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1. 发明专利

JP2001262390A PALLADIUM PLATING LIQUID 失效
公开(公告)号：JP2001262390A
公开(公告)日：2001-09-26
申请号：JP2000207992
申请日：2000-07-10
申请人： FURUKAWA ELECTRIC CO LTD , MATSUDA SANGYO CO LTD
发明人： MORI MITSUO , UEKI SHINJI , ODA KAZUHIRO , SUZUKI SATOSHI , MATSUDA AKIRA
IPC分类号： C25D3/50 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a palladium plating liquid having excellent plating wettability after the plated palladium plating layer has been subjected to heat, hardly causing liquid degradation and suitable as a plating liquid for lead frame and to provide the plating liquid that enables thick plating and effectively applied for the manufacture of the contact material for electron parts. SOLUTION: The palladium plating liquid contains 1-60 g/L water soluble palladium compound (expressed in terms of palladium), 1.0-50 g/L sulfurous acid or the salt and 0.1-100 g/L sulfamic acid or the salt as essential ingredients and the water soluble palladium compound is at least one kind selected from a group of a chloride, bromide, iodide and nitrite of anmine complex salt of palladium and the thick plating palladium plating liquid contains 0.1-200 g/L phosphoric acid or the salt.

2. 发明专利

JPH10229152A LEAD MATERIAL FOR ELECTRONIC COMPONENT, LEAD USING THE SAME AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH10229152A
公开(公告)日：1998-08-25
申请号：JP30877597
申请日：1997-11-11
申请人： FURUKAWA ELECTRIC CO LTD , KYOWA ELECTRIC WIRE
发明人： TANIMOTO MORIMASA , SUZUKI SATOSHI , MATSUDA AKIRA , SUGIE KINYA
IPC分类号： H01L23/48 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To enhance the solderability of a lead material and to make it possible to increase the welding strength of the welding part of the lead material with an aluminium wire or the like, by a method wherein the melting temperature of a second plated layer is made lower than that of a first plated layer. SOLUTION: A plated layer of two-layer structure, wherein a first plated layer 2 and a second plated layer 3 are laminated in this order of the layer 2 and the layer 3 on the surface of a conductive substrate 1, is formed. In this lead material A, the melting temperature of the layer 3, which is the uppermost layer, is set lower than that of the layer 2, which is positioned under the layer 3. Therefore, even if the layer 3, which is the uppermost layer, is molten when soldering to the uppermost layer is performed, melting of the layer 2, which is positioned under the layer 3, is not caused. As a result, this layer 2 results in functioning as a barrier to Cu or the like diffusing thermally from the conductive base body 1 by heat at the time when the layer 2 is soldered. Accordingly, the deterioration of the solderability of the material A is inhibited and a good bonding strength between a solder on the layer 2 and a solder on the layer 3 is obtained.

3. 发明专利

JPH09280784A COPPER OR COPPER ALLOY MEMBER FOR HEAT EXCHANGER, AND ITS MANUFACTURE 失效
公开(公告)号：JPH09280784A
公开(公告)日：1997-10-31
申请号：JP8647496
申请日：1996-04-09
申请人： FURUKAWA ELECTRIC CO LTD
发明人： UEDA KENICHIRO , ISOBE TAKESHI , TANI TOSHIO , MATSUDA AKIRA
IPC分类号： F28F13/18 , F25B37/00
摘要： PROBLEM TO BE SOLVED: To keep the excellent hydrophilic property for a long time by forming a film of copper oxide in which the mole ratio of the cupric oxide to the cuprous oxide is not less than a prescribed value on the surface of a phosphorus deoxidized copper pipe, or a 9/1 cupro-nickel pipe by the electrolytic oxidation method to the thickness of a prescribed range. SOLUTION: The cathodic degreasing treatment is performed on a phosphorus deoxidized copper pipe or a 9/1 cupro-nickel pipe in the alkaline aqueous solution (NaOH: 400g/dm , the solution temperature: 70-95 deg.C). A cap is covered on each end of the phosphorus deoxidized copper tube or the 9/1 cupro-nickel pipe, and the copper oxide film in which the mole ratio of the cupric oxide to the cuprous oxide is >=5 is formed to the thickness of 0.2-10μm through anodic oxidation under the condition of the current density of 1.5-5A/dm , and the total power supply of 100-2,000 C/dm . The excellent hydrophilic property can be kept for a long time.

4. 发明专利

JPH093686A SILVER COATED PHOSPHOR BRONZE FOR SPRING AND ITS PRODUCTION 失效
公开(公告)号：JPH093686A
公开(公告)日：1997-01-07
申请号：JP15654295
申请日：1995-06-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SUZUKI SATOSHI , MATSUDA AKIRA
IPC分类号： C25D5/10 , C25D7/00 , H01H1/02 , H01H1/025 , H01H1/06
摘要： PURPOSE: To provide excellent corrosion resistance and to stabilize contact resistance by forming, via a copper layer, a coating layer composed of silver or silver alloy on the surface of phosphor bronze. CONSTITUTION: After a copper plating layer 2 is formed on the surface of phosphor bronze 1 for spring, a coating layer 3 composed of silver or silver alloy plating is further formed. It is preferable to apply low temp. annealing after copper plating and silver or silver alloy plating are successively performed. It is further preferable that, subsequently to this double layer plating, reduction of area is carried out, followed by low temp. annealing. The copper layer 2 is interposed as a barrier to the diffusion of tin from the phosphor bronze 1 into the silver type metal coating layer 3 at the time of annealing, and, although its thickness is not particularly limited, a thickness of 0.5-5.0μm is preferred in terms of function and cost. Moreover, it is desirable to regulate the thickness of the silver type metal coating layer 3 to 0.2-5.0μm in terms of practical use. It is preferable that low temp. annealing is done by performing holding for 1min to 2hr in the temp. region of 200-500 deg.C where the strain of the material can be sufficiently removed and the softening of phosphor bronze is not brought about.

5. 发明专利

JPH08253897A METHOD FOR REPLENISHING METALLIC ION TO ELECTROLYTIC BATH 失效
公开(公告)号：JPH08253897A
公开(公告)日：1996-10-01
申请号：JP5737595
申请日：1995-03-16
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MATSUDA AKIRA , SUZUKI SATOSHI
IPC分类号： C25B15/08 , C23C18/31 , C25D21/14
摘要： PURPOSE: To practically replenish a metallic ion by dipping a metallic material containing the same kind of a metal as a metal to be replenished and a carbon material into an electrolytic bath and electrically connecting both to efficiently dissolve the metallic ion from the dissolving electrode. CONSTITUTION: The metallic material containing the same kind of the metal as the metallic ion to be replenished and the carbon material to be a counter electrode are dipped into the electrolytic bath. The metallic material is dissolved as the ion in the electrolytic bath by connecting the metallic material and the carbon material with a lead wire or the like. Carbon black is suitable as the carbon material. Any of a single metal and an insoluble material coated with a metal can be used as the metal material to be replenished. The electrolytic bath is applicable for an electroplating bath or an electroless plating bath. As a result, the dissolving speed of the metallic ion from the dissolving electrode is improved compared to the case using the oxide of a platinum group metal as the counter' electrode and the metallic ion is efficiently replenished.

6. 发明专利

JPH04325689A FORMATION OF PATINA COATING FILM 失效
公开(公告)号：JPH04325689A
公开(公告)日：1992-11-16
申请号：JP9697591
申请日：1991-04-26
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MATSUDA AKIRA
IPC分类号： C23C22/63
摘要： PURPOSE:To obtain a patina coating film having a uniform color tone and satisfactory adhesion by bringing the surface of a member made of a Cu-based metal into contact with a patina producing liq. while brushing the surface of the member. CONSTITUTION:The surface of a member whose surface is made of Cu or Cu alloy is etched with an inorg. acid such as sulfuric acid, nitric acid or hydrochloric acid or is mechanically ground by buffing or blasting. A patina producing liq. is then brought into contact with the surface of the member to form a patina coating film. At this time, the surface of the member is brushed. This brushing method is not especially limited and the surface of the member may be lightly rubbed with a jig such as a brush obtd. by implanting filaments of nylon or other material having corrosion resistance to the patina producing liq. or a roll obtd. by winding a fabric of the corrosion resistant material.

7. 发明专利

JPH04247896A MANUFACTURE OF TIN OR TIN ALLOY PLATED MATERIAL 失效
公开(公告)号：JPH04247896A
公开(公告)日：1992-09-03
申请号：JP783491
申请日：1991-01-25
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MATSUDA AKIRA
IPC分类号： C25D3/30 , C25D5/48
摘要： PURPOSE:To offer a tin or tin alloy plated material which causes no surface discolor during storage. CONSTITUTION:After plating the base material with tin or tin alloy, the plated material is dipped in an aq. soln. in which a carboxylic acid is dissolved to dissolve and remove Sn(OH)2 depositing on the surface of the plated material. The Sn(OH)2 depositing on the surface of the plated material is dissolved and removed by the aq. soln. of carbosylic acid, so that the plated material causes no surface discolor during storage.

8. 发明专利

JPH03161180A PRODUCTION OF COMPOSITE MATERIAL 失效
公开(公告)号：JPH03161180A
公开(公告)日：1991-07-11
申请号：JP29644789
申请日：1989-11-15
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SUZUKI SATOSHI , MATSUDA AKIRA
IPC分类号： B23K20/00 , B23K20/04
摘要： PURPOSE:To obtain a composite material having an excellent adhesive property by applying plating consisting of a part or the whole of the components of a noble metal or alloy to be coated on the surface of the noble metal or the alloy thereof, then executing press welding. CONSTITUTION:The noble metal or the alloy thereof is joined by cold press welding or hot press welding onto a part or the entire surface of the surface of a conductive metallic base material to produce the composite material. The plating consisting of a part or the whole of the components of a noble metal or alloy to be coated is, thereupon, applied on the surface of the noble metal or the alloy thereof. The press welding is thereafter executed. The conductive base body is made of copper, copper alloy or the composite material thereof. The noble metals are Au, Pd, Pt, Ag or alloys thereof. Thus, the generation of a blister, etc., is lessened.

9. 发明专利

JPH03111600A ELECTROPOLISHING BATH FOR NI-TI ALLOY 失效
公开(公告)号：JPH03111600A
公开(公告)日：1991-05-13
申请号：JP24943789
申请日：1989-09-26
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MATSUDA AKIRA , NAKAMURA TAKEO , IWAI HIROHISA , SHIROYAMA KAISUKE
IPC分类号： C09K13/06 , C25F3/16
摘要： PURPOSE:To remove the offensive odor of a polishing bath, to improve the luster of a polished surface and to reduce the cost required to treat waste water by incorporating prescribed percentages of trihydric alcohol, perchloric acid and monohydric alcohol. CONSTITUTION:This electropolishing bath for Ni-Ti alloys is composed of 20-50vol.% trihydric alcohol (glycerol), 5-20vol.% perchloric acid and the balance monohydric alcohol (ethanol or methanol) and emits no offensive odor. By using this bath, Ni-Ti alloys having fine surface luster are efficiently obtd. and waste water is treated at a low cost.

10. 发明专利

JPH0353100A METHOD FOR CONTINUOUSLY TAPERING WIRE ROD 失效
公开(公告)号：JPH0353100A
公开(公告)日：1991-03-07
申请号：JP18506489
申请日：1989-07-18
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MATSUDA AKIRA , SHIRAKAWA AKITOMO , SHIROYAMA KAISUKE , IWAI HIROHISA
IPC分类号： B23H3/00 , B23H9/18 , C25F3/16
摘要： PURPOSE:To efficiently and accurately taper a wire rod by passing the wire rod through an electropolishing bath contg. set anodes and supplying electric current when the part of the wire rod to be tapered enters the bath. CONSTITUTION:A long-sized wire rod 1 is continuously passed through an electropolishing bath 2 contg. set anodes 3. When the point A of the wire rod 1 to be tapered reaches the inlet of the bath 2, electric current is supplied. When the point A reaches the outlet of the bath 2, the supply of electric current is stopped to taper the wire rod 1. The length A-C of the tapered part is nearly equal to the length A-B of the bath 2 and nearly symmetric tapering is carried out between A-C and A-B. The diameter of the point A as the smallest diameter of the wire rod 1 depends on the quantity of supplied electric current. The long-sized wire rod is repeatedly tapered by periodically supplying electric current.

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