专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2009094326A Method of grinding wafer 审中-公开
标题翻译：研磨方法
公开(公告)号：JP2009094326A
公开(公告)日：2009-04-30
申请号：JP2007264172
申请日：2007-10-10
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： KAJIYAMA KEIICHI , MASUDA TAKATOSHI , WATANABE SHINYA , AOKI SHIGEHIKO , HOSHIKAWA HIROTOSHI , KOBAYASHI YOSHIKAZU , HARADA SEISHI , YAMAMOTO SETSUO
IPC分类号： H01L21/304 , B24B7/22
CPC分类号： B24D7/18 , B24B1/00 , B24B7/228
摘要： PROBLEM TO BE SOLVED: To produce the gettering effect without reducing the bending strength of devices even if the backside of a wafer is ground.
SOLUTION: In a method of grinding a wafer where the backside of a wafer having a plurality of devices formed on the front surface thereof is ground and free movement of heavy metal is suppressed and the bending strength of the devices is maintained at ≥1,000 MPa by the gettering effect, a grinding wheel to be used in the method has such a configuration that a grinding stone is firmly fixed to the free end of a base, the grinding stone being such that diamond abrasive grains having a grain diameter of ≤1 μm are fastened together using vitrified bond. A protection member is pasted to the front surface of the wafer, and the protection member is held on a chuck table. The grinding wheel is turned by turning the chuck table to grind the backside of the wafer by the grinding stone until an average value of the surface roughness of the backside of the wafer becomes ≤0.003 μm and a distortion layer remaining on the backside of the wafer has a thickness of 0.05 μm.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使晶片的背面被研磨，也可以在不降低器件的弯曲强度的情况下产生吸气效果。解决方案：在研磨晶片的方法中，其中具有形成在其前表面上的多个器件的晶片的背面被研磨并且重金属的自由移动被抑制，并且器件的弯曲强度保持在≥ 通过吸气效果为1000MPa，在该方法中使用的砂轮具有如下结构：磨石牢固地固定在基座的自由端，研磨石使得具有晶粒直径≤ 1微米用玻璃化粘结固定在一起。保护构件被粘贴到晶片的前表面，并且保护构件保持在卡盘台上。通过转动卡盘台来研磨砂轮，通过研磨石研磨晶片的背面直到晶片背面的表面粗糙度的平均值变为≤0.003μm，并且残留在晶片背面的失真层厚度为0.05μm。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2007290101A Vitrified bond grindstone and its manufacturing method 审中-公开
标题翻译：维修粘结磨石及其制造方法
公开(公告)号：JP2007290101A
公开(公告)日：2007-11-08
申请号：JP2006123441
申请日：2006-04-27
申请人： Disco Abrasive Syst Ltd , 株式会社ディスコ
发明人： HOSHIKAWA HIROTOSHI , KOGA HIROMI
IPC分类号： B24D3/18 , B24D3/00 , B24D3/28
摘要： PROBLEM TO BE SOLVED: To provide a vitrified bond grindstone with heightened porosity and a good autogenous blade action by reducing the thickness of a bond bridge, and a manufacturing method thereof.
SOLUTION: This vitrified bond grindstone 2 couples super-abrasives 24 with a vitrified bond, and has infinite pores 22. The super-abrasives 24 are coupled with a foamed bond bridge 21 with thickness of 20 μm or less, and the grindstone has pores 22 surrounded by the bond bridge 21.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过减小粘结桥的厚度来提供具有更高孔隙率和良好的自生叶片作用的玻璃化粘结磨石及其制造方法。
解决方案：该玻璃化磨石2将超磨料24与玻璃化粘合结合，并具有无限孔22.超磨料24与厚度为20μm或更小的泡沫粘结桥21相连，磨石具有由债券桥21包围的毛孔22.版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2012006126A Grinding tool 有权
标题翻译：研磨工具
公开(公告)号：JP2012006126A
公开(公告)日：2012-01-12
申请号：JP2010146030
申请日：2010-06-28
申请人： Disco Corp , 株式会社ディスコ
发明人： NAGAI OSAMU , KUWANA KAZUTAKA , HOSHIKAWA HIROTOSHI , HAYASAKA HIDEKI
IPC分类号： B24D7/10 , B24B55/02 , B24D7/06
摘要： PROBLEM TO BE SOLVED: To provide a grinding tool which can reduce load of maintenance and cost.SOLUTION: A base section 40 on which several grinding stones 419 are arranged and a nozzle 422 for supplying grinding liquid is formed is composed of a first section 41 where the grinding stones 419 are arranged and a second section 42 which is separable from the first section 41 and the nozzle 422 is formed. Only the first section 41 where expendable grinding stones 419 are arranged is handled as an expendable item, and the second section 42 where the nozzle 422 is formed can be used without being replaced.
摘要翻译：要解决的问题：提供可以减少维护和成本的负担的研磨工具。解决方案：在其上布置有多个磨石419的基部40和用于供给研磨液的喷嘴422形成在其上布置有磨石419的第一部分41和可与第一部分42分离的第二部分42 形成第一部分41和喷嘴422。作为一次性物品，仅处理设置有消耗性磨石419的第一部分41，并且可以使用不形成喷嘴422的第二部分42。版权所有（C）2012，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式