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    • 2. 发明专利
    • STRUCTURE OF FROG TYPE HEAT RECEIVER/DISSIPATOR AND ITS APPLICATION METHOD
    • JP2002110868A
    • 2002-04-12
    • JP2000331464
    • 2000-09-26
    • TS HEATRONICS CO LTD
    • AKACHI HISATERU
    • H01L23/36
    • PROBLEM TO BE SOLVED: To provide a structure of a frog type heat receiver/dissipator, and its application method, in which heat receiving/dissipating efficiency can be enhanced remarkably. SOLUTION: The frog type heat receiver/dissipator is constructed to provide a convection control air duct having a main convection channel between fin groups and a sub-convection channel proximate thereto. The sub-convection channel has a specified cross-sectional area including zero and such an arranging method as a fresh convection current is introduced constantly into a heat receiver/dissipator from the outside thereof is employed. When the cross-sectional area of the sub-convection channel is zero in the convection control air duct, loss convection of a frog type heat sink group having an appropriate fin density decreases approximately to zero and the efficiency of the heat receiver/dissipator is increased remarkably. In case of a heat receiver/dissipator having an excessively high fin density, fluid resistance of main convection is lowered significantly by selecting the cross-sectional area of the sub-convection channel and the efficiency of the heat receiver/dissipator is increased remarkably. When a plurality of frog type heat receivers/dissipators are applied in the same apparatus, only a fresh convection current is introduced into each heat receiver/dissipator by arranging each heat receiver/dissipator while inclining against the convection current and lowering of heat receiving/dissipating efficiency due to thermal interference is eliminated.
    • 6. 发明专利
    • HEAT DIFFUSING COMPOSITE PLATE
    • JP2001177024A
    • 2001-06-29
    • JP36294499
    • 1999-12-21
    • TS HEATRONICS CO LTD
    • AKACHI HISATERU
    • H05K7/20F28D9/00F28D15/02F28F21/02H01L23/36H01L23/373
    • PROBLEM TO BE SOLVED: To provide a thermodiffusion heat transfer plate which is capable of efficiently and uniformly diffusing and transferring a large amount of heat supplied from a heating element onto the heat receiving plane of a heat dissipat ing means. SOLUTION: A heat diffusing composite plate is composed of a center layer 1 and metal thin films 1 each smaller than 10 μm in thickness and deposited on the center layer 1 sandwiching it between them. The center layer 1 is formed of very pure graphite which is very high in thermal conductivity along its surface but comparatively low in thermal conductivity in its thickness direction. The metal thin film 2 is deposited on the surface of the center layer 1 through a prescribed method such as a plasma ion chemical deposition method, a plasma ion physical deposition method or the like which keeps a deposit very high in bonding strength to the center layer 1. The heat diffusing composite plate is capable of effectively taking advantage of the high thermal conductivity of graphite and enhanced in mechanical strength.
    • 7. 发明专利
    • LATTICE TYPE HEAT PIPE
    • JP2001165582A
    • 2001-06-22
    • JP34455399
    • 1999-12-03
    • TS HEATRONICS CO LTD
    • AKACHI HISATERU
    • F28D15/02
    • PROBLEM TO BE SOLVED: To provide a light weight plate heat pipe, having even heat diffusing performance in all directions, facilitated in the actual mounting of a heat generating body or the heat pipe itself, abundant in flexibility and having no posture dependence. SOLUTION: A plurality of meandering fine groove plates 2, 3, whose one side is provided with a meandering fine groove, are connected to the front surface 1-1 and the rear surface 1-2 of a thin metallic common plate 1 while retaining a predetermined space. Respective meandering fine groove plates 2, 3 are arranged in the shape of a lattice while being intersected with each other by a predetermined intersecting angle (90 deg., for example) through the common plate 1. Meandering fine-diameter tunnels are formed of a surface connection between the common plate 1 and the meandering fine grooves of both of the plates 2, 3 while operating liquid is sealed into the fine tunnels whereby the plate heat pipe is constituted.