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1. 发明专利

JP2014065119A Polishing pad sheet, polishing pad, method of manufacturing the same, and polishing method 有权
标题翻译：抛光垫片，抛光垫，其制造方法和抛光方法
公开(公告)号：JP2014065119A
公开(公告)日：2014-04-17
申请号：JP2012212661
申请日：2012-09-26
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： MIYAZAWA FUMIO , FUJII TAKATOSHI
IPC分类号： B24B37/24 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad which further highly flattens a surface of a polished object, and is excellent in suppressing generation of a scratch.SOLUTION: A polishing pad includes an elastic resin sheet with a plurality of separate air bubbles formed thereon as a polishing layer. A thickness of the resin sheet after the resin sheet is heated at a predetermined temperature increases by more than 3% with respect to a thickness of the resin sheet before heated.
摘要翻译：要解决的问题：提供一种进一步使抛光对象的表面平坦化的抛光垫，并且具有优异的抑制刮痕产生。抛光垫包括：弹性树脂片，其上形成有多个分开的气泡作为抛光层。树脂片在预定温度下加热后的树脂片的厚度相对于加热前的树脂片的厚度增加3％以上。

2. 发明专利

JP2013199618A Polishing pad and method for producing the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：JP2013199618A
公开(公告)日：2013-10-03
申请号：JP2012070037
申请日：2012-03-26
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： TATENO TEPPEI , MIYASAKA HIROHITO , MATSUOKA TATSUMA , KANAZAWA KAE , MIYAZAWA FUMIO
IPC分类号： C08J5/14 , B24B37/24 , H01L21/304
CPC分类号： B24B37/24 , C08G18/4238 , C08G18/44 , C08G18/4825 , C08G18/4854 , C08G18/7671 , C08L75/04 , C08L75/06
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a finish-polishing pad capable of polishing with few polishing scratches and of forming a stable film, and the polishing pad.SOLUTION: A polishing pad is produced by a method for producing a polishing pad having a polyurethane resin film as a polishing layer on a deposition substrate. The method includes the steps of: dissolving a composition for polyurethane resin film formation including a polyurethane resin and an additive, in a solvent in which the resin is soluble; removing an insoluble component such that the insoluble component in the solution is less than 1 mass% relative to the total mass of the composition for polyurethane resin film formation; adding and mixing a poor solvent into the solution, from which the insoluble component has been removed, in an amount (ml), which is calculated by formula 1: coagulation value (ml) relative to the poor solvent of the polyurethane resin×A (A=0.007-0.027), relative to a solid content in mass of 1 g; and forming the polyurethane resin film by allowing film formation of the mixed solution on the deposition substrate by a wet-coagulation method.
摘要翻译：要解决的问题：提供一种能够以少量抛光划痕抛光并形成稳定膜的抛光抛光垫的制造方法和抛光垫。解决方案：通过抛光垫的制造方法制造抛光垫在沉积基板上具有聚氨酯树脂膜作为抛光层。该方法包括以下步骤：将包含聚氨酯树脂和添加剂的聚氨酯树脂成膜用组合物溶解在树脂溶解的溶剂中; 除去不溶性成分，使得溶液中的不溶成分相对于聚氨酯树脂成膜用组合物的总质量小于1质量％将不良溶剂加入并除去不溶成分已被除去的溶液中，其量（ml）由式1计算：凝固值（ml）相对于聚氨酯树脂的不良溶剂×A（ A = 0.007-0.027），相对于1g的质量的固体含量; 并通过湿式凝结法在沉积基板上形成混合溶液来形成聚氨酯树脂膜。

3. 发明专利

JP2013089767A Abrasive pad and manufacturing method therefor 有权
标题翻译：研磨垫及其制造方法
公开(公告)号：JP2013089767A
公开(公告)日：2013-05-13
申请号：JP2011228987
申请日：2011-10-18
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： ITOYAMA MITSUNORI , MIYAZAWA FUMIO
IPC分类号： H01L21/304 , B24B37/20 , B24B37/24 , C08G18/32
CPC分类号： B24B37/24 , C08G18/3814 , C08G18/4854 , C08G18/7621 , C08G2101/00 , C08G2101/0066 , C08K2201/005 , H01L21/31053 , C08G18/10 , C08G18/6685 , C08G18/3206
摘要： PROBLEM TO BE SOLVED: To provide an abrasive pad which ensures excellent polishing rate and polishing uniformity by improving the problem of scratch occurring when using a conventional hard (dry) abrasive pad, and can deal with not only the primary polishing but also the finish polishing, and to provide a manufacturing method therefor.SOLUTION: In the abrasive pad for polishing a semiconductor device including an abrasive layer which has a polyurethane polyurea resin molding containing substantially spherical bubbles, independent bubble ratio of the polyurethane polyurea resin molding is 60-98%, the ratio (loss modulus/storage modulus) tanδ of the loss modulus E" to the storage modulus E' of the polyurethane polyurea resin molding is 0.15-0.30, the storage modulus E' is 1-100 MPa, and the density D of the polyurethane polyurea resin molding is 0.4-0.8 g/cm.
摘要翻译：要解决的问题：提供一种研磨垫，其通过改善使用常规硬（干）研磨垫时的划痕问题，确保优异的抛光速率和抛光均匀性，并且不仅可以处理初次抛光，而且还可以处理精抛光，并提供其制造方法。解决方案：在用于抛光包括具有包含基本上球形的气泡的聚氨酯聚脲树脂模制物的研磨层的半导体器件的研磨垫中，聚氨酯聚脲树脂模塑件的独立气泡比为60-98％，所述比（损耗模量 /储能模量）tanδ与聚氨酯聚脲树脂成型体的储能模量E'相比为0.15-0.30，储能模量E'为1-100MPa，聚氨酯聚脲树脂成型体的密度D为（C）2013，JPO和INPIT

4. 发明专利

JP2012223835A Polishing pad, and manufacturing method therefor 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：JP2012223835A
公开(公告)日：2012-11-15
申请号：JP2011091285
申请日：2011-04-15
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： ITOYAMA MITSUNORI , MIYAZAWA FUMIO
IPC分类号： B24B37/24 , C08J5/14 , H01L21/304
CPC分类号： B24B37/24 , B24B37/22 , C08G18/10 , C08G18/4854 , C08G18/7621 , C08G2101/0008 , C08J9/12 , C08J2207/00 , C08J2375/04 , H01L21/304 , C08G18/3814 , C08G18/4829
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad which solves the problem of scratching caused by the use of conventional hard (dry) polishing pads, achieves an excellent polishing rate and polishing uniformity, and is applicable not only to primary polishing but also to finish polishing, and to provide a manufacturing method for the same.SOLUTION: The polishing pad for polishing semiconductor devices includes a polishing layer having a polyurethane polyurea resin foam containing generally spherical bubbles. In the polishing pad, the polyurethane polyurea resin foam has an M component spin-spin relaxation time T2 of 160 to 260 μs, exhibits a storage elastic modulus E' of 1 to 30 MPa in a tensile mode where the polyurethane polyurea resin foam's temperature is 40°C, initial load is 10 g, distortion range is 0.01 to 4%, and measured frequency is 0.2 Hz, and the density D of the polyurethane polyurea resin foam is in the range of 0.30 to 0.60 g/cm.
摘要翻译：要解决的问题：为了提供解决由于使用传统的硬（干）抛光垫引起的划伤问题的抛光垫，实现了优异的抛光速率和抛光均匀性，并且不仅适用于一次抛光，还要完成抛光，并提供其制造方法。解决方案：用于抛光半导体器件的抛光垫包括具有聚氨酯聚脲树脂泡沫的抛光层，其含有大体上的球形气泡。在抛光垫中，聚氨酯聚脲树脂泡沫体的M成分自旋自旋松弛时间T2为160〜260μs，聚氨酯聚脲树脂泡沫体的温度为拉伸模式时的储存弹性模量E'为1〜30MPa 40℃，初始负荷为10g，变形范围为0.01〜4％，测定频率为0.2Hz，聚氨酯聚脲树脂发泡体的密度D在0.30〜0.60g / cm 3的范围内 3 。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012223834A Polishing pad, and manufacturing method therefor 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：JP2012223834A
公开(公告)日：2012-11-15
申请号：JP2011091284
申请日：2011-04-15
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： ITOYAMA MITSUNORI , MIYAZAWA FUMIO
IPC分类号： B24B37/24 , C08G18/00 , C08G18/48 , C08J5/14 , H01L21/304
CPC分类号： B24B37/24 , C08G18/10 , C08G18/14 , C08G18/4854 , C08G2101/0008 , C08G2101/0083 , C08J9/12 , C08J2207/00 , C08J2375/04 , C08G18/48 , C08G18/3814
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad which solves the problem of scratching caused by the use of conventional hard (dry) polishing pads, achieves an excellent polishing rate and polishing uniformity, and is applicable not only to primary polishing but also to finish polishing, and to provide a manufacturing method for the same.SOLUTION: The polishing pad for polishing semiconductor devices includes a polishing layer having a polyurethane polyurea resin foam containing generally spherical bubbles. In the polishing pad, the hard segment content (HSC) of the polyurethane polyurea resin foam given by following formula (1): HSC=100×(r-1)×(Mdi+Mda)÷(Mg+r×Mdi+(r-1)×Mda) is in the range of 26 to 34%, and the density D of the polyurethane polyurea resin foam is in the range of 0.30 to 0.60 g/cm.
摘要翻译：要解决的问题：为了提供解决由于使用传统的硬（干）抛光垫引起的划伤问题的抛光垫，实现了优异的抛光速率和抛光均匀性，并且不仅适用于一次抛光，还要完成抛光，并提供其制造方法。解决方案：用于抛光半导体器件的抛光垫包括具有聚氨酯聚脲树脂泡沫的抛光层，其含有大体上的球形气泡。在抛光垫中，由下式（1）给出的聚氨酯聚脲树脂发泡体的硬链段含量（HSC）：HSC = 100×（r-1）×（Mdi + Mda）÷（Mg + r×Mdi +（r -1）×Mda）在26〜34％的范围内，聚氨酯聚脲树脂发泡体的密度D在0.30〜0.60g / cm 3的范围内，。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2011104749A Polishing sheet, and method for manufacturing polishing sheet 有权
标题翻译：抛光片和制造抛光片的方法
公开(公告)号：JP2011104749A
公开(公告)日：2011-06-02
申请号：JP2009264813
申请日：2009-11-20
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： ITOYAMA MITSUNORI , MIYAZAWA FUMIO
IPC分类号： B24B37/22 , B24B37/24 , B24B37/26 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing sheet capable of suppressing a polishing defect and flattening an article to be polished. SOLUTION: The polishing sheet 10 includes a polishing member 6. The polishing member 6 is constituted by a film-like surface layer 3 formed of a polyurethane resin having a polishing surface P for polish-machining the article to be polished; and a sheet-like base 2 formed of a polyurethane resin having the same quality as the surface layer 3. In the surface layer 3, unevenness 5 is formed at a polishing surface P side at an interval Pe by the self-organization of the polyurethane resin, and the surface layer 3 has a honeycomb structure. On the polishing surface P, an opening hole of a recess 5a is formed. The base 2 is arranged at an opposite surface side to the polishing surface P of the surface layer. On the polishing member 6, the base 2 and the surface layer 3 are fused to be integrated. The opening hole of the recess 5a formed on the polishing surface P is made fine and uniform. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够抑制抛光缺陷并使待抛光制品变平的抛光片。抛光片6包括抛光构件6.抛光构件6由具有抛光表面P的聚氨酯树脂形成的膜状表面层3构成，用于对要抛光的物品进行抛光加工; 以及由具有与表面层3相同质量的聚氨酯树脂形成的片状基底2.在表面层3中，通过聚氨酯的自组织以间隔Pe在研磨面P侧形成凹凸5 树脂，表面层3具有蜂窝结构体。在研磨面P上形成凹部5a的开孔。基体2配置在与表面层的研磨面P相反的一侧。在抛光构件6上，底座2和表面层3被熔合成一体。形成在研磨面P上的凹部5a的开孔细微均匀。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010089183A Selecting method of grinding sheet for polishing pad 有权
标题翻译：抛光垫研磨片选择方法
公开(公告)号：JP2010089183A
公开(公告)日：2010-04-22
申请号：JP2008259464
申请日：2008-10-06
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： ITOYAMA MITSUNORI , TAKAHASHI DAISUKE , MIYAZAWA FUMIO
IPC分类号： B24B37/20 , C08G18/00 , C08G101/00 , C08J5/14 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a selecting method of grinding sheets for a grinding pad capable of achieving stabilization of polishing performance by making degree of abrasion appropriate. SOLUTION: The polishing pad includes an urethane sheet with a foamed structure having a polishing surface. The urethane sheet is selected and used from sheets formed by slicing a foamed product in which a polyisocyanate compound, a polyol compound, water, a polyamine compound, and non-reactive gas are mixed. A sheet having a F value in a range of 100-200 specified by the formula: F=-13.8×HSC-726×R+773×D-7.95A+1,516 is selected as a good product, wherein HSC indicates a content of a hard segment, R indicates an equivalent ratio of sum of hydroxy groups of a polyol compound and amino groups of a polyamine compound to isocyanate groups of a polyisocyanate compound, D indicates a bulk density, and A indicates hardness. The F value is correlative to easiness of abrasion at a polishing surface. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种研磨片材的选择方法，该研磨垫能够通过使磨损程度适当地实现抛光性能的稳定化。解决方案：抛光垫包括具有抛光表面的泡沫结构的聚氨酯片。选择聚氨酯片材，并从通过将多异氰酸酯化合物，多元醇化合物，水，多胺化合物和非反应性气体混合的发泡产品切片形成的片材中使用。选择由F = -13.8×HSC-726×R + 773×D-7.95A + 1,516指定的范围为100-200的F值的片材作为良品，其中HSC表示硬链段，R表示多元醇化合物的羟基与多胺化合物的氨基与多异氰酸酯化合物的异氰酸酯基的和的当量比，D表示堆积密度，A表示硬度。 F值与研磨面的磨损容易度相关。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2010076064A Method of manufacturing polishing pad 有权
标题翻译：制造抛光垫的方法
公开(公告)号：JP2010076064A
公开(公告)日：2010-04-08
申请号：JP2008248606
申请日：2008-09-26
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： ITOYAMA MITSUNORI , TAKAHASHI DAISUKE , MIYAZAWA FUMIO
IPC分类号： B24B37/24 , C08G18/10 , C08G18/32 , C08G18/66
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a polishing pad capable of moderating the degree of abrasion and stabilizing polishing performance. SOLUTION: The polishing pad includes a urethane sheet of a foam structure having a polishing surface. The urethane sheet is formed of a mixture of a polyisocyanate compound, a polyol compound, water, and a polyamine compound. Amounts of the respective components are controlled so that an F value obtained by an expression of F=-36.7×HSC-758.8×R+656×D-619×T+2587 is in a range of 100-200, wherein HSC refers to a content of hard segments, R refers to a total equivalence ratio of a total amount of a hydroxy group of the polyol compound and an amino group of the polyamine compound with respect to an isocyanate group of the polyisocyanate compound, D refers to a bulk density, and T refers to a thickness, respectively. The F value correlates with likelihood of abrasion on the polishing surface and the thickness T correlates with a service life. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够缓和磨损程度和稳定抛光性能的抛光垫的制造方法。解决方案：抛光垫包括具有抛光表面的泡沫结构的聚氨酯片。聚氨酯片由多异氰酸酯化合物，多元醇化合物，水和多胺化合物的混合物形成。控制各成分的量，使得通过F = -36.7×HSC-758.8×R + 656×D-619×T + 2587的表达获得的F值在100-200的范围内，其中HSC是指硬链段的含量R表示多元醇化合物的羟基与多胺化合物的氨基相对于多异氰酸酯化合物的异氰酸酯基的总当量比，D表示多异氰酸酯化合物的异氰酸酯基，，T分别为厚度。 F值与抛光表面的磨损可能性相关，厚度T与使用寿命相关。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010058231A Polishing method 有权
标题翻译：抛光方法
公开(公告)号：JP2010058231A
公开(公告)日：2010-03-18
申请号：JP2008227403
申请日：2008-09-04
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： ITOYAMA MITSUNORI , MIYAZAWA FUMIO
IPC分类号： B24B37/00 , B24B37/24 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing method capable of improving planarity of an object to be polished. SOLUTION: A polishing pad 20 includes a polishing sheet 1 having a polishing plane P comprising polyurethane resin as a main component for polishing the object to be polished. Inside the polishing sheet 1, a number of foams 2 are formed. In the polishing sheet 1 except the foams 2, acetyl cellulose is contained. When polishing, the polishing pad 20 is installed on a polishing plate of a polishing machine, and the object to be polished is polished while alkaline slurry capable of deacetylating acetyl cellulose is supplied. During the polishing process, at least part of acetyl cellulose on the side of the polishing plane P is deacetylated by the slurry, while forming a surface layer 1a. The surface layer 1a is higher in hydrophilicity and swelling property than an inner layer 1b of the surface layer 1a. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够提高待抛光对象的平面性的抛光方法。解决方案：抛光垫20包括具有抛光面P的抛光片1，抛光面P包含聚氨酯树脂作为抛光被抛物体的主要部件。在研磨片1内部形成有多个泡沫体2。在除了泡沫2之外的抛光片1中，含有乙酰纤维素。抛光时，将研磨垫20安装在研磨机的研磨板上，对供给脱乙酰化乙酰纤维素的碱性浆料进行抛光。在抛光过程中，抛光平面P一侧的至少部分乙酰纤维素被浆料脱乙酰，同时形成表面层1a。表面层1a的亲水性和溶胀性比表层1a的内层1b高。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009279680A Method of manufacturing polishing pad 有权
标题翻译：制造抛光垫的方法
公开(公告)号：JP2009279680A
公开(公告)日：2009-12-03
申请号：JP2008132250
申请日：2008-05-20
申请人： Fujibo Holdings Inc , 富士紡ホールディングス株式会社
发明人： MIYAZAWA FUMIO , ITOYAMA MITSUNORI , TAKAHASHI DAISUKE , TAKADA NAOKI
IPC分类号： B24B37/24 , C08J5/14 , C08J9/224 , C08L75/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad capable of uniforming foaming structure. SOLUTION: The polishing pad 1 has a polyurethane sheet 2 of the foaming structure. The polyurethane sheet 2 includes an isocyanate-group containing compound as a main component, and has a polishing surface P to abut to a polished object via slurry in the polishing process. Hemispherical particulates 3 with resin shells are approximately regularly and evenly dispersed on the polyurethane sheet 2. A hollow cavity is formed at the center of each shell, and a foaming component is disposed in the cavity of the particulate 3. Pores 6 formed of the foaming component disposed in cavities of the particulates 3 are approximately regularly and evenly formed in the polyurethane sheet 2. The particulates 3 are enclosed in the pores 6. The pores 6 are formed of gases generated from the foaming component. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够均匀发泡结构的抛光垫。解决方案：抛光垫1具有发泡结构的聚氨酯片材2。聚氨酯片2包括含异氰酸酯基的化合物作为主要成分，并且在研磨过程中具有通过浆料与研磨对象物接合的研磨面P. 具有树脂壳的半球形颗粒3近似均匀地分散在聚氨酯片材2上。在每个壳体的中心处形成中空腔，并且在颗粒3的空腔中设置发泡部件。由发泡体形成的孔6 设置在微粒3的空腔中的部件大致规则地均匀地形成在聚氨酯片材2中。微粒3被包封在孔隙6中。孔6由发泡部件产生的气体形成。版权所有（C）2010，JPO＆INPIT

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