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1. 发明专利

JP2010225753A DICING TAPE 审中-公开
公开(公告)号：JP2010225753A
公开(公告)日：2010-10-07
申请号：JP2009069978
申请日：2009-03-23
申请人： FURUKAWA ELECTRIC CO LTD
发明人： TAMAGAWA ARIMICHI , YABUKI AKIRA , OTA SATOSHI , YANO SHOZO , ISHIWATARI SHINICHI
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a dicing tape that efficiently picks up a thin semiconductor chip in a pick-up step after a dicing step. SOLUTION: Provided is a dicing tape to be used for fixing a to-be-diced body such as a semiconductor wafer when cutting and separating (dicing) the semiconductor wafer, etc. into individual elements. The dicing tape has an adhesive layer on a base film, and the base film has a loop stiffness of 3 to 25 mN as measured under predetermined conditions. COPYRIGHT: (C)2011,JPO&INPIT

2. 发明专利

JP2003173988A METHOD FOR DICING SEMICONDUCTOR WAFER 审中-公开
公开(公告)号：JP2003173988A
公开(公告)日：2003-06-20
申请号：JP2001370500
申请日：2001-12-04
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YANO SHOZO
IPC分类号： B23K26/40 , B23K26/14 , B23K26/38 , H01L21/301 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide a means for preventing cracks from generating in a step of dicing a semiconductor wafer, and further easily integrally bonding a small piece of a die bond sheet having the same dimension as a semiconductor chip to a back surface of the chip, and further to provide a method capable of solving the above-mentioned problems at a stroke. SOLUTION: In a method for dicing a semiconductor wafer, a semiconductor wafer (1) that a die bond sheet (2) is bonded to a back side thereof is supported and fixed by bonding by using a laser micro-jet dicing tape (24) bonded fixedly to a ring frame (3). In this state, the semiconductor wafer (1), the die bond sheet (2) and an adhesive layer (8) of the laser micro-jet dicing tape (24) are fully cut and diced by a laser micro-jet dicing that a water jet (6) is caused to guide a laser beam (5). COPYRIGHT: (C)2003,JPO

3. 发明专利

JPH11182776A PIPELINE INNER SURFACE REPAIRING METHOD AND REPAIRING MEMBER USED IN THIS METHOD 失效
公开(公告)号：JPH11182776A
公开(公告)日：1999-07-06
申请号：JP35159397
申请日：1997-12-19
申请人： TOA GROUT KOGYO CO , FURUKAWA ELECTRIC CO LTD
发明人： OOKA SHINKICHI , OKAMOTO KENSUKE , NISHIYAMA HIDEMI , NISHIMURA TAKESHI , YANO SHOZO , KITAJIMA HISASHI
IPC分类号： F16L55/16 , B29C63/42 , B29K101/12 , B32B1/08 , B32B27/10
摘要： PROBLEM TO BE SOLVED: To convey a repairing member into a repair required place in a pipeline to effectively repair the inner peripheral surface of the pipeline even in the case of hindering a worker from entering inside to work due to a small inner diameter of the pipeline at the time of partially repairing a damaged place of the existing pipeline such as a sewer pipe. SOLUTION: A repairing member 1 is composed of a cylindrical body with at least two layers. The inner layer 2 serving as the repairng member is made of elastic material and has an outer diameter larger than the inner diameter of a pipeline to be repaired, in an unrestricted state where internal stress is minimum. The outer layer 3 has an inner diameter smaller than the inner diameter of the pipeline, and the inner layer 2 is held to the outer layer 3 in the state of diameter enlargement being impeded by mechanical force. The vertical sectional shape of the inner layer to an axis of the pipeline is almost similar to the inner peripheral outline shape of the pipeline. After removing the outer layer 3, only the inner layer 2 serving as the inner surface repairing member is inserted in the pipeline, conveyed into a repair required place of the pipeline and installed. Spontaneous diameter enlarged deformation in a direction of reducing internal stress is generated to the inner layer to make it adhere closely to the inner surface of the pipeline, and inner surface repair is completed in the remaining state of internal stress.

4. 发明专利

JPH0897526A METAL-BASED PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH0897526A
公开(公告)日：1996-04-12
申请号：JP3286393
申请日：1993-01-27
申请人： FURUKAWA ELECTRIC CO LTD
发明人： ASADA TOSHIAKI , OTSUKA HIDEO , YANO SHOZO , OOSAWA AYAHA
IPC分类号： B32B15/08 , C09J7/02 , C09J11/04 , C09J201/00 , H05K1/05
摘要： PURPOSE: To enhance a withstand voltage characteristic and a heat radiating property by using a material containing an inorganic filling agent, the dielectric constant of which is not less than a predetermined value, for the insulating layer of a printed circuit board constituted by applying metal foil to one surface of a metal plate through an insulating material. CONSTITUTION: Metal foil 4 constituting a circuit is laminated on a printed circuit board 1 through an insulating layer 7. The insulating layer 7 is formed of insulating bonding agent layers 2 in which an inorganic filling material 6 is mixed and a plastic film layer 3 containing an inorganic filling material 5 held therebetween. The alloy plate, the cover plate or the like of a copper plate, an iron plate or the like is used for the metal plate 1. An epoxy or acryl resion or the like, or a modification or a mixture of them is used for the base resin of the insulating bonding agent layer 2. Inorganic fine particles of Al2 O3 , SiO2 or the like are used for the inorganic filling agent 6. The inorganic filling material 5 in which a conductive fine particle or a high-dielectric ceramic is mixed into a resin such as polyimide, polyester or the like is used for the plastic film layer 3. Thereby, a dielectric constant becomes not less than 11 at a frequency of 1mHz, so that withstand voltage and high heat-radiating property may be obtained.

5. 发明专利

JPH07221052A ADHESIVE TAPE FOR FIXING SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH07221052A
公开(公告)日：1995-08-18
申请号：JP1282794
申请日：1994-02-04
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YANO SHOZO , HIRUKAWA HIROSHI , IWAMOTO KAZUSHIGE
IPC分类号： C09J7/02 , H01L21/301 , H01L21/68 , H01L21/683
摘要： PURPOSE:To prevent necking on expansion by allowing a base film to consist of a plurality of layers and the layer at the surface side where no adhesive mass layer of the base film is provided to contain a friction-reduction agent. CONSTITUTION:A base film 3 of an adhesive tape 1 for fixing a semiconductor wafer consists of four layers (3a, 3b, 3c, and 3d) and a polymer of polyorefin and thermoplastic elastomer is used for each layer. A friction-reduction agent is contained in a base resin of the layer 3d in contact with a press tool at the opposite side of the adhesive mass coating layer 3a where the adhesive mass layer 2 is formed out of the layer constituting the base film 3. Then, no necking phenomenon for reducing the friction at the friction part between the adhesive tape 1 and the press tool occurs on expansion, thus fully and uniformly expanding the distance between chips and easily recognizing the image on pick-up and hence preventing malfunction.

6. 发明专利

JPH06224552A MANUFACTURE OF PRINTED BOARD 失效
公开(公告)号：JPH06224552A
公开(公告)日：1994-08-12
申请号：JP3286593
申请日：1993-01-27
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YANO SHOZO , ASADA TOSHIAKI , OOSAWA FUMIYO , OTSUKA HIDEO
IPC分类号： B32B15/08 , H05K3/00 , H05K3/38 , H05K3/44
摘要： PURPOSE:To improve the withstand voltage characteristics of an insulating layer by coating metal foil with insulating adhesive in vacuum or in normal pressure or pressurized electrically negative gas atmosphere, permitting the foil to be in a temporarily hardened condition and integrating a base board with the metal foil by heating and pressurizing them through the temporarily hardened adhesive layer. CONSTITUTION:Insulating adhesive is formed by mixing a prescribed quantity of dicyandiamide as hardening agent and a prescribed quantity of alumina as filler with bisphenol A type epoxy resin. Foil 1 is coated with the insulating adhesive in vacuum using type coating device. Then, the coated copper foil is heated at a prescribed temperature for a prescribed time so as to temporarily harden the adhesive and the copper foil prepreg provided with the insulating adhesive layer 2 is manufactured. The copper foil 1 can be coated with the insulating adhesive in SF6 gas under prescribed pressure or the coating can be performed in SF6 gas under prescribe pressure using a knife coater. As for the gas, C4F10 gas or the mixed gas of SF6 gas and C4F10 gas can be used other than SF6 gas.

7. 发明专利

JPH05315742A HEAT-RESISTANT ADHESIVE 失效
公开(公告)号：JPH05315742A
公开(公告)日：1993-11-26
申请号：JP11622492
申请日：1992-05-08
申请人： FURUKAWA ELECTRIC CO LTD
发明人： NAKAMURA NOBUYUKI , ASADA TOSHIAKI , YANO SHOZO
IPC分类号： C08G59/40 , C09J163/00 , H05K3/38
摘要： PURPOSE:To obtain high heat-resisting characteristics by causing the title adhesive to contain a resin intimate mixture composed of novolak epoxy resin or bisphenol epoxy, polyfunctional maleimide and gum resin; organophosphoric acid based compound, epoxy curing agent, and inorganic filler as essential ingredients. CONSTITUTION:The heat-resistant adhesive contains a resin intimate mixture composed of 10-90wt.% novolak epoxy resin or bisphenol epoxy resin, 10-90wt.% polyfunctional maleimide and 0-20wt.% gum resin; organophosphoric acid compound, epoxy curing agent, and inorganic filler as essential ingredients. The polyfunctional maleimide in the condensate of maleic anhydride and polyamine, but the polyamine obtained by the use of aromatic polyamine such as diaminodiphenylmethane and polyphenylmethylenepolyamine as raw material is desirable from the viewpoint of heat resistance and alkyl-group substitution products of these materials are suitable from the viewpoint of miscibility with epoxy resin.

8. 发明专利

JPH05287254A 失效
公开(公告)号：JPH05287254A
公开(公告)日：1993-11-02
申请号：JP9437192
申请日：1992-04-14
申请人： FURUKAWA ELECTRIC CO LTD
发明人： ASADA TOSHIAKI , YANO SHOZO , YOSHIDA MIKIKO , NAKAMURA NOBUYUKI
IPC分类号： H05K3/38 , C09J163/00
摘要： PURPOSE:To provide the subject adhesive having a long pot life a wide B-stage condition and excellent heat resistance, adhesion, flexibility and stability. CONSTITUTION:This adhesive comprises 100 pts.wt. epoxy resin, 0.8-1.2 equivalents of the stoichiometric amount, per 100 pts.wt. epoxy resin, of a diaminodiphenyl sulfone, 0.5-1.5 pts.wt. at least one member selected from among an imidazole compound, a boron trifluoride/amine complex compound and dicyandiamide and 190-580 pts.wt. filler.

9. 发明专利

JP2003163186A METHOD FOR FABRICATING SEMICONDUCTOR CHIP 审中-公开
公开(公告)号：JP2003163186A
公开(公告)日：2003-06-06
申请号：JP2002301205
申请日：2002-10-16
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YANO SHOZO , MARUYAMA HIROMITSU
IPC分类号： H01L21/67 , H01L21/301 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a method for fabricating a semiconductor chip in which a supporting/securing tape does not float with a semiconductor chip stuck thereto when the semiconductor wafer is diced by laser-dicing where a laser is guided by water jet and then the semiconductor chip is picked up. SOLUTION: Under a state where a supporting/securing adhesive tape 14 having a porous basic material film is stuck to a ring frame 12 and a semiconductor wafer is stuck to the supporting/securing adhesive tape, the semiconductor wafer is diced by laser-dicing where a laser 5 is guided by water jet 6. Subsequently, a semiconductor chip 1 fabricated by dicing is picked up with a nonporous adhesive tape 13 stuck to the side of the supporting/securing adhesive tape where the semiconductor wafer is not stuck. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2001012652A UNDERGROUND DUCT LINE 失效
公开(公告)号：JP2001012652A
公开(公告)日：2001-01-16
申请号：JP17939999
申请日：1999-06-25
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OZAWA SATOSHI , NISHIYAMA HIDEMI , YANO SHOZO
IPC分类号： H02G9/06 , F16L1/024 , F16L3/10 , F16L3/22 , F16L3/223
摘要： PROBLEM TO BE SOLVED: To facilitate the leveling of the bottom of an excavated ditch with good workability and easily ensure the linearity of a duct. SOLUTION: In this duct line, a number of duct bases 2 of a required length having a plurality of grooves 4 for housing the half circumference of a duct formed in parallel on the upper surface are arranged with the end surfaces being butted so as to continue the grooves 4. Short duct pillows 3 having a plurality of recessed parts 5 for housing the half circumference of the duct formed in parallel on both upper and lower surfaces are arranged at prescribed intervals in the longitudinal direction of the ducts 1, and lengthy ducts 1 are laid with the upper surface-side recessed parts 5 of the duct pillows 3 as guides. This is repeated once or more to lay pipes in a plurality of stages.

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