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1. 发明专利

JPS6451873A CAMERA 失效
公开(公告)号：JPS6451873A
公开(公告)日：1989-02-28
申请号：JP20990087
申请日：1987-08-24
申请人： FUJI PHOTO FILM CO LTD
发明人： TAJIMA HIDEKAZU
IPC分类号： G03B17/00 , H04N5/225
摘要： PURPOSE:To prevent the generation of a discharge noise etc., that erroneously operate an electronic circuit by discharging constantly a charge electrostatically charged in a camera to a human body. CONSTITUTION:In the camera incorporating the electronic circuit, a conductive member 46 is disposed on the surface of the camera so as to bring into contact with the human body at least at the time of photographing and the conductive member is electrically connected to a ground part in the camera in the electronic circuit. At the time of holding a grip part at the time of photographing, since the hand and fingers frequently bring into contact with the conductive rubber 46 of the bottom part of the grip part, the charge electrostatically charged in the camera is discharged to the human body through the conductive rubber 46. Thereby, the large quantity of the charge is not charged in the camera to prevent the generation of the discharge noise erroneously operating the electronic circuit in the camera.

2. 发明专利

JPH0991939A SIGNAL RECORDING/REPRODUCING DEVICE 失效
公开(公告)号：JPH0991939A
公开(公告)日：1997-04-04
申请号：JP24447695
申请日：1995-09-22
申请人： FUJI PHOTO FILM CO LTD
发明人： KATO YOSHIAKI , HIRATA HIDETOSHI , MIZUNO MASAHIKO , TAJIMA HIDEKAZU
IPC分类号： G03B17/02 , G11B33/12 , H01L23/36 , H04N5/225 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To suppress the temperature increase of an equipment inexpensively and efficiently without using any special parts such as a thermoelectric converter and a radiation board. SOLUTION: A signal recording/reproducing device includes a multilayer substrate 62 where, for example, semiconductor integrated circuits 64 and 66 with a large power consumption are packaged, and the multilayer substrate 62 is stored in an armor case made of a main constitute of organic resin. Then, for example, the distance between the armor case and the multilayer substrate 62 and the packaging position of the semiconductor integrated circuits 64 and 66 with a large power consumption are carefully considered to prevent heat generated from the semiconductor integrated circuits 64 and 66 from greatly affecting the armor case.

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