专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004087467A Thermal fuse for resistive circuit substrate 有权
公开(公告)号：JP2004087467A
公开(公告)日：2004-03-18
申请号：JP2003173651
申请日：2003-06-18
申请人： Denso Corp , Fujikura Ltd , 株式会社デンソー , 株式会社フジクラ
发明人： EGUCHI KATSUO , SUZUKI TAKAO , ITO MASANORI , MIYAZAWA KAZUHIRO , NAMIKAWA AKITO
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To prevent fuse solder from sliding off from a board to lose a fuse function in an abnormality when a large current flows and a resistive circuit abruptly generates heat.
SOLUTION: A base body 17 that works as a bridge for a resistive circuit 2 is provided on an procelain enamel substrate 1 as a fuse base 16, and aside from this, nonconductive bases 18 through which a current does not flow are provided at, for example, four corners of an area where solder is placed. A solder fuse 7 is placed such that the base body 17 and the nonconductive base 18 are covered, and thereby a thermal fuse 14 is formed. Even in the case that a large current flows in the abnormality of motor lock or the like, and the base body 17 in addition to the resistive circuit abruptly generates heat, and thus a contacting interface between the solder and the base body 17 melts, the nonconductive base 18, through which current does not flow since a temperature rise is delayed in the base 18 compared with the base body 17 through which the current flows, acts to keep the solder 7, and prevents slide-off from the substrate.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2002270976A INSULATION COATED METAL BOARD 失效
公开(公告)号：JP2002270976A
公开(公告)日：2002-09-20
申请号：JP2001067353
申请日：2001-03-09
申请人： FUJIKURA LTD
发明人： UCHIDA KAZUHIRO , YAGI SHIGEKI , SUZUKI TAKAO , OKUYAMA HITOSHI , ITO MASANORI
IPC分类号： H05K1/05 , H05K1/02 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To prevent a cut portion of a multi-chip board from corroding, thereby effectively preventing is aging deterioration. SOLUTION: An enamel board 10 has a steel sheet, enamel 16 coating its surface, a plurality of male-type terminals 12 projecting at the end of the board and a specified circuit formed on a enamel 16 surface. The male-type terminals are housed in a connector housing and inserted in and connected to female-type terminals. A tab 13 connected to an intermediate plate 14 is probuatingly arranged at a position to be housed in the connector housing and is cut off from the plate 14 in a form of a half-finished product.

3. 发明专利

JPH04199594A FORMATION OF GROUND STRUCTURE OF ENAMELLED BOARD 失效
公开(公告)号：JPH04199594A
公开(公告)日：1992-07-20
申请号：JP32530290
申请日：1990-11-29
申请人： FUJIKURA LTD
发明人： URUGA KENICHI , OKUYAMA HITOSHI , YAJIMA KIYOSHI , SUZUKI TAKAO , ITOU MASANORI
IPC分类号： H05K3/44
摘要： PURPOSE:To improve corrosion resistance to water, salt water, and the like by fitting a hole of a metal plate with an Ni pin, welding from the bottom, cutting off beads to flatten, coating with glass, and then removing glass on the head of an Ni pin to expose the head serving as a ground point. CONSTITUTION:A metal core of an enamelled substrate before glass coating is holed; a hole is fitted with an Ni-made pin and secured by welding from the bottom of the metal core; and its bead is cut off to flatten. Thereafter, the metal core is coated with glass: sandblasting glass on the head facilitates removal of glass from the Ni head because of poor adhesion between Ni and glass with the result that a smooth ground part with no difference in level from an enamelled layer. Next, a conductive paste is screen-printed, dried, and baked to form a ground structure. This process improves corrosion resistance to water, salt water, and the like.

4. 发明专利

JPH0479394A U-SHAPED ENAMELLED CIRCUIT BOARD 失效
公开(公告)号：JPH0479394A
公开(公告)日：1992-03-12
申请号：JP19302790
申请日：1990-07-23
申请人： FUJIKURA LTD
发明人： SUZUKI TAKAO , YAJIMA KIYOSHI , OKUYAMA HITOSHI , ITOU MASANORI , URUGA KENICHI
IPC分类号： H05K1/05 , H05K1/00 , H05K1/02
摘要： PURPOSE:To make a form of an enamelled circuit board compact and eliminate resonances caused by vibrations of a base body, etc., by forming protruding terminals on at least one end part of the enamelled circuit base board which is obtained through bending a plate nearly into a U-shape, and by enabling them to be connected with external connectors. CONSTITUTION:As iron core plates, the comparatively thin plates of 0.4 and 0.6 m in thickness are selected. The spaces between the two faces of a U-shaped base board 1 are made to be 5, 10, 15, and 20mm. Both the width and height of the U-shaped board 1 are made to be 45 mm. In the one of 5mm in the space between the two faces, a circuit 2 is formed with a screen printing performed by a suction method, and in the ones of the other spaces, the circuit 2 is formed by a curved-face printing method respectively. The enamelled circuit board 1 of a U-shape is considered as a base board in which the top parts of two planar base boards are interconnected. Therefore, in spite of selecting the comparatively thin iron core plates of 0.4 and 0.6mm in thickness, as a result of confirming their mechanical strengths when inserting them into connectors, both are satisfactory. Further, after housings are provided, the base boards are cooled by an air flow, and their high stabilities are found without resonating to vibrations.

5. 发明专利

JPH03263726A TEMPERATURE FUSE CIRCUIT BOARD WITH PROTECTIVE CASE 失效
公开(公告)号：JPH03263726A
公开(公告)日：1991-11-25
申请号：JP6115590
申请日：1990-03-14
申请人： FUJIKURA LTD , CALSONIC CORP , KARUSONITSUKU KOOWA KK
发明人： SUZUKI TAKAO , YAJIMA KIYOSHI , ITOU MASARITSU , URUGA KENICHI , OKUYAMA HITOSHI , YAMAMOTO NOBUTAKA , HIRABAYASHI HISANAGA , ICHIKAWA JUN
IPC分类号： H05K1/02 , H01H37/76 , H01H85/046 , H05K1/05 , H05K1/16
摘要： PURPOSE:To prevent the damage of a temperature fuse caused by the abrasion during packing, transportation, storage or assembling into a device by providing a protruded fuse protective case made of a heat-resistant material on the temperature fuse formed on a porcelain board. CONSTITUTION:A resistor circuit layer 4 is formed on a porcelain board 7, an over-glaze layer 6 is formed on the board 7 except a fuse section, and a fuse is formed on the board 7, and a protective case 1 made of a heat-resistant material such as an aluminum plate or heat-resistant resin machined into a protruded shape is fitted astride this circuit. The height of the protruded section of the protective case 1 is set to 1.0-5.0mm for the inner size from the board face to the inner face of the case 1. The damage of the porcelain circuit board 7 with the temperature fuse 3 caused by the abrasion due to vibrations during packing or transportation or the abrasion during the fitting to a device is prevented by the protective case 1.

6. 发明专利

JPH0393123A TEMPERATURE FUSE 失效
公开(公告)号：JPH0393123A
公开(公告)日：1991-04-18
申请号：JP22753189
申请日：1989-09-04
申请人： FUJIKURA LTD , CALSONIC CORP
发明人： ITOU MASANORI , YAJIMA KIYOSHI , SUZUKI TAKAO , OKUYAMA HITOSHI , URUGA KENICHI , YAMAMOTO NOBUTAKA , HIRABAYASHI HISANAGA
IPC分类号： H05K1/02 , H01H37/76 , H05K3/34
摘要： PURPOSE:To surely cut a circuit by forming projected parts of a metal which is easy to be eroded with a molten low melting point metal at both end parts of a circuit and depositing a low melting point metal in the way of bridging both projected parts. CONSTITUTION:Connected with both end parts of a conductive circuit and used a fuse base, a metal, for example a silver thick film, which is easy to be eroded with a molten low melting point metal is projected to form projected parts 2 at both end parts. The projected parts 2 are still separated from each other and then a fuse 3 is formed in the disconnected part between them so as to bridge and connected them. The (a) part, as a temperature fuse normal work part, is cut by melting the solder 3 in the same as a conventional way when a substrate is over-heated. Even if the solider is melted and the melted solder is spread to both ends in that part and the circuit is not cut, the fuse base Ag is eroded at the connection part (b part) of the solder and the projected fuse base, and thus the circuit is cut as the connection part works as an erosion work part.

7. 发明专利

JPH02276206A RESISTANCE VALUE ADJUSTING METHOD FOR RESISTANCE CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH02276206A
公开(公告)日：1990-11-13
申请号：JP9638589
申请日：1989-04-18
申请人： FUJIKURA LTD
发明人： YAJIMA KIYOSHI , OKUYAMA HITOSHI , SUZUKI TAKAO , ITOU MASANORI , URUGA KENICHI
IPC分类号： H01C17/22 , H01C7/22
摘要： PURPOSE:To adjust a resistance value in a simple manner without redesigning a circuit in accordance with the requirement of change in resistance value of a resistance circuit substrate by a method wherein the length of a low resistance conductive circuit, which is connected to a connection terminal is increased or decreased within the extent wherein the temperature of the connection terminal is not raised, and the conductive circuit is printed and sintered. CONSTITUTION:The resistance value of the title resistance circuit substrate becomes R1 when terminal parts 1-1 and 1-2 are selected, the resistance value R1+R2 is obtained when terminal parts 1-1 to 1-4 are selected, and the resistance value R1+R2+R3 is obtained when terminal parts 1-1 to 1-3 are selected. When it is necessary to change the above-mentioned resistance value, a low resistance conductor is printed and sintered on a part of the resistance circuit, or a conductive circuit 4 is printed and sintered linking to the conductive circuit provided in order to prevent the temperature rise of the terminal part, and the resistance value is reduced, or the resistance value is increased by reducing the length of the conductive circuit 2 to the extent with which the temperature rise of the terminal parts 1-1, 1-2, 1-3 and 1-4 can be prevented, and the resistance value is increased.

8. 发明专利

JPH02232983A ENAMELED BOARD PROVIDED WITH INSERTION TERMINAL AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH02232983A
公开(公告)日：1990-09-14
申请号：JP5351589
申请日：1989-03-06
申请人： FUJIKURA LTD
发明人： SUZUKI TAKAO , YAJIMA KIYOSHI , ITOU MASANORI , URUGA KENICHI , OKUYAMA HITOSHI
IPC分类号： H05K1/05 , H05K1/11 , H05K3/40 , H05K3/44
摘要： PURPOSE:To prevent enamel baked on a board from protruding so as to improve it in insertability by a method wherein the tip of a metal core of a terminal is subjected to a specified tapering process. CONSTITUTION:A part 6, shaped with slant lines, adjacent to the tip of an insertion terminal 5 is removed through punching leaving the tip of the terminal 5. Then, the tips 7 of the terminals 5 shaded with slant lines are pressed down in a lengthwise direction and flattened to be tapered. At this time, burrs occur around the tips 7. Lastly, the whole board 4 is punched out with the occurred burrs at the same time (a shaded part 8 is removed through punching) to obtain a metal core 1 of an enameled board. By this setup, the tip of the metal core 1 is tapered in a thicknesswise direction up to the range of 1.0-3.0mm so as to be as thick as 0.10-0.30mm, an enamel layer 2 on a fitting insertion terminal is prevented rom swelling, and an enameled board of this design can be smoothly inserted in to a connector.

9. 发明专利

JPH02144821A FUSE FORMATION 失效
公开(公告)号：JPH02144821A
公开(公告)日：1990-06-04
申请号：JP29610088
申请日：1988-11-25
申请人： FUJIKURA LTD
发明人： ITOU MASANORI , SUZUKI TAKAO , YAJIMA KIYOSHI
IPC分类号： H05K1/02 , H01H85/00 , H01H85/02 , H01H85/143 , H05K3/34
摘要： PURPOSE:To carry out fuse formation efficiently by laminating a low temperature solder and a high temperature solder and heating the solders at a middle temperature to melt only the low temperature solder. CONSTITUTION:A solder paste 3 of an eutectic solder is printed on both ends 2 of a conductive circuit and a plate solder 4 is mounted on the solder paste 3. The circuit board is then placed on a belt of a belt furnace and heated. The solder paste is thus melted and the upper solder plate 4 is soldered to the conductive circuit 2. Like this, since heating is carried out at a temperature between the melting points of the low melting point metal and the high melting point metal, only the low melting point metal 3 is melted and one side of the solder 3 is connected with the conductive circuit 2 and the other side is connected to the high melting point metal 4, and as a result, circuit is formed efficiently.

10. 发明专利

JPH0240987A ENAMELED SUBSTRATE 失效
公开(公告)号：JPH0240987A
公开(公告)日：1990-02-09
申请号：JP19070388
申请日：1988-08-01
申请人： FUJIKURA LTD
发明人： YAJIMA KIYOSHI , NAKAMOTO MITSUSACHI , SUZUKI TAKAO , ITOU MASANORI
IPC分类号： H05K1/05 , H05K7/14 , H05K7/20
摘要： PURPOSE:To prevent the cracking of enamel easily while improving heat dissipating properties by coating the required section of an enameled substrate with a resin containing a specified silicone rubber. CONSTITUTION:A contact surface with a clamping member of an enameled substrate is coated with a resin layer including an silicone rubber having high heat resistance and being filled with filler powder having high thermal conductivity. The cracking of enamel is prevented without accurately controlling clamping torque by the resin layer while improving heat dissipating properties without using heat-resistant plastics, etc.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式