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1. 发明专利

JP2007157921A Device and method for processing substrate 审中-公开
标题翻译：用于处理基板的装置和方法
公开(公告)号：JP2007157921A
公开(公告)日：2007-06-21
申请号：JP2005349440
申请日：2005-12-02
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MORISAWA SHINYA , SHIRAKASHI MICHIHIKO , KATAKABE ICHIRO , ITO KENYA , MAEDA KAZUAKI , KAMEZAWA KAORU , TOMITA HIROSHI
IPC分类号： H01L21/304 , H01L21/027 , H01L21/306 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing method, wherein two or more kinds of substrates to be processed can be processed with the same substrate processing device avoiding reverse contamination without using two or more substrate processing devices, and a processing liquid can be improved in recovery efficiency by using a roller groove corresponding to the processing liquid. SOLUTION: The substrate processing device is equipped with three or more roller members 11 which are arranged on a plane to chuck the periphery of the disc-shaped substrate W to be processed, a roller rotation drive mechanism 12 which rotates, at least, one or more of the roller members 11, a substrate surface processing nozzle 16 which supplies a processing liquid to the surface and/or the rear of the substrate W to be processed, and others. Two or more roller grooves 11a which are engaged with the periphery of the substrate W are provided to the roller member 11 in a vertical direction at a prescribed pitch, or the roller members 11 each provided with the roller groove 11a are provided at a prescribed pitch in a vertical direction. Furthermore, the device is provided with a cleaning nozzle 17 that cleans the grooves 11a, and a suction nozzle 18 which sucks up processing liquid attaching to the insides of the grooves 11a. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种基板处理装置和基板处理方法，其中可以使用相同的基板处理装置处理两种或更多种待处理的基板，以避免反向污染，而不使用两个或更多个基板处理装置通过使用与处理液对应的滚子槽，能够提高处理液的回收效率。解决方案：基板处理装置配备有三个或更多个辊构件11，其被布置在平面上以卡紧待处理的盘形基板W的周边;辊旋转驱动机构12，至少旋转，一个或多个辊构件11，将处理液体供给到待处理的基板W的表面和/或后部的基板表面处理喷嘴16等。将两个以上的与基板W的周边接合的滚子槽11a以规定的间距在垂直方向上设置到滚子部件11，或者设置有滚子槽11a的滚子部件11以规定间距在垂直方向。此外，该装置设置有清洁槽11a的清洁喷嘴17和吸附附着到槽11a的内部的处理液的吸嘴18。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2008013851A Rotary holding apparatus and semiconductor substrate-processing apparatus 审中-公开
标题翻译：旋转保持装置和半导体基板处理装置
公开(公告)号：JP2008013851A
公开(公告)日：2008-01-24
申请号：JP2007186358
申请日：2007-07-17
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONGO AKIHISA , KATAKABE ICHIRO , MORISAWA SHINYA
IPC分类号： C25D19/00 , C25D7/12 , C25D17/00 , H01L21/288 , H01L21/304 , H01L21/306 , H01L21/3205 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor substrate-processing apparatus which can reduce the initial and running costs of the apparatus, requires a small installation space, can form a circuit wiring with copper or a copper alloy in a short processing time and prevents a copper film from remaining at an edge/bevel, which causes cross-contamination. SOLUTION: The semiconductor substrate-processing apparatus has a rotary member that rotates around a rotation axis and a plurality of holding members which are arranged along a circle having a center corresponding to the rotation axis of the rotary member and which rotate along with the rotary member, wherein the holding members each has a washing unit for washing a semiconductor substrate held by a rotary holding apparatus that rotates around an axial center of the holding member. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够降低设备的初始和运行成本的半导体衬底处理设备，需要较小的安装空间，可以在短的处理时间内形成具有铜或铜合金的电路布线并防止铜膜残留在边缘/斜面上，导致交叉污染。解决方案：半导体基板处理装置具有围绕旋转轴线旋转的旋转部件和沿着具有与旋转部件的旋转轴线对应的中心的圆周配置的多个保持部件，旋转构件，其中保持构件各自具有用于清洗由围绕保持构件的轴向中心旋转的旋转保持装置保持的半导体衬底的洗涤单元。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2004221261A Processing method of semiconductor substrate 有权
公开(公告)号：JP2004221261A
公开(公告)日：2004-08-05
申请号：JP2003006016
申请日：2003-01-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ONO HARUKO , TAKEDA SACHIKO , KATAKABE ICHIRO
IPC分类号： H01L21/3205 , B44C1/22 , C09G1/02 , H01L21/308 , H01L21/321 , H01L21/3213 , H01L21/768
CPC分类号： H01L21/32134 , C09G1/02 , H01L21/32115 , H01L21/7684
摘要： PROBLEM TO BE SOLVED: To provide a process for etching a barrier metal film at a temperature of about the room temperature without applying mechanical load and excessively etching copper of a necessary part.
SOLUTION: In the processing method, etching liquid is used where etching velocity ratio to copper and barrier metal is adjustable, when a copper film and a barrier metal film are smoothed, in a substrate from which the films are exposed.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2004273961A Cleaning device of metal wiring forming substrate 审中-公开
公开(公告)号：JP2004273961A
公开(公告)日：2004-09-30
申请号：JP2003065845
申请日：2003-03-12
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KODERA MASAKO , ITO KENYA , KAMEZAWA MASAYUKI , HAMADA TOSHIMI , KATAKABE ICHIRO
IPC分类号： H01L23/52 , B08B1/04 , B08B3/02 , B08B3/04 , B08B3/08 , B08B3/12 , C23G3/00 , H01L21/00 , H01L21/302 , H01L21/304 , H01L21/3205
CPC分类号： H01L21/67173 , B08B1/04 , B08B3/02 , B08B3/04 , B08B3/08 , B08B3/12 , C23G3/00 , H01L21/67046 , H01L21/67051 , H01L21/67057 , H01L21/67219
摘要： PROBLEM TO BE SOLVED: To provide a cleaning device to restrict a corrosion of a wiring formed of aluminium or its alloy on a substrate.
SOLUTION: The cleaning device of this metal wiring forming substrate has a grasping mechanism for holding the substrate, a cleaning mechanism for cleaning the substrate and a functional water supply mechanism. A surface of the substrate is cleaned with the functional water supplied from the functional water supply mechanism to the cleaning mechanism.
COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2004235216A Substrate processor and substrate processing method 有权
标题翻译：基板处理器和基板处理方法
公开(公告)号：JP2004235216A
公开(公告)日：2004-08-19
申请号：JP2003018792
申请日：2003-01-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAJITA SHINJI , KATAKABE ICHIRO , ONO HARUKO , INOUE KATSUTAKA , TAKEDA SACHIKO
IPC分类号： H01L21/306 , H01L21/00 , H01L21/304
CPC分类号： H01L21/67051
摘要： PROBLEM TO BE SOLVED: To prevent contamination of a substrate due to a substrate processing liquid, mist and the like, and to make continuously performable a series of chemical processings including spin drying of the substrate with the same device.
SOLUTION: The processor is provided with a substrate holder 16 holding and rotating the substrate, a spatter prevention cup 18 surrounding a periphery of the substrate W held by the substrate holder 16 and preventing spatter of substrate processing liquid supplied to the substrate W, and a scattering prevention cup cleaning part 44 cleaning the inner wall face of the scattering prevention cup 18. The scattering prevention cup 18 can freely move upward/downward among a lower substrate transfer position, an upper scattering prevention position and a cleaning position between them.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：为了防止由于基板处理液体，雾等引起的基板的污染，并且使得能够连续地执行一系列化学处理，包括用相同的装置旋转基板的干燥。解决方案：处理器设置有保持和旋转基板的基板保持器16，围绕由基板保持器16保持的基板W的周边的防溅杯18，并防止提供给基板W的基板处理液的飞溅以及清除散射防止杯18的内壁面的散射防止杯清洁部44.防散射杯18可以在下基板转印位置，上部散射防止位置和它们之间的清洁位置之间自由移动。版权所有（C）2004，JPO＆NCIPI

6. 发明专利

JP2004084056A Electroless plating apparatus and post-electroless plating cleaning method 有权
公开(公告)号：JP2004084056A
公开(公告)日：2004-03-18
申请号：JP2003024944
申请日：2003-01-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATAKABE ICHIRO , INOUE KATSUTAKA , O CHIKAAKI , TAKAGI DAISUKE
IPC分类号： B08B1/04 , C23C18/16 , C23C18/32 , H01L21/00 , H01L21/288 , H01L21/304
CPC分类号： H01L21/67051 , B08B1/04 , C23C18/1632 , C23C18/1689 , C23C18/1893 , C23C18/32 , C23C18/50 , H01L21/67046
摘要： PROBLEM TO BE SOLVED: To provide a technique for removing particles of Co and Ni produced by electroless plating and present on a silicon thermal oxidation film after formation of Cu wiring without affecting the wiring. SOLUTION: An electroless plating apparatus where electroless plating is applied to the surface of wiring in an electronic circuit substrate formed with fine circuit patterns by electroconductive metal wiring is provided with: a substrate transfer means; a loading station arranged in association with the substrate transfer means; one or more electroless plating cells 5 arranged in association with the substrate transfer apparatuses 3a, 3b and 3c; and cleaning devices 6 and 7 arranged in association with the substrate transfer apparatuses and performing cleaning in which cleaning members move to the same direction to scrub substrate surfaces, or cleaning in which the cleaning members rotationally move to a horizontal direction to scrub the substrate surfaces and/or solution cleaning. The particles of Co and Ni produced by electroless plating are removed without affecting the wiring. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2005109362A Processing liquid, and substrate processing method and apparatus using processing liquid 审中-公开
标题翻译：处理液和基板处理方法和使用处理液的装置
公开(公告)号：JP2005109362A
公开(公告)日：2005-04-21
申请号：JP2003343875
申请日：2003-10-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATAKABE ICHIRO , FUKUNAGA AKIRA , INOUE KATSUTAKA
IPC分类号： C23C18/16 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a processing liquid and a substrate processing method and apparatus using the processing liquid whereby any water mark can be suppressed from being formed on the surface of a low-permittivity material (low-k material).
SOLUTION: The processing liquid is the one for processing the substrate wherein a low-permittivity material is exposed to the external at least in a portion of the surface thereof. The processing liquid has at least a hydrophilic group and a hydrophobic group respectively in its one molecule, and includes an organic substance having volatility at a room temperature.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种处理液和使用该处理液的基板处理方法和设备，从而可以抑制在低介电常数材料（低k材料）的表面上形成任何水痕。解决方案：处理液体是用于处理基板的处理液体，其中低介电常数材料至少在其表面的一部分中暴露于外部。处理液体在其一个分子中分别具有至少亲水基团和疏水基团，并且包括在室温下具有挥发性的有机物质。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2006004955A Substrate processing apparatus and substrate processing method 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2006004955A
公开(公告)日：2006-01-05
申请号：JP2004158716
申请日：2004-05-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HAMADA TOSHIMI , KONO MICHIHISA , KATAKABE ICHIRO , SHIMA SHOHEI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for rapidly and reliably drying a substrate by drying process that is performed after wet washing process, and to quickly remove an unneeded thin film formed at and adhered to the bevel and edge sections of the substrate while obtaining a steel slope edge profile even if the film is hard, and to restrain surface roughness at the bevel and edge sections after removing the unneeded thin film. SOLUTION: The substrate processing apparatus comprises a substrate holder 22 for retaining the substrate W; and dry gas supply sections 32, 36 for setting an atmosphere in which at least one portion of the surface of the substrate W retained by a substrate holder 22 is exposed to a dry gas atmosphere whose moisture is controlled. The substrate processing system comprises a polishing apparatus for polishing the thin film formed at and adhered to the bevel and edge sections of the substrate; and an etching device for removing the thin film remaining at the bevel and edge sections of the substrate after polishing by the polishing apparatus by etching. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种基板处理装置，用于通过在湿式洗涤处理之后进行的干燥工艺快速且可靠地干燥基板，并且快速地除去形成在并附着到斜边部分和边缘部分上的不需要的薄膜同时获得钢倾斜边缘轮廓，即使该膜是硬的，并且在去除不需要的薄膜之后抑制斜面和边缘部分处的表面粗糙度。解决方案：基板处理装置包括用于保持基板W的基板保持件22; 以及干燥气体供给部32,36，其设定由基板保持件22保持的基板W的表面的至少一部分暴露于控制了湿度的干燥气体环境的气氛。基板处理系统包括用于抛光在基板的斜边和边缘部分上形成并粘附到薄膜上的薄膜的抛光装置; 以及蚀刻装置，用于通过蚀刻在研磨装置进行研磨之后，去除残留在基板的斜面和边缘部分的薄膜。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2002170802A METHOD AND ITS APPARATUS FOR CLEANING SUBSTRATE 失效
公开(公告)号：JP2002170802A
公开(公告)日：2002-06-14
申请号：JP2000307812
申请日：2000-10-06
申请人： EBARA CORP
发明人： KATAKABE ICHIRO , MORISAWA SHINYA , ONO HARUKO , KIHARA SACHIKO , FUKUNAGA AKIRA
IPC分类号： B08B3/02 , B08B3/08 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus for cleaning substrate by which an edge cut width can be freely set, native oxide in a circuit forming region on the surface of the substrate can be prevented from growing and wiring materials of copper or the like adhered on the back side of the substrate can be surely removed. SOLUTION: An acid solution is supplied continuously on the center of the surface of the substrate W while the substrate W is being rotated, and then an oxidizing reagent solution is supplied continuously or intermittently on the circumference of the substrate W.

10. 发明专利

JP2002050606A SUBSTRATE RINSE LIQUID AND SUBSTRATE TREATMENT METHOD 失效
公开(公告)号：JP2002050606A
公开(公告)日：2002-02-15
申请号：JP2000233252
申请日：2000-08-01
申请人： EBARA CORP
发明人： ONO HARUKO , FUKUNAGA AKIRA , KATAKABE ICHIRO , KIHARA SACHIKO
IPC分类号： B24B57/02 , B24B37/00 , C11D7/26 , C11D7/32 , C11D7/60 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide substrate rinse liquid which restrains attaching of metals during ultra-pure water rinse of a substrate, where a metallic wiring is formed, and to provide a substrate washing treatment method for restraining attaching of the metals. SOLUTION: The substrate rinse liquid consists of ultra-pure water, comprising chelating agent of free acid or ammonium salt at 100 mg/L or less. After a treatment including a process for making chemical or abrasive liquid function is performed for the surface of a substrate, the substrate is rotated and rinse treatment for removing chemical or contaminant from the surface is applied by means of substrate rinse liquid consisting of ultra-pure water comprising chelating agent of free acid or ammonium salt.

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