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    • 4. 发明专利
    • Positive resist composition
    • 积极抵抗组成
    • JP2004302199A
    • 2004-10-28
    • JP2003095805
    • 2003-03-31
    • Fuji Photo Film Co Ltd富士写真フイルム株式会社
    • SATO KENICHIROYAMANAKA TSUKASANISHIYAMA FUMIYUKIMOMOTA ATSUSHI
    • G03F7/039G03F7/027H01L21/027
    • PROBLEM TO BE SOLVED: To provide a positive photoresist composition which solves problems in the techniques to improve the performance of microphotofabrication itself using far UV light, in particular, ArF excimer laser light, and to provide a positive photoresist composition for far UV exposure with low dependence on the PEB (post exposure bake) time. SOLUTION: The positive resist composition contains: a resin (A) in which all of repeating units are acrylic units, which has an alicyclic group but no aromatic group and which increases the solubility with a developing solution by the effect of an acid; a resin (B) which contains an acrylic unit and a methacrylic unit as repeating units, which has no aromatic group and which increases the solubility with a developing solution by the effect of an acid; a compound (C) which generates an acid by irradiation of active rays or radiation. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种正光致抗蚀剂组合物,其解决了使用远紫外光,特别是ArF准分子激光来提高微成像本身的性能的技术中的问题,并提供用于远紫外线的正性光致抗蚀剂组合物 曝光时间对PEB(曝光后曝光)的依赖度低。 解决方案:正型抗蚀剂组合物包含:其中所有重复单元均为丙烯酸单元的树脂(A),其具有脂环基但不含芳族基团,并且通过酸的作用增加与显影液的溶解度 ; 含有丙烯酸单元和甲基丙烯酸单元作为重复单元的树脂(B),其不具有芳族基团,并且通过酸的作用使显影液的溶解度增加; 通过活性射线或辐射的照射产生酸的化合物(C)。 版权所有(C)2005,JPO&NCIPI