专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014058620A Board for cof for tablet terminal 有权
标题翻译：纸板终端纸盒
公开(公告)号：JP2014058620A
公开(公告)日：2014-04-03
申请号：JP2012204175
申请日：2012-09-18
申请人： Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： OBA HIROSHI , AKIYAMA SATOSHI , KOKUNI MASAHIRO
IPC分类号： C08J5/18 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film suitable for a board for a high definition (fine pitch) circuit such as for COF, capable of reducing dimensional changes in a width direction (TD) of the polyimide film while maintaining a thermal expansion coefficient (CTE) approximated to a copper wiring in a machine transportation direction (MD) of the polyimide film, and to provide a copper-clad laminate using the same as a base material.SOLUTION: A board for a COF for a tablet terminal contains a polyimide film in which fine particles having a particle diameter of 0.07 to 2.0 μm are dispersed uniformly and having a thickness of 26.5 to 36.5 μm as a base material, and on which copper wiring having the thickness of 1 to 10 μm is formed, and the polyimide film is manufactured by using one or more aromatic diamine selected from a group consisting of paraphenylene diamine, 4,4'-diaminodiphenyl ether and 3,4'-diaminodiphenyl ether, and one or more acid anhydride selected from a group consisting of pyromellitic dianhydride and 3,3'-, 4,4'-diphenyl tetracarboxylic acid dianhydride.
摘要翻译：要解决的问题：为了提供适合于用于COF的高分辨率（细间距）电路板的聚酰亚胺膜，能够减小聚酰亚胺膜的宽度方向（TD）的尺寸变化，同时保持热膨胀系数（CTE）近似于聚酰亚胺膜的机器输送方向（MD）上的铜布线，并提供使用其作为基材的覆铜层压板。解决方案：用于平板电脑终端的COF板包含其中粒径为0.07-2.0μm的细颗粒均匀分散并具有26.5至36.5μm的厚度的聚酰亚胺膜作为基材，其上形成有厚度为1至10μm的铜布线，通过使用一种或多种选自对苯二胺，4,4'-二氨基二苯醚和3,4'-二氨基二苯醚的芳族二胺和一种或多种选自以下的酸酐来制备聚酰亚胺膜：由均苯四酸二酐和3,3'-，4,4'-二苯基四羧酸二酐组成。

2. 发明专利

JP2013014776A Polyimide film, and copper-clad laminate using the same as substrate material 审中-公开
标题翻译：聚酰亚胺薄膜和使用相同材料的铜箔层压板
公开(公告)号：JP2013014776A
公开(公告)日：2013-01-24
申请号：JP2012194817
申请日：2012-09-05
申请人： Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , B32B7/02 , B32B15/08 , B32B15/088 , B32B15/20 , B32B27/34
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film excellent in dimensional stability and suitable for a substrate for fine pitch circuit, particularly COF (Chip on film) in which wiring is carried out at naroow pitches in the width direction, and a copper-clad laminate using the same as a substrate material.SOLUTION: The polyimide film has a thermal expansion coefficient αMD in the machine transport direction (MD) of the film of 3 to 10 ppm/°C, and a thermal expansion coefficient αTD in the transverse direction (TD) of 10 to 20 ppm/°C. With the polyimide film used as a substrate material, copper of 1 to 10 μm in thickness is formed thereon.
摘要翻译：要解决的问题：为了提供尺寸稳定性优异并且适用于细间距电路的基板的聚酰亚胺膜，特别是在宽度方向上以纳罗孔间距进行布线的COF（膜上芯片），以及覆铜层压板使用其作为基底材料。解决方案：聚酰亚胺膜的膜的机器输送方向（MD）的热膨胀系数αMD为3〜10ppm /℃，横向（TD）的热膨胀系数αTD为10〜 20 ppm /°C。以聚酰亚胺薄膜为基材，在其上形成厚度为1〜10μm的铜。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2009021351A Cover lay 有权
标题翻译：盖子
公开(公告)号：JP2009021351A
公开(公告)日：2009-01-29
申请号：JP2007182277
申请日：2007-07-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU , SAWAZAKI KOICHI
IPC分类号： H05K3/28 , C08G73/10 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a cover lay which has superior size stability, superior heat resistance, and characteristics adaptive to an AOI and is also superior in traveling property (easy lubricating property) and adhesion. SOLUTION: The cover lay is provided which uses a polyimide film mainly made up of paraphenylenediamine and 4,4'-diaminodiphenyl ether as a diamine component and pyromellitic dianhydride and 3,3',4,4'-biphenyl tetracarboxylic acid dianhydride as a dianhydride component and has an adhesive layer formed on one surface of the polyimide film, the cover lay is characterized by using the polyimide film in which powers mainly made up of inorganic particles of 0.01 to 1.5 μm in particle size and 0.05 to 0.7 μm in average particle size are dispersed in the film in an amount of 0.1 to 0.9% per film resin weight. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的尺寸稳定性，优异的耐热性和适合于AOI的特性的覆盖层，并且还具有优异的行进性（易于润滑性）和粘附性。
解决方案：提供了使用主要由对苯二胺和4,4'-二氨基二苯醚作为二胺组分的聚酰亚胺膜和均苯四酸二酐和3,3'，4,4'-联苯四羧酸二酐作为二酐成分，具有在聚酰亚胺膜的一个表面上形成的粘合剂层，其特征在于，使用主要由粒径为0.01〜1.5μm的无机粒子和0.05〜0.7μm的主要成分的聚酰亚胺膜平均粒径分散在膜中，其膜厚为0.1〜0.9质量％。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008211044A Chip-on film 审中-公开
标题翻译：芯片电影
公开(公告)号：JP2008211044A
公开(公告)日：2008-09-11
申请号：JP2007047426
申请日：2007-02-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： H05K1/03 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a chip-on film (COF) having excellent slidability and foldability. SOLUTION: The chip-on film is made by forming an interconnection so as to be capable of mounting IC chips on at least one side of polyimide film, wherein the polyimide film is that in which inorganic particles of which the particle diameter is 0.01-1.5 μm, the average particle diameter is 0.05-0.7 μm, having the particle size distribution where the particles of particle diameter 0.15-0.60 μm account for the proportion of 80 or more vol.% among all particles, are distributed and contained with the proportion of 0.1-0.9 wt.% per film resin weight, and, the interconnection is formed at least one side of the polyimide film through or not through adhesives. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供具有优异的滑动性和折叠性的贴片膜（COF）。解决方案：贴片膜通过形成互连而制成，以便能够将IC芯片安装在聚酰亚胺膜的至少一侧上，其中聚酰亚胺膜是其中粒径为 0.01-1.5μm，平均粒径为0.05-0.7μm，粒径分布为粒径分布为0.15-0.60μm的颗粒占所有颗粒中80％或更多体积％的比例，分布并含有每个膜树脂重量的比例为0.1-0.9重量％，并且通过或不通过粘合剂形成至少一个聚酰亚胺膜的一侧。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008166554A Flexible printed wiring board 有权
标题翻译：柔性印刷接线板
公开(公告)号：JP2008166554A
公开(公告)日：2008-07-17
申请号：JP2006355333
申请日：2006-12-28
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , SAWAZAKI KOICHI , MAEDA SHU
IPC分类号： H05K1/03 , C08G73/10 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board in which minute wiring can be formed and which has proper running performance (easy slidability) and will not deform, even if lead-free solder is used. SOLUTION: The flexible printed wiring board contains a polyimide film, principally comprising paraphenyldiamine and 4,4'-diaminodiphenylether as a diamine component and pyromellitic acid dihydride and 3,3', 4,4'-biphenyl tetracarboxylic acid dihydride as an acid dihydride component, and further containing minute inorganic particles, wherein wiring is formed on one surface or on both surfaces of the polyimide film, with or without an adhesive. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使使用无铅焊料，也可以提供能够形成微细布线且具有适当的运行性能（易滑动性）并且不会变形的柔性印刷布线板。解决方案：柔性印刷线路板包含聚酰亚胺膜，主要包括对苯二胺和4,4'-二氨基二苯基醚作为二胺组分和均苯四酸二酐和3,3'，4,4'-联苯四羧酸二酐作为酸二酐组分，并且还含有微小的无机颗粒，其中布线在聚酰亚胺膜的一个表面上或两个表面上形成，具有或不具有粘合剂。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008147439A Copper clad plate 有权
标题翻译：铜箔板
公开(公告)号：JP2008147439A
公开(公告)日：2008-06-26
申请号：JP2006333205
申请日：2006-12-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , KOKUNI MASAHIRO , SAWAZAKI KOICHI
IPC分类号： H05K1/03 , C08G73/10 , C08J5/18 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate that has a small dimensional change rate after etching and characteristics adaptable to AOI and is suitable for a flexible printed wiring board while being excellent in slipping properties and adhesion. SOLUTION: A polyimide film is formed of paraphenylenediamine and 4, 4'-diaminodiphenyl ether as diamine components and pyromellitic dianhydride and 3, 3', 4, 4'-biphenyltetracarboxylic dianhydride as acid anhydride components. Inorganic particles are dispersed in the film at a ratio of 0.1-0.9 wt.% per film resin weight. The inorganic particles respectively have a particle size of 0.01-1.5 μm and an average particle size of 0.05-0.7 μm while having a particle size distribution in which inorganic particles having a particle size of 0.15-0.60 μm occupy a ratio exceeding 80 vol.% in all particles. The copper clad plate is composed by adhering a copper plate to one face or both faces of the film via an adhesive. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在蚀刻后具有小的尺寸变化率和适用于AOI的特性的铜包覆板，并且适用于柔性印刷线路板，同时具有优异的滑动性能和粘附性。解决方案：聚酰亚胺膜由对苯二胺和4,4'-二氨基二苯醚作为二胺组分和均苯四酸二酐和3,3'，4,4'-联苯四羧酸二酐作为酸酐组分形成。无机颗粒以薄膜树脂重量为0.1-0.9重量％的比例分散在膜中。无机粒子的粒径分别为0.01〜1.5μm，平均粒径为0.05〜0.7μm，粒径分布为0.15〜0.60μm的无机粒子的比例超过80体积％在所有颗粒中。铜箔板通过粘合剂将铜板粘合到膜的一个面或两个面上而构成。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008034526A Cover lay 审中-公开
标题翻译：盖子
公开(公告)号：JP2008034526A
公开(公告)日：2008-02-14
申请号：JP2006204787
申请日：2006-07-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU , SAWAZAKI KOICHI
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a cover lay suitable to be stuck on a flexible printed board employing a lead-free solder by solving the problem of both a change in dimension of the cover lay and heat resistance thereof.
SOLUTION: A polyimide film is used as mainly containing paraphenylenediamine and 4, 4'-diaminophenylether as a diamine component, and pyromellitic acid dianhydride as an acid diandhydride component. An adhesive is applied on one surface of the polyimide film to form the cover lay.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过解决覆盖层的尺寸变化和耐热性两者的问题，提供适于粘贴在使用无铅焊料的柔性印刷板上的覆盖层。解决方案：聚酰亚胺膜主要用作对苯二胺和4,4'-二氨基苯基醚作为二胺组分，和均苯四甲酸二酐用作酸二酐组分。将粘合剂施加在聚酰亚胺膜的一个表面上以形成覆盖层。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007196670A Copper clad plate 有权
标题翻译：铜箔板
公开(公告)号：JP2007196670A
公开(公告)日：2007-08-09
申请号：JP2006341379
申请日：2006-12-19
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , SAWAZAKI KOICHI , KOKUNI MASAHIRO
IPC分类号： B32B15/088 , B32B15/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate suitable as a material of a flexible printed wiring board enabling the formation of fine wiring, not deformed even if lead-free solder is used and excellent in dimensional stability and heat resistance.
SOLUTION: A polyimide film, which is formed of paraphenylenediamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic dianhydride as an acid anhydrite component and a 3,3', 4,4'-biphenyltetracarboxylic dianhidride, is used and a copper plate is provided to one side or both sides of the polyimide film using an adhesive or without using the adhesive to obtain the copper clad plate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种适合作为能够形成精细布线的柔性印刷布线板的材料的铜包覆板，即使使用无铅焊料也不变形，并且尺寸稳定性和耐热性优异。解决方案：使用由对苯二胺和4,4'-二氨基二苯基醚作为二胺组分形成的聚酰亚胺膜和作为酸硬水合物组分的均苯四酸二酐和3,3'，4,4'-联苯四羧酸二阴离子并且使用粘合剂或不使用粘合剂将聚酰亚胺膜的一侧或两侧的铜板设置在铜包覆板上。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007180179A Chip on film 审中-公开
标题翻译：电影片
公开(公告)号：JP2007180179A
公开(公告)日：2007-07-12
申请号：JP2005375365
申请日：2005-12-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： H01L21/60 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a chip on film excellent in foldability and obtained by using a polyimide film having high dimensional stability and proper elastic modulus.
SOLUTION: The chip on film permits wiring 2 to be formed on at least one surface of a polyimide film 1 such that an IC chip is mountable thereon. The polyimide film 1 is obtained by using chiefly 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether as diamine components, and using pyromellitic dianhydride as dianhydride. The wiring 2 is formed on at least one surface of the polyimide film 1 via an adhesive or without mediating the same.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的折叠性的薄片，并通过使用具有高尺寸稳定性和适当的弹性模量的聚酰亚胺膜获得。解决方案：膜上的芯片允许布线2形成在聚酰亚胺膜1的至少一个表面上，使得IC芯片可以安装在其上。通过主要使用3,4'-二氨基二苯基醚和4,4'-二氨基二苯基醚作为二胺成分，使用均苯四酸二酐作为二酐得到聚酰亚胺膜1。布线2经由粘合剂形成在聚酰亚胺薄膜1的至少一个表面上，或不进行介导。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006160974A Polyimide film 审中-公开
标题翻译：聚酰亚胺膜
公开(公告)号：JP2006160974A
公开(公告)日：2006-06-22
申请号：JP2004357823
申请日：2004-12-10
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： C08J5/18 , C08G73/10 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film which has a uniform structure with no structural difference between the outermost layer of the film and the inside of the film and can form a circuit board exhibiting excellent dimensional stability. SOLUTION: The polyimide film gives a difference in Δw, the half value width of the Raman spectrum band in the neighborhood of 1,610-1,630 cm -1 , of at most 1.3 cm -1 between the inside of the film and the outermost layer of the film, when the half value width (Δw) is measured by the Raman spectroscopy where the excitation wavelength, the laser spot and the wave number resolution (sampling interval) are set to 1,064 nm, 1-2 μm and at least 1 cm -1 , respectively. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有均匀结构的聚酰亚胺膜，其膜的最外层和膜的内部之间没有结构差异，并且可以形成显示出优异的尺寸稳定性的电路板。
解决方案：聚酰亚胺薄膜在Δw的差值，在1,610-1,630cm -1附近的拉曼光谱带的半值宽度至多为1.3cm×SP> 当通过激光波长，激光光斑和波数分辨率（采样间隔）的拉曼光谱测量半值宽度（Δw）时，膜的内部和膜的最外层之间的厚度为1 分别设定为1,064nm，1-2μm和至少1cm -1 。版权所有（C）2006，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式