substrate by using a component mounting machine, and heated and pressed to connect the flexible substrate 10 to the rigid substrate, and then the reinforcing plate 1 is peeled.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以实现高安装质量的柔性基板及其连接方法。解决方案：具有粘附在与刚性基板连接的连接部分的背面上的加强板1的柔性基板10通过使用部件安装机器安装在刚性基板上的指定位置，并被加热并连接柔性基板10到刚性基板，然后加强板1被剥离。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007067243A Circuit board and electronic apparatus 审中-公开
标题翻译：电路板和电子设备
公开(公告)号：JP2007067243A
公开(公告)日：2007-03-15
申请号：JP2005252887
申请日：2005-08-31
申请人： Sony Corp , ソニー株式会社
发明人： URUSHIBARA TOSHICHIKA , MIYAMOTO TADAYUKI , HYODO SACHIKO , SHIOZAWA KOJI , OKABE MASAKAZU , MASUDA YUSUKE
IPC分类号： H05K1/14 , H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board capable of housing the head of a fixing screw into the other space and contributing to miniaturization of an electronic device by reducing or preventing the projection of the head of the fixing screw to the top surface of a rigid board, and to provide the electronic device. SOLUTION: The circuit board is provided with a first rigid board 4 having a plurality of first land portions 64; a second rigid board 7 having a plurality of second land portions 65; and a flexible wiring board 2 sandwiched by the first and second rigid boards 4 and 7, having a plurality of third land portions 14 corresponding to the first land portions 64 on one surface and a plurality of fourth land portions 15 corresponding to the second land portions 65 on the other surface. At least one part of the first land portions 64 and the third land portions 14 are electrically connected, and at least one part of the second land portions 65 and the fourth land portions 15 are electrically connected, and one part of one of the first rigid board 4 and the second rigid board 7 is protruded from an external edge of the other, thereby providing a fixing portion 52. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路板，其能够将固定螺钉的头部容纳到另一个空间中，并且通过减少或防止固定螺钉的头部突出到顶部而有助于电子装置的小型化刚性板的表面，并提供电子设备。解决方案：电路板设置有具有多个第一接地部分64的第一刚性基板4; 具有多个第二接地部65的第二刚性基板7; 以及由第一刚性基板4和第二刚性基板7夹持的柔性布线板2，具有与一个表面上的第一接地部分64相对应的多个第三接地部分14和对应于第二接地部分的多个第四接地部分15 65在另一个表面。第一接地部分64和第三接地部分14的至少一部分电连接，并且第二接地部分65和第四接地部分15的至少一部分电连接，并且第一刚性中的一个部分板4和第二刚性板7从另一个的外边缘突出，从而提供固定部分52.版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007067244A Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：JP2007067244A
公开(公告)日：2007-03-15
申请号：JP2005252888
申请日：2005-08-31
申请人： Sony Corp , ソニー株式会社
发明人： URUSHIBARA TOSHICHIKA , SHIOZAWA KOJI , OKABE MASAKAZU , HYODO SACHIKO , MASUDA YUSUKE , MIYAMOTO TADAYUKI
IPC分类号： H05K3/46 , H05K1/14
CPC分类号： H05K1/147 , H05K1/141 , H05K1/189 , H05K3/363 , H05K3/4691 , H05K2201/09063 , H05K2201/2009 , H05K2203/1572 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49155 , Y10T156/1056 , Y10T156/1075 , Y10T156/137
摘要： PROBLEM TO BE SOLVED: To provide a circuit board which can be easily manufactured by sandwiching a flexible board with two rigid boards, and is so sufficiently highly reliable as to be practical use while it has a simple configuration. SOLUTION: The circuit board is provided with a first rigid board 3 having a plurality of first land portions 60 on one surface; a second rigid board 6 having a plurality of second land portions 61 on one surface; and a flexible wiring board 2 having a third land portion 10 sandwiched by the rigid boards and corresponding to the first land portions on one surface and a fourth land portion 11 corresponding to the second land portions on the other surface. The second and fourth land portions are arranged so as to shift from the first and third land portions, and at least one part of the first and third land portions and at least one part of the second land and fourth land portions are electrically connected, respectively. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路板，其可以通过将具有两个刚性板的柔性板夹在中间而容易地制造，并且在具有简单的构造的情况下具有如实际应用的足够高的可靠性。解决方案：电路板设置有在一个表面上具有多个第一接地部分60的第一刚性板3; 第二刚性基板6，其在一个表面上具有多个第二接合部61; 以及柔性布线板2，其具有夹在刚性基板之间并对应于一个表面上的第一接地部分的第三接地部分10和与另一个表面上的第二接地部分相对应的第四接地部分11。第二和第四接地部分被布置成从第一和第三接地部分移位，并且第一接地部分和第三接地部分的至少一部分和第二接地区域和第四接地部分的至少一部分分别电连接。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006179529A Connection method of flexible board 审中-公开
标题翻译：柔性板的连接方法
公开(公告)号：JP2006179529A
公开(公告)日：2006-07-06
申请号：JP2004368319
申请日：2004-12-20
申请人： Sony Corp , ソニー株式会社
发明人： YANAGIDA KENJI , KOIKE TOSHIHIKO , MORIUCHI NOBUKIMI , MIZUNO MICHIHIKO , OKAJI AKIMASA , HYODO SACHIKO , SHIOZAWA KOJI , MASUDA YUSUKE
IPC分类号： H05K3/36 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a connection method of a flexible board for realizing high packaging quality.
SOLUTION: A flexible board is mounted at a predetermined position of an aggregate substrate consisting of a rigid substrate 31 and a waste substrate 32. The flexible board is secured to the waste substrate 32 and hot pressed thus connecting the flexible board and the rigid substrate 31 through solder. The flexible board is separated from the waste substrate 32 and the rigid substrate 31 is separated from the waste substrate 32.
COPYRIGHT: (C)2006,JPO&NCIPI

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