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    • 3. 发明专利
    • DIP FORMING METHOD
    • JPS60184461A
    • 1985-09-19
    • JP3905084
    • 1984-03-01
    • FUJIKURA LTD
    • TAKAYAMA TERUYUKIYAMAGUCHI TETSUOSAKAI MASAAKIMIYAUCHI KENICHI
    • B22D23/04B22D11/00
    • PURPOSE:To enable long-time stable operation of a dip forming method by cleaning up the surface of a seed wire and maintaining the atmosphere of the inert gas or weak reducing gas above the atmospheric pressure in the passage atmosphere until the seed wire is dipped into a molten metal. CONSTITUTION:A seed wire 7 to be used as a core is dipped in a molten metal 5 to stick and solidify the molten metal 5 around the wire 7 and to manufacture a casting rod 9. Such rod is continuously hot rolled, by which a clad wire rod is obtd. A passage atmosphere 11 in which the seed wire 7 having the surface cleaned by scalping 6 travels to the insertion port 2 for the seed wire of a crucible 1 is maintained in the atmosphere of the inert gas or weak reducing gas under the pressure above the atmospheric pressure. The product having good quality is thus obtd. without requiring any special mechanism for maintaining airtightness around the machine or jig. The maintenance of the equipment is made simple and the long-term stable operation is made possible.
    • 4. 发明专利
    • DIP FORMING METHOD
    • JPS5548458A
    • 1980-04-07
    • JP12121578
    • 1978-10-03
    • FUJIKURA LTD
    • YAMAGUCHI TETSUOSAKAI MASAAKISUGIYAMA NORIOMIYAUCHI KENICHI
    • B22D23/04B22D11/01B22D19/00
    • PURPOSE:To heat efficiently electrolytic copper in a preheating furnace to a desired temperature in a short time in a marking method for manufacture of a roughing- down wire of copper, by previously applying a thermal-absorption facilitating liquid of excellent thermal absorptivity containing neither Pb nor Zn on the surface of electrolytic copper when electrolytic copper is taken in the preheating furnace. CONSTITUTION:On the surfacae of elecrolytic copper 1 in a plate shape, a thermal- absorption facilitating liquid (e.g. China ink, black paint, etc.) of excellent absorptivity containing neither Pb nor Zn is previously applied. Next, electroytic copper 1 is put in preheating furnace 2, preheated up to a fixed temperature by heating method 6 such as a gas burner, and then fused in desolving furnace 3. Next, molten copper 4 is carried to holding furnace 7 and crucible 8. In crusible 8, base material 5 of copper runs from the lower part to the upper part and molten copper 4 sticks to the surface of base material 5 and is then solidified. In this method, even if a component if the liquid would be contained in the molten copper, neither Pb nor Zn is contained in the liquid, so that it will never exert any influence upon the mechanical and electrical properties of copper.
    • 7. 发明专利
    • DIP COATING FORMING DEVICE
    • JPS62112767A
    • 1987-05-23
    • JP25318585
    • 1985-11-12
    • FUJIKURA LTD
    • TOMINAGA HARUOTAKAYAMA TERUYUKIMIYAUCHI KENICHIYAMAGUCHI TETSUO
    • B22D11/00C23C2/04C23C2/14C23C2/38
    • PURPOSE:To provide the titled device which decreases the displacement of the amt. of the molten metal in a crucible in spite of a fluctuation in the molten metal level on the upper stream side of the molten metal supply of the crucible which allows the passage of a seed wire from an insertion hole through the inside of the molten metal and yields a coated wire having stable strength and dielectric constant at a stabilized coating rate by providing a partition wall having a small hole on the above- mentioned upper stream side. CONSTITUTION:A reducing gas is supplied 18 to a pressure furnace 15 to pressurize the molten metal Y in the furnace 15 with a prescribed pressure and to increase the molten metal level in a tapping furnace 16 so that the molten metal Y is supplied into the crucible 2. The seed wire B is passed in this state through the molten metal Y in the crucible 2 and is cooled 7 to obtain the coated wire C. The small hole 31 of the partition wall 30 controls the movement of the molten metal Y eve if the molten metal level in the crucible 2 is fluctuated by the minor fluctuation generated in the pressure to be exerted to the furnace 15. The fluctuation rate of the molten metal level in the partition wall 30 is, therefore, controlled to the value smaller than conven tional practice. The thickness of the coating layer to be formed on the outside of the seed wire B is thus made uniform and the fluctuation of the coating rate is suppressed. The coated wire C having stable quality is thus obtd.
    • 8. 发明专利
    • DIP FORMING METHOD
    • JPS60127068A
    • 1985-07-06
    • JP23526283
    • 1983-12-14
    • FUJIKURA LTD
    • TAKAYAMA TERUYUKIYAMAGUCHI TETSUOSAKAI MASAAKIMIYAUCHI KENICHI
    • B22D23/04B22D11/00
    • PURPOSE:To enable easy production of a clad material having different cladding rates with a dip forming method in which a metallic wire rod is passed through the inside of molten copper and a copper cladding material is produced by preheating the metallic wire rod and passing the same through the inside of the molten copper. CONSTITUTION:The melt of the copper melted in a melting furnace 3 is put into a graphite crucible 2 and a metallic wire 6 such as a copper wire or steel wire is inserted into the crucible from the inlet 1 in the bottom thereof and is pulled up in the molten copper 5. The wire is cooled in a cooling column 7 to solidify the molten copper sticking on the surface of the wire 6. The clad material is thus produced. The amt. of the molten copper sticking and solidifying on the surface of the wire 6, i.e., cladding rate is determined by the quantity of the heat reception and transmission generated between the wire 6 and the molten copper in the crucible. The cladding rate of the clad material is adjustable freely by preheating the wire 6 to a specific temp. with an electrical heater 12 in a vessel 8 in which a nonoxidizing atmosphere of a vaccum or Ar or the like is maintained prior to insertion of the wire 6 into the crucible 2.