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1. 发明专利

JP2008156558A High adhesion copolymerized polyimide film 审中-公开
标题翻译：高粘度共聚聚酰亚胺膜
公开(公告)号：JP2008156558A
公开(公告)日：2008-07-10
申请号：JP2006349575
申请日：2006-12-26
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SUEHIRO MORITSUGU , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , C08G73/10 , C08J7/00
摘要： PROBLEM TO BE SOLVED: To provide a high adhesion copolymerized polyimide film having improved adhesiveness to a copper foil and excellent dimensional stability and water wettability.
SOLUTION: The high adhesion copolymerized polyimide film having a 200°C heat-shrinkage of ≤0.05% in both machine transportation direction (MD) and transverse direction (TD), a film surface roughness Ra of ≥0.065 μm and Rmax of ≥1.0 μm measured by a stylus-type surface roughness tester and a surface free energy of ≥80 mN/m measured by a contact angle method is produced from a polyimide film derived from p-phenylenediamine, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride by successively applying a sand-matting treatment, a relaxation treatment and a plasma treatment to the polyimide film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改善的对铜箔的粘附性的高粘合性共聚聚酰亚胺膜和优异的尺寸稳定性和水润湿性。解决方案：在机器输送方向（MD）和横向（TD）上具有≤0.05％的200℃热收缩率的高粘合性共聚聚酰亚胺膜，≥0.065μm的膜表面粗糙度Ra和≥0.065μm的Rmax 通过触针式表面粗糙度测定仪测量的≥1.0μm，通过接触角法测量的≥80mN/ m的表面自由能由衍生自对苯二胺，4,4'-二氨基二苯醚和均苯四酸酯的聚酰亚胺膜通过对聚酰亚胺膜进行沙粒处理，松弛处理和等离子体处理来制备二酐。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008106139A Polyimide film and method for producing the same 审中-公开
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：JP2008106139A
公开(公告)日：2008-05-08
申请号：JP2006290150
申请日：2006-10-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , TESHIBA TOSHIHIRO
IPC分类号： C08L79/08 , C08K3/00
CPC分类号： C08G73/1042 , C08J5/18 , C08J2379/08 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/0266
摘要： PROBLEM TO BE SOLVED: To obtain a polyimide film that has excellent running properties, adhesiveness and dimensional stability of a film and is applicable to an automatic optical inspection system (AOI) of a flexible printed circuit board (FPC) or a chip-on-film (COF) and to provide a method for producing the same.
SOLUTION: The polyimide film is produced mainly by imidation from p-phenylenediamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic acid dianhydride and 3,3', 4,4'-biphenyltetracarboxylic acid dianhydride as acid dianhydride components and comprises 0.1-0.9 wt.% based on the weight of a film resin of inorganic particles, having particle diameters in a range of 0.01-1.5 μm, an average particle diameter of 0.05-0.7 μm and a particle size distribution in which ≥80 vol.% based on the total particles of inorganic particles having particle diameters of 0.15-0.60 μm, dispersed into the film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有优异的运行性能，粘合性和膜的尺寸稳定性的聚酰亚胺膜，并且可应用于柔性印刷电路板（FPC）或芯片的自动光学检测系统（AOI） - 膜（COF），并提供其制造方法。解决方案：聚酰亚胺膜主要通过由对苯二胺和4,4'-二氨基二苯醚作为二胺组分和均苯四酸二酐和3,3'，4,4'-联苯四羧酸二酐作为酸二酐组分的酰亚胺化产生相对于无机粒子的薄膜树脂的重量为0.1〜0.9重量％，粒径为0.01〜1.5微米，平均粒径为0.05〜0.7微米，粒径分布为≥80 基于分散在膜中的粒径为0.15-0.60μm的无机颗粒的总颗粒的体积％。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008106138A Polyimide film and method for producing the same 审中-公开
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：JP2008106138A
公开(公告)日：2008-05-08
申请号：JP2006290149
申请日：2006-10-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , TESHIBA TOSHIHIRO
IPC分类号： C08L79/08 , C08J5/18 , C08K3/00 , H05K1/03
CPC分类号： C08L79/08 , C08J5/18 , C08J2379/08 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/0266
摘要： PROBLEM TO BE SOLVED: To obtain a polyimide film that is obtained by addition of inorganic microscopic particles, does not expose inorganic powder, produces surface projections in a state uniformly dispersed in a film, controls a surface state, has running properties, adhesiveness of film and heat resistance applicable to an automatic optical inspection system (AOI) of a flexible printed circuit board (FPC) or a chip-on-film (COF) and to provide a method for producing the same.
SOLUTION: The polyimide film comprises 0.1-0.9 wt.% based on the weight of a film resin of inorganic particles, having particle diameters in a range of 0.01-1.5 μm, an average particle diameter of 0.05-0.7 μm and a particle size distribution in which ≥80 vol.% based on the total particles of inorganic particles having particle diameters of 0.15-0.60 μm, dispersed into the film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了获得通过添加无机微粒而获得的聚酰亚胺膜，不暴露无机粉末，以均匀分散在膜中的状态产生表面突起，控制表面状态，具有运行特性，适用于柔性印刷电路板（FPC）或薄膜（COF）的自动光学检查系统（AOI）的膜的粘合性和耐热性，并提供其制造方法。解决方案：基于无机颗粒的膜树脂的重量，聚酰亚胺膜包含0.1-0.9重量％的粒径，其粒径在0.01-1.5μm的范围内，平均粒径为0.05-0.7μm，和粒度分布，其中分散在膜中的基于粒径为0.15-0.60μm的无机颗粒的总颗粒的≥80体积％。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008001793A Polyimide film and its manufacturing process 审中-公开
标题翻译：聚酰亚胺薄膜及其制造工艺
公开(公告)号：JP2008001793A
公开(公告)日：2008-01-10
申请号：JP2006172400
申请日：2006-06-22
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , B29C59/00
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having an excellent easy-to-slip characteristic which reduces the adhesion of the films at the hinges in laminating multilayer boards with a heat press and solves the problem of "squeaking" noises made by the films rubbed with each other and its manufacturing process.
SOLUTION: The polyimide film has streaky ruggedness the distances between the tops and the bottoms of which are in the range of 0.05-10 μm on the surface. The maximum distance Ry between the tops and the bottoms of the streaky ruggedness is in the range of 4-10 μm. The surface roughness Rz of the film is 0.7-8 μm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的易滑动特性的聚酰亚胺膜，其在热压机的层压多层板中降低了铰链处的膜的粘附性，并且解决了产生“吱吱”的噪音的问题由电影相互摩擦及其制造过程。
解决方案：聚酰亚胺薄膜的表面上的顶部和底部之间的距离在0.05-10μm的范围内具有条纹粗糙度。条纹坚固性的顶部和底部之间的最大距离Ry在4-10μm的范围内。膜的表面粗糙度Rz为0.7〜8μm。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007138058A Highly adhesive polyimide film and method for manufacturing the same 审中-公开
标题翻译：高粘性聚酰亚胺膜及其制造方法
公开(公告)号：JP2007138058A
公开(公告)日：2007-06-07
申请号：JP2005335436
申请日：2005-11-21
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO , SUEHIRO MORITSUGU
IPC分类号： C08J7/00 , C08G73/10 , C09J5/02 , C09J7/00 , C09J179/08
摘要： PROBLEM TO BE SOLVED: To provide a highly adhesive polyimide film, especially a polyimide film which shows an improved adhesion to a copper foil and is excellent in dimensional stability and water wettability, and a method for manufacturing the same. SOLUTION: The highly adhesive polyimide film is obtained by forming a polyimide film from paraphenylenediamine (PPD), 4,4'-diaminodiphenyl ether (ODA), pyromellitic dianhydride (PMDA) and 3,3', 4,4'-biphenyltetracarboxylic dianhydride (BPDA), subjecting the polyimide film to relaxation and further subjecting it to sandblasting and a plasma treatment. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种高粘合性聚酰亚胺膜，特别是显示出对铜箔的粘合性提高并且尺寸稳定性和水润湿性优异的聚酰亚胺膜及其制造方法。解决方案：通过从对苯二胺（PPD），4,4'-二氨基二苯醚（ODA），均苯四酸二酐（PMDA）和3,3'，4,4'-二氨基二苯醚联苯四羧酸二酐（BPDA），使聚酰亚胺薄膜松弛并进一步进行喷砂处理和等离子体处理。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2005314669A Polyimide film and copper-clad laminate using the same as substrate 审中-公开
标题翻译：聚酰亚胺膜和铜箔层压板，使用其作为基板
公开(公告)号：JP2005314669A
公开(公告)日：2005-11-10
申请号：JP2005088334
申请日：2005-03-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , B32B15/08 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having excellent dimensional stability and suitable for a substrate for a fine pitch circuit board, especially a COF (chip on film) wired at a narrow pitch in the film width direction and to provide a copper-clad laminate using the same film as a substrate.
SOLUTION: The polyimide film is characterized as having 3-10 ppm/°C coefficient of thermal expansion α
MD in the mechanical transporting direction (MD) of the film and 10-20 ppm/°C coefficient of thermal expansion α
TD in the transverse direction (TD). The copper-clad laminate is characterized in that the copper of 1-10 μm thickness is formed on the polyimide film as the substrate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题：提供一种尺寸稳定性优异的聚酰亚胺膜，适用于细间距电路基板，特别是薄膜宽度方向的窄间距配线的COF（膜上胶片）的基板，使用与基板相同的膜的覆铜层压板。解决方案：聚酰亚胺膜的特征在于膜的机械传送方向（MD）为3-10ppm /℃的热膨胀系数α MD ，10-20ppm /° 热膨胀系数α TD 横向（TD）。覆铜层压板的特征在于，在作为基板的聚酰亚胺膜上形成有1-10μm厚度的铜。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2008156557A High adhesion copolymerized polyimide film 审中-公开
标题翻译：高粘度共聚聚酰亚胺膜
公开(公告)号：JP2008156557A
公开(公告)日：2008-07-10
申请号：JP2006349574
申请日：2006-12-26
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SUEHIRO MORITSUGU , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , C08G73/10 , C08J7/00 , C08K3/00 , C08L79/08 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a high adhesion copolymerized polyimide film having improved adhesiveness to a copper foil and excellent slipperiness, dimensional stability and water wettability.
SOLUTION: The high adhesion copolymerized polyimide film having a 200°C heat-shrinkage of ≤0.05% in both machine transportation direction (MD) and transverse direction (TD), a film surface roughness Ra of ≥0.065 μm and Rmax of ≥1.0 μm measured by a stylus-type surface roughness tester and a surface free energy of ≥80 mN/m measured by a contact angle method is produced from a polyimide film derived from p-phenylenediamine, 4,4'-diaminodiphenyl ether, pyromellitic dianhydride and 3,3', 4,4'-biphenyltetracarbopxylic acid dianhydride and containing inorganic particles by successively applying a sand-matting treatment, a relaxation treatment and a plasma treatment to the polyimide film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改善的对铜箔的粘合性和优异的滑爽性，尺寸稳定性和水润湿性的高粘合性共聚聚酰亚胺膜。解决方案：在机器输送方向（MD）和横向（TD）上具有≤0.05％的200℃热收缩率的高粘合性共聚聚酰亚胺膜，≥0.065μm的膜表面粗糙度Ra和≥0.065μm的Rmax 通过触针型表面粗糙度测定器测量的≥1.0μm，通过接触角法测量的≥80mN/ m的表面自由能由衍生自对苯二胺，4,4'-二氨基二苯醚，均苯四酸二酐和3,3'，4,4'-联苯四丙二酸二酐，并通过对聚酰亚胺膜进行沙粒处理，松弛处理和等离子体处理而含有无机颗粒。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008144051A Highly adhesive polyimide film and method for producing the same 审中-公开
标题翻译：高粘性聚酰亚胺膜及其制造方法
公开(公告)号：JP2008144051A
公开(公告)日：2008-06-26
申请号：JP2006333211
申请日：2006-12-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO , SUEHIRO MORITSUGU
IPC分类号： C08J5/18 , C08G73/10 , C08J7/00
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having improved adhesiveness to a copper foil and excellent easy slipperiness, dimensional stability and water wettability and to provide a method for producing the polyimide film.
SOLUTION: The highly adhesive polyimide film is a polyimide film formed from p-phenylenediamine, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride and comprising inorganic particles. The polyimide film has ≤0.05% heat shrinkage percentage at 200°C in both the mechanical transporting direction (MD) and the width direction (TD) of the film, ≥0.065 μm surface roughness Ra and ≥1.0 μm Rmax measured with a stylus type surface roughness meter, ≤1.0 coefficient of static friction and ≥80 mN/m surface free energy measured on the basis of a contact angle method.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改善的对铜箔的粘附性的聚酰亚胺膜和优异的易滑性，尺寸稳定性和水润湿性，并提供一种聚酰亚胺膜的制造方法。解决方案：高度粘合的聚酰亚胺膜是由对苯二胺，4,4'-二氨基二苯醚和均苯四酸二酐形成并包含无机颗粒的聚酰亚胺膜。聚酰亚胺膜在膜的机械输送方向（MD）和宽度方向（TD）的200℃下的热收缩率≤0.05％，表面粗糙度Ra≥0.065μm，用触针型测定的≥1.0μmRmax 表面粗糙度计，≤1.0静摩擦系数和≥80mN / m表面自由能测量基于接触角法。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008144049A Polyimide film for forming, method for producing the same and formed product 审中-公开
标题翻译：用于成型的聚酰亚胺膜，其制造方法和成型产品
公开(公告)号：JP2008144049A
公开(公告)日：2008-06-26
申请号：JP2006333208
申请日：2006-12-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , C08G73/10 , F21V7/22
摘要： PROBLEM TO BE SOLVED: To provide a lightweight polyimide film for forming having excellent surface smoothness, safety, formability, heat resistance and handleability and suitable as a reflector substrate for lighting equipment.
SOLUTION: The polyimide film for forming is a film composed of a thermoplastic polyimide obtained by reacting an aromatic tetradicarboxylic dianhydride with an aromatic diamine. The polyimide film for forming is characterized in that the minimum viscoelasticity of the storage modulus (E') of the viscoelasticity is ≤10
8 Pa and the tensile elongation at the glass transition temperature (E") A is ≥150%.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的表面平滑度，安全性，成形性，耐热性和可操作性的轻型聚酰亚胺膜，并且适合作为照明设备的反射器基板。解决方案：用于形成的聚酰亚胺膜是由芳族四羧酸二酐与芳族二胺反应获得的热塑性聚酰亚胺构成的膜。用于成型的聚酰亚胺膜的特征在于，粘弹性的储能模量（E'）的最小粘弹性为≤10 8Pa，玻璃化转变温度（E“）A的拉伸伸长率为 ≥150％。
版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008106141A Polyimide film and method for producing the same 审中-公开
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：JP2008106141A
公开(公告)日：2008-05-08
申请号：JP2006290152
申请日：2006-10-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , TESHIBA TOSHIHIRO
IPC分类号： C08L79/08 , C08G73/10 , C08J5/18 , C08K3/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a polyimide film that has excellent running properties, adhesiveness and dimensional stability of a film and is applicable to an automatic optical inspection system (AOI) of a flexible printed circuit board (FPC) or a chip-on-film (COF) and to provide a method for producing the same.
SOLUTION: The polyimide film is produced mainly by imidation from 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic acid dianhydride as an acid dianhydride component and comprises 0.1-0.9 wt.% based on the weight of a film resin of inorganic particles, having particle diameters in a range of 0.01-1.5 μm, an average particle diameter of 0.05-0.7 μm and a particle size distribution in which ≥80 vol.% based on the total particles of inorganic particles having particle diameters of 0.15-0.60 μm, dispersed into the film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有优异的运行性能，粘合性和膜的尺寸稳定性的聚酰亚胺膜，并且可应用于柔性印刷电路板（FPC）或芯片的自动光学检测系统（AOI） - 膜（COF），并提供其制造方法。解决方案：聚酰亚胺膜主要通过作为二胺组分的3,4'-二氨基二苯醚和4,4'-二氨基二苯醚进行酰亚胺化和作为酸二酐组分的均苯四甲酸二酐制备，并且包含0.1-0.9重量％对于粒径为0.01〜1.5μm，平均粒径为0.05〜0.7μm的无机粒子的薄膜树脂的重量和基于总粒子数的≥80体积％的粒径分布，分散在膜中的粒径为0.15-0.60μm的无机颗粒。版权所有（C）2008，JPO＆INPIT

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