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1. 发明专利

JP2013187275A Machining method 审中-公开
标题翻译：加工方法
公开(公告)号：JP2013187275A
公开(公告)日：2013-09-19
申请号：JP2012050003
申请日：2012-03-07
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： PRIEWASSER KARL
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To perform processing of forming a circular recessed portion on a back surface of a disk-like workpiece and leaving an annular projecting portion serving as a reinforcement portion in an outer periphery thereof, at a cost lower than that of a conventional method.SOLUTION: A processing method includes a step of cutting and removing a center portion of a back surface 1b of a disk-like workpiece 1 held by a holding table 20 by a cutting blade 33 to form a circular recessed portion 1E and an annular projecting portion 1F surrounding the circular recessed portion 1E. The step of forming the circular recessed portion E includes the steps of: allowing the cutting blade 33 rotating at a position at a predetermined distance to a center side of the workpiece 1 from an outer peripheral edge of the workpiece 1 to cut into the workpiece 1 from the back surface 1b side at a predetermined depth; and thereafter relatively moving the cutting blade 33 in a radial direction of the workpiece 1 while rotating the holding table 20 in a state in which the cutting blade 33 cuts into the workpiece 1.
摘要翻译：要解决的问题：为了进行在圆盘状工件的背面上形成圆形凹部的处理，并在其外周留下用作加强部的环状突出部，成本低于常规方法。一种处理方法，包括通过切割刀片33切割和去除由保持台20保持的盘状工件1的后表面1b的中心部分以形成圆形凹部1E和环形围绕圆形凹部1E的突出部1F。形成圆形凹部E的步骤包括以下步骤：允许在距离工件1的中心侧预定距离的位置处的切割刀片33从工件1的外周边缘旋转到工件1中从背面1b侧预定深度; 然后在切割刀片33切入工件1的状态下使保持台20旋转，同时使切割刀片33在工件1的径向上相对移动。

2. 发明专利

JP2007287796A Processing method of wafer 有权
标题翻译： WAFER的处理方法
公开(公告)号：JP2007287796A
公开(公告)日：2007-11-01
申请号：JP2006111019
申请日：2006-04-13
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： PRIEWASSER KARL
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a processing method of a wafer in which such an inconvenience as the adhesive of a protective tape fuses and solidifies in a device region does not occur.
SOLUTION: A device region 4 in which a plurality of semiconductor chips 3 are formed and an outer circumference surplus region 5 surrounding the device region 4 are formed on the surface of a wafer 1 and the backside of the wafer is ground. The backside region corresponding to the device region 4 is ground concavely and a ringlike reinforcing portion is formed in the backside region corresponding to the outer circumference surplus region. The processing method of a wafer 1 comprises a step for sticking a protective tape 6 having adhesive 6a only in the region corresponding to the outer circumference surplus region 5, a step for grinding the backside region corresponding to the device region 4 of the wafer 1, an additional step for processing the wafer 1 to raise the temperature thereof, a step for removing the reinforcing portion 1b, and a step for sticking the wafer 1 from which the reinforcing portion 1b is removed to a dicing tape and stripping the protective tape.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种晶片的处理方法，其中不会发生诸如保护带的粘合剂的不方便在器件区域中熔化和固化的处理方法。解决方案：在晶片1的表面和晶片的背面上形成其中形成有多个半导体芯片3的器件区域4和围绕器件区域4的外周剩余区域5。对应于器件区域4的背面区域被凹入地磨削，并且在对应于外周余量区域的背侧区域中形成环形加强部分。晶片1的处理方法包括仅在与外周剩余区域5对应的区域中粘贴具有粘合剂6a的保护带6的步骤，用于研磨与晶片1的器件区域4对应的背面区域的步骤，用于处理晶片1以提高其温度的附加步骤，去除加强部分1b的步骤以及将加强部分1b从其移除的晶片1粘贴到切割带并剥离保护带的步骤。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007027309A Method of processing wafer 有权
标题翻译：加工方法
公开(公告)号：JP2007027309A
公开(公告)日：2007-02-01
申请号：JP2005205538
申请日：2005-07-14
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： SEKIYA KAZUMA , PRIEWASSER KARL
IPC分类号： H01L21/304 , H01L21/301
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L21/68735 , H01L2221/68327 , H01L2221/6834
摘要： PROBLEM TO BE SOLVED: To ease handling of a wafer that is made thinner by grinding in the following processing or transportation, and to make it possible to divide the wafer into devices. SOLUTION: The surface side of a wafer W wherein a device area and a peripheral excessive area surrounding the device area are formed on the surface is held by a holding table 20 of a grinder 2, an area corresponding to the device area in the rear surface of the wafer W is ground to form a concave W3, and an annular enforced part W4 is formed on the peripheral side of the convex W3. After a protection tape is stuck to the concave W3, the wafer is divided into devices while the protection tape side is being held by a chuck table of a dividing device for dividing the wafer W. Even if the thickness of the device area is made very small, the device area is enforced from the periphery area W4, so that the wafer W after the rear surface is ground can be easily removed from the holding table of the grinder, and handling of the wafers can be eased during conveyance of the wafers in the following steps and among the following steps. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了在随后的处理或运输中通过研磨来轻松处理通过研磨而变薄的晶片，并且使得可以将晶片分成器件。解决方案：其中在表面上形成围绕设备区域的设备面积和周边过多区域的晶片W的表面侧由研磨机2的保持台20保持，对应于设备区域的区域晶片W的后表面被研磨以形成凹形W3，并且在凸起W3的周边形成有环形加强部W4。在将保护带粘贴到凹部W3上之后，将晶片分割为装置，同时保护带侧由用于分割晶片W的分割装置的卡盘夹持。即使设备区域的厚度非常大小的时候，从周边区域W4施加设备区域，从而能够容易地从研磨机的保持台移除背面后的晶片W，并且可以在晶片的输送期间缓和晶片的处理以下步骤以及以下步骤之一。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007243112A Recess working method and irregularity absorption pad for wafer 审中-公开
标题翻译：回收工作方法和用于波形的非正常吸收垫
公开(公告)号：JP2007243112A
公开(公告)日：2007-09-20
申请号：JP2006067387
申请日：2006-03-13
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： PRIEWASSER KARL
IPC分类号： H01L21/304 , B24B1/00
CPC分类号： B24B7/228
摘要： PROBLEM TO BE SOLVED: To simplify the dealing of a wafer formed so as to be made thin by the back face grinding of a wafer, and to increase the flexural strength of a device by preventing irregularity corresponding to the irregularity of the surface of the device from being exposed on the back face.
SOLUTION: In the case of grinding the back face of a wafer W equipped with a device region where a plurality of devices are formed and a peripheral surplus region surrounding the device region on the surface, a chuck table 50 is rotated in such a status that an irregularity absorption pad 1 is interposed between the chuck table 50 and the device region of the wafer W, and grinding is carried out by always bringing a grinding wheel section 513 into contact with the center of the rotation of the back face of the wafer W without bringing it into contact with the back face of the peripheral surplus region so that a recess W3 can be formed at the back face side of the device region, and that a ring-shaped reinforcing portion W4 including the peripheral surplus region can be formed at the peripheral side of the recess W3.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了简化通过晶片的背面研磨而形成为薄的晶片的处理，并且通过防止对应于表面的不规则性的不规则性来增加器件的弯曲强度的设备被暴露在背面。解决方案：在研磨配备有形成有多个器件的器件区域的晶片W的背面和围绕表面的器件区域的周边剩余区域的情况下，卡盘台50以这样的方式旋转凹凸吸收垫1夹在夹盘台50和晶片W的装置区域之间的状态，并且通过使研磨轮部分513与背面的旋转的中心接触来进行研磨晶片W不使其与周边剩余区域的背面接触，使得可以在器件区域的背面侧形成凹部W3，并且包括外围剩余区域的环状加强部分W4可以形成在凹部W3的周边。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007036143A Machining method of semiconductor wafer 审中-公开
标题翻译：半导体波形加工方法
公开(公告)号：JP2007036143A
公开(公告)日：2007-02-08
申请号：JP2005221298
申请日：2005-07-29
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： PRIEWASSER KARL
IPC分类号： H01L21/301
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/78 , Y10T156/1052 , Y10T156/1062 , Y10T156/1064 , Y10T156/1075
摘要： PROBLEM TO BE SOLVED: To provide a machining method of a semiconductor wafer capable of eliminating various inconveniences generated by cutting an adhesive film after adhering the adhesive film to the semiconductor wafer and can be applied to diversified device sizes easily. SOLUTION: The adhesive film 4 is cut to the same shape and size as those of a street 2b in the semiconductor wafer 2, and the street 2b is matched to a cut line 5 of the adhesive film 4 for positioning the semiconductor wafer 2. Then, the adhesive film 4 is adhered to the semiconductor wafer 2, and the semiconductor wafer 2 is cut along the street 2b to break a device 2a into individual pieces. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体晶片的加工方法，其能够消除将粘合剂膜粘附到半导体晶片之后通过切割粘合剂膜而产生的各种不便，并且可以容易地应用于多样化的器件尺寸。解决方案：将粘合膜4切割成与半导体晶片2中的街道2b相同的形状和尺寸，并且街道2b与用于定位半导体晶片的粘合膜4的切割线5相匹配然后，将粘合膜4粘附到半导体晶片2，并且沿着街道2b切割半导体晶片2，以将器件2a分解为单独的片。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2014067970A Surface protection member and processing method 有权
标题翻译：表面保护构件和加工方法
公开(公告)号：JP2014067970A
公开(公告)日：2014-04-17
申请号：JP2012214123
申请日：2012-09-27
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： PRIEWASSER KARL
IPC分类号： H01L21/304
CPC分类号： H01L29/06 , H01L21/6835 , H01L21/78 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S438/977
摘要： PROBLEM TO BE SOLVED: To provide a surface protection member which allows a protection member to be easily peeled from a wafer surface and no adhesive agent to be left on a device surface, to provide a processing method of the wafer using the surface protection member.SOLUTION: A processing method includes the steps of: arranging a wafer 1 on a surface protection member 10 by making a device region 3 of the wafer 1 correspond to an unevenness absorption member 14 arranged in a recess 12 of the surface protection member 10, and fixing the surface protection member 10 and the wafer 1 by arranging an adhesive agent 20 on the outside of the device region 3 (fixing step); holding the surface protection member 10 side with a holding table 21 and grinding a rear face 1b of the wafer 1 with grinding means 22 to thin the rear face down to a predetermined thickness (grinding step); and removing the surface protection member 10 from the wafer 1 (removing step). This method makes peeling easy and allows no adhesive agent to be left on the device surface by locally arranging the adhesive agent 20 on the outside of the device region 3.
摘要翻译：要解决的问题：提供一种表面保护构件，其允许保护构件容易地从晶片表面剥离并且不会留在装置表面上的粘合剂，以提供使用表面保护构件的晶片的处理方法。解决方案：一种处理方法，包括以下步骤：通过使晶片1的器件区域3对应于布置在表面保护构件10的凹部12中的凹凸吸收构件14，将晶片1布置在表面保护构件10上，以及通过在装置区域3的外侧设置粘合剂20来固定表面保护构件10和晶片1（固定步骤）; 用保持台21保持表面保护构件10一侧，并用研磨装置22研磨晶片1的后表面1b，将背面减薄至预定厚度（研磨步骤）; 并将表面保护构件10从晶片1移除（去除步骤）。该方法使得剥离容易，并且通过将粘合剂20局部地布置在器件区域3的外部，不会使器件表面上留下粘合剂。

7. 发明专利

JP2013187272A Processing method 审中-公开
标题翻译：处理方法
公开(公告)号：JP2013187272A
公开(公告)日：2013-09-19
申请号：JP2012049933
申请日：2012-03-07
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： PRIEWASSER KARL
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To perform processing of forming a circular recessed portion on a back surface of a disk-like workpiece and leaving an annular projecting portion serving as a reinforcement portion in an outer periphery thereof, at a cost lower than that of a conventional method.SOLUTION: A processing method for forming an annular groove 6A in an outer periphery portion on a back surface 1b side of a disk-like workpiece 1 by a cutting blade 33, and then cutting and removing an annular groove inner periphery region 6B inside the annular groove 6A to form a circular recessed portion 1E, includes the steps of: allowing the cutting blade 33a to cut into one end of the annular groove inner periphery region 6B; then cutting the workpiece 1 from one end to the other end of the annular groove inner periphery region 6B while linearly relatively moving the workpiece 1 and the cutting blade 33 in a processing feed direction; and then releasing the cutting to the workpiece 1 by the cutting blade 33, and relatively moving the cutting blade 33 and the workpiece 1 in an indexing feed direction perpendicular to the processing feed direction. In the method, the above steps are repeated to form the circular recessed portion 1E.
摘要翻译：要解决的问题：为了进行在圆盘状工件的背面上形成圆形凹部的处理，并在其外周留下用作加强部的环状突出部，成本低于常规方法。一种用于通过切割刀33在圆盘状工件1的背面1b侧的外周部形成环状槽6A的加工方法，然后将内部的环状槽内周面区域6B切断形成圆形凹部1E的环形槽6A包括以下步骤：允许切割刀片33a切割成环形槽内周边区域6B的一端; 然后在工件1和切割刀片33沿加工进给方向线性相对移动的同时将工件1从环形槽内周边区域6B的一端切割到另一端; 然后通过切割刀片33将工件1切断，并使切割刀33和工件1沿与加工进给方向正交的分度方向相对移动。在该方法中，重复上述步骤以形成圆形凹部1E。

8. 发明专利

JP2007036153A Sticking method and apparatus of protective tape for wafer 审中-公开
标题翻译：用于保护带的保护方法和装置
公开(公告)号：JP2007036153A
公开(公告)日：2007-02-08
申请号：JP2005221445
申请日：2005-07-29
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： PRIEWASSER KARL
IPC分类号： H01L21/02 , H01L21/304 , H01L21/683
CPC分类号： H01L21/67132
摘要： PROBLEM TO BE SOLVED: To enable a wafer to which a protective tape has been stuck in an original flat shape without any deformation by eliminating inconveniences, where warpage, or the like is generated in the wafer due to the operation of tension given to the protective tape after sticking the protective tape to the wafer. SOLUTION: The protective tape 20 stocked in a tape cassette 32 while tension has been released is sucked and held by a protective tape suction plate 42, a separation sheet 22 is separated by a separation mechanism 70, and the protective tape suction plate 42 is inserted into a vacuum chamber 60. A wafer suction plate 41 for sucking and holding a wafer 10 is inserted into the vacuum chamber 60, thus allowing a viscous surface 21 of the protective tape 20 to oppose a surface 11 in the wafer 10. The inside of the vacuum chamber 60 is evacuated from this state, the protective tape suction plate 42 is raised, and the protective tape 20 is stuck to the wafer 10. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了使得保护带已经被粘贴在原始平面形状上的晶片没有任何变形，通过消除由于给定的张力的操作而在晶片中产生翘曲等的不便，在将保护带粘贴到晶片之后到保护胶带。
解决方案：当释放张力时，储存在带盒32中的保护带20由保护带吸引板42吸住并保持，分离片22被分离机构70分离，保护带吸附板 42被插入真空室60.用于吸取和保持晶片10的晶片吸引板41被插入到真空室60中，从而允许保护带20的粘性表面21与晶片10中的表面11相对。真空室60的内部从该状态抽出，保护带吸附板42升高，保护带20粘贴在晶片10上。版权所有（C）2007，JPO＆INPIT

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