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1. 发明专利

JP2005251921A Heat radiating structure and its manufacturing method 有权
标题翻译：热辐射结构及其制造方法
公开(公告)号：JP2005251921A
公开(公告)日：2005-09-15
申请号：JP2004059140
申请日：2004-03-03
申请人： Dow Corning Asia Ltd , Fuji Polymer Industries Co Ltd , Nissan Motor Co Ltd , ダウコーニングアジア株式会社 , 富士高分子工業株式会社 , 日産自動車株式会社
发明人： SHIBUYA AKIHIRO , FURUKAWA SUKEYUKI , NARUSE MIKIO , EHIRA ATSUSHI , OGAWA KAZUHIRO , OTA HIROTOMO , ABE KAZUYOSHI , IKEZAWA ATSUSHI , KAKEHI TORU
IPC分类号： H05K7/20 , C09K5/14 , H01L21/48 , H01L23/34 , H01L23/36 , H01L23/373 , H01L25/07
CPC分类号： H01L23/3737 , C09K5/14 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L25/072 , H01L2224/32013
摘要： PROBLEM TO BE SOLVED: To provide a heat radiating structure, capable of effectively radiating heat from a heat generating body, such as a semiconductor device or the like, while maintaining electrical insulation over a long period of time.
SOLUTION: In the radiating structure, a heat generator 11 and a heat radiator 2 are integrated via an electrically insulating and heat conducting sheet 7 on at least one of which a heat conductive grease 8 is coated, and the heat-conducting sheet 7 and the electrically insulating and heat conductive grease 8 are insoluble to each other.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够有效地从诸如半导体装置等的发热体辐射热量的热辐射结构，同时保持长时间的电绝缘。解决方案：在辐射结构中，热电偶11和散热器2通过电绝缘导热片7在其中涂覆有导热油脂8中的至少一个上而被整合，导热片电绝缘导热油脂8彼此不溶。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005064291A Insulation sheet and semiconductor device assembly using the same 审中-公开
标题翻译：绝缘片和半导体器件组装使用相同
公开(公告)号：JP2005064291A
公开(公告)日：2005-03-10
申请号：JP2003293494
申请日：2003-08-14
申请人： Fuji Polymer Industries Co Ltd , Nissan Motor Co Ltd , 富士高分子工業株式会社 , 日産自動車株式会社
发明人： SHIBUYA AKIHIRO , FURUKAWA SUKEYUKI , NARUSE MIKIO , EHIRA ATSUSHI , OGAWA KAZUHIRO , OTA HIROTOMO , ABE KAZUYOSHI
IPC分类号： H01L23/36 , H01L23/373 , H01L23/40 , H01L23/473
CPC分类号： H01L23/4006 , H01L23/3737 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an insulation sheet where thermal conductivity is improved without degrading insulation.
SOLUTION: In the insulation sheet 1 which is provided between a semiconductor device 20 and a heat sink 30, a thermally conductive filler of 70 to 93 mass% is contained in the base material of organo-polysiloxane, and the quantity of conductive impurity in this insulation sheet is ≤500 ppm or less.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在不降低绝缘性的情况下提高导热性的绝缘片。解决方案：在设置在半导体器件20和散热器30之间的绝缘片1中，在有机聚硅氧烷的基材中含有70〜93质量％的导热性填料，导电性该绝缘片中的杂质≤500ppm以下。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2013080862A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013080862A
公开(公告)日：2013-05-02
申请号：JP2011220929
申请日：2011-10-05
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： KURODA MOTOHIKO , MURAKAMI AKIRA , OGAWA KAZUHIRO
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To solve a problem that a filling layer provided for filling a gap between a semiconductor module and a heat sink may flow out due to a thermal cycle, vibrations, and the likes.SOLUTION: A semiconductor device 100 includes: multiple semiconductor modules 10 including semiconductor modules having different heights; coolers 12 which are disposed on both surfaces of the multiple semiconductor modules 10 and are used for cooling the multiple semiconductor modules 10; and filling layers 11 which are provided between the multiple semiconductor modules 10 and the coolers 12, have insulation properties, and include a curable material.
摘要翻译：解决的问题：为了解决由于热循环，振动等而使用于填充半导体模块和散热器之间的间隙的填充层可能流出的问题。解决方案：半导体器件100包括：多个半导体模块10，包括具有不同高度的半导体模块; 冷却器12，其设置在多个半导体模块10的两个表面上，并用于冷却多个半导体模块10; 并且设置在多个半导体模块10和冷却器12之间的填充层11具有绝缘性能，并且包括可固化材料。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2007215280A Insulating sheet, manufacturing method of stator having insulating sheet, and motor 审中-公开
标题翻译：绝缘片，具有绝缘片的定子的制造方法和电机
公开(公告)号：JP2007215280A
公开(公告)日：2007-08-23
申请号：JP2006030597
申请日：2006-02-08
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： OGAWA KAZUHIRO , EHIRA ATSUSHI
IPC分类号： H02K3/30 , H02K3/34
摘要： PROBLEM TO BE SOLVED: To provide an insulating sheet that can suppress a rise in the temperature of a coil of a motor, a manufacturing method of a stator having the insulating sheet.
SOLUTION: The insulating sheet 3 is composed of a polymer and a monomer, and this insulating sheet 3 includes a liquid crystal monomer 10 containing a mesogen group and a polymer group in a molecule at 50 to 500 weight parts with respect to 100 weight parts of a liquid crystal polymer 9 containing a mesogen group. Since the insulating sheet 3 contains the mesogen group that exhibits a liquid crystal property, the molecule forms a high-order structure in a liquid crystal state, and as a result, heat conductivity by a phonon being a heat conductive medium of a high-polymer material is promoted.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够抑制马达的线圈的温度上升的绝缘片，具有绝缘片的定子的制造方法。解决方案：绝缘片3由聚合物和单体构成，该绝缘片3包括分子中含有介晶基团和聚合物基团的液晶单体10，相对于100分子为50〜500重量份重量份含有介晶基团的液晶聚合物9。由于绝缘片3含有表现出液晶性质的介晶基，所以分子在液晶状态下形成高阶结构，结果导致作为高分子导热介质的声子材料被推广。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2010161874A Split stator core and manufacturing method for the same 有权
标题翻译：分离定子芯及其制造方法
公开(公告)号：JP2010161874A
公开(公告)日：2010-07-22
申请号：JP2009002412
申请日：2009-01-08
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： TAKARAGI SHINICHI , OGAWA KAZUHIRO , HASHIMOTO TOMIHITO
IPC分类号： H02K1/18 , H02K3/46 , H02K9/22
CPC分类号： Y02T10/641
摘要： PROBLEM TO BE SOLVED: To provide a split stator core that allows a thermoplastic polymeric material to be interposed between an insulator and a core segment without problems, when slide-fitting the insulator to the core segment, has superior heat-dissipation properties by smoothly transmitting heat generated in a coil to the core segment, and attains the simplification of process, reduction in the cycle time, smooth mass-production, and cost reduction, while attaining easy and simple assembling or manufacturing work, as well as, to provide a manufacturing method for the core.
SOLUTION: A split stator core 2 has a core segment 3, an insulator 6, and a coil 9, and a thermoplastic polymeric material 7 that allows slide-fitting of the insulator 6 is provided on either one or both the inner face 6a of the insulator 6 and the lamination face 4a of the core segment 3.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供允许热塑性聚合物材料插入绝缘体和芯部分之间没有问题的分割定子芯，当将绝缘体滑动配合到芯部分时，具有优异的散热性能通过将线圈中产生的热量顺利地传递到芯部，并且在实现容易且简单的组装或制造工作的同时，实现了工艺的简化，循环时间的缩短，批量生产的顺利和成本的降低，以及提供核心的制造方法。解决方案：分体定子芯2具有芯部3，绝缘体6和线圈9，并且允许绝缘体6滑动配合的热塑性聚合材料7设置在内表面绝缘体6的6a和芯部3的层叠面4a。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009158919A Semiconductor device and manufacturing method thereof 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2009158919A
公开(公告)日：2009-07-16
申请号：JP2008249995
申请日：2008-09-29
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： OGAWA KAZUHIRO , TAKARAGI SHINICHI , SESHIMO HATSUNA , HASHIMOTO TOMIHITO , KINO NOBUO , UENO DAIGO , HASHIGUCHI KATSUTOSHI
IPC分类号： H01L23/36
CPC分类号： H01L2224/32225 , H01L2924/1301 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can be made compact in size having a simple constitution, and has an insulating layer having superior heat conductivity by suppressing thermal resistance, and a manufacturing method thereof. SOLUTION: The semiconductor device 1 comprises a non-insulation type semiconductor module 2 in which a semiconductor chip 5 is incorporated, a cooler 3 which cools the semiconductor chip, and an insulating layer 4 which is disposed between the cooler 3 and non-insulation type semiconductor module 2 and formed directly on the cooler 3, the insulating layer 4 containing a polymer and a filler having higher thermal conductivity than that of the polymer. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以制造成具有简单结构的尺寸紧凑的半导体器件，并且具有通过抑制热阻而具有优良的热导率的绝缘层及其制造方法。解决方案：半导体器件1包括其中结合有半导体芯片5的非绝缘型半导体模块2，冷却半导体芯片的冷却器3和设置在冷却器3和非冷却器3之间的绝缘层4 绝缘型半导体模块2，直接形成在冷却器3上，绝缘层4含有聚合物和具有比聚合物热导率高的填料。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008108842A Semiconductor device and method for manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2008108842A
公开(公告)日：2008-05-08
申请号：JP2006289016
申请日：2006-10-24
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： SESHIMO HATSUNA , EHIRA ATSUSHI , OGAWA KAZUHIRO
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having excellent performance for cooling of a semiconductor chip and also provide a method for manufacturing the same semiconductor chip. SOLUTION: The semiconductor device is provided with a non-insulated semiconductor module 2 including a built-in semiconductor chip, a cooler 3 for cooling the semiconductor chip, and an insulating layer 6 formed using a polymer material as a mother material and held between the non-insulated semiconductor module 2 and the cooler 3. A swelling assisting agent 8 is penetrated and heat conductive particle 9 is added to the front surface part 6SM in the side of the non-insulated semiconductor module and to the front surface part 6SH in the side of the cooler of the insulating layer 6. Moreover, the semiconductor device also includes a heat conductive path 10 that is formed between the non-insulated semiconductor module 2 and the cooler 3 in the stage that the predetermined load is applied. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的半导体芯片冷却性能的半导体器件，并且还提供制造相同半导体芯片的方法。解决方案：半导体器件设置有包括内置半导体芯片的非绝缘半导体模块2，用于冷却半导体芯片的冷却器3和使用聚合物材料作为母材形成的绝缘层6，以及保持在非绝缘半导体模块2和冷却器3之间。膨胀助剂8被穿透，并且导热颗粒9被添加到非绝缘半导体模块侧的前表面部分6SM和前表面部分 6SH。此外，半导体器件还包括在施加预定负载的阶段之间形成在非绝缘半导体模块2和冷却器3之间的导热路径10。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2005204352A Adhesive and securing method of permanent magnet to motor and permanent magnet motor 审中-公开
标题翻译：永磁电机的电机和永磁电机的粘合和固化方法
公开(公告)号：JP2005204352A
公开(公告)日：2005-07-28
申请号：JP2004004918
申请日：2004-01-13
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： OGAWA KAZUHIRO , EHIRA ATSUSHI
IPC分类号： C09J4/00 , C09J11/04 , C09J163/00 , H02K1/27
摘要： PROBLEM TO BE SOLVED: To provide adhesive exhibiting high thermal conductivity and filling properties and capable of enhancing cooling performance of a permanent magnet sharply.
SOLUTION: The adhesive 6 being used for securing the permanent magnet 5 of a motor 1 contains 10 pts.wt. of liquid resin 8 in the temperature range of 100°C from room temperature and including a polymerization group for 100 pts.wt. of monomer 7 including a mesogen group and a polymerization group in molecule wherein the extending direction of the mesogen group is substantially aligned with the direction of heat conduction.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供显示出高导热性和填充性能并能够显着提高永磁体的冷却性能的粘合剂。解决方案：用于固定电动机1的永磁体5的粘合剂6含有10重量份的液体树脂8在室温下在100℃的温度范围内，并且包括聚合基团100重量份。的单体7，其包括介晶基团和分子中的聚合基团，其中介晶组的延伸方向基本上与热传导方向对准。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004327533A Semiconductor device and its manufacturing method 审中-公开
公开(公告)号：JP2004327533A
公开(公告)日：2004-11-18
申请号：JP2003117008
申请日：2003-04-22
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： OGAWA KAZUHIRO , EHIRA ATSUSHI , SHIBUYA AKIHIRO , FURUKAWA SUKEYUKI , NARUSE MIKIO
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is equipped with a semiconductor module capable of transmitting heat released from it to a cooler well and a semiconductor chip that is built in the semiconductor module and excellent in cooling performance, and to provide its manufacturing method.
SOLUTION: The semiconductor device is equipped with the non-insulated semiconductor module 2 provided with a built-in semiconductor chip, the cooler 3 cooling the semiconductor chip, and silicone grease 6 that is insulating liquid material and sandwiched between the non-insulated semiconductor module 2 and the cooler 3. The silicone grease 6 contains synthetic zeolite 7 as an adsorbent adsorbing air.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2008108756A Insulating material, method of manufacturing motor stator using the same, and method of assembling insulating material to semiconductor device 有权
标题翻译：绝缘材料，使用其制造电动机定子的方法以及将绝缘材料组装到半导体器件的方法
公开(公告)号：JP2008108756A
公开(公告)日：2008-05-08
申请号：JP2006287109
申请日：2006-10-23
申请人： Nissan Motor Co Ltd , 日産自動車株式会社
发明人： OGAWA KAZUHIRO , EHIRA ATSUSHI , OBA TOSHIYUKI
IPC分类号： H01L23/36 , H02K3/34
摘要： PROBLEM TO BE SOLVED: To provide an insulating material that reduces thermal contact resistance, can greatly restrain temperature rise in an electrical heating element, such as a motor coil and a semiconductor chip in a semiconductor device, can improve drive efficiency when using the insulating material for the motor, and can improve cooling performance in a semiconductor module when using the insulating material for the semiconductor device. SOLUTION: The insulating material contains a polymer and a monomer. An insulating sheet 10 contains 50-500 pts.wt. of a liquid crystal monomer 12 containing a mesogen group and a polymerizable group in a molecule for 100 pts.wt. of a liquid polymer 11 containing the mesogen group. When the insulating sheet 10 is used for manufacturing the motor stator 2, the insulating sheet 10 and the coil 5 are arranged in a slot 4 provided on the stator core 3 in the motor stator 2 for heat treatment to fuse the insulating sheet 10 to both of the stator core 3 and the coil 5. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供降低热接触电阻的绝缘材料，可以极大地抑制诸如电动机线圈和半导体器件中的半导体芯片的电加热元件中的温度升高，可以在使用时提高驱动效率用于电动机的绝缘材料，并且当使用用于半导体器件的绝缘材料时，可以提高半导体模块中的冷却性能。解决方案：绝缘材料含有聚合物和单体。绝缘片10包含50-500重量份的分子中含有介晶基团和可聚合基团的液晶单体12，重量为100重量份。的含有介晶基团的液体聚合物11。当绝缘片10用于制造电动机定子2时，绝缘片10和线圈5被布置在设置在电动机定子2中的定子铁芯3上的槽4中，用于热处理以将绝缘片10熔合到两者定子铁芯3和线圈5。版权所有（C）2008，JPO＆INPIT

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