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1. 发明专利

JP2008070201A Humidity sensor 有权
标题翻译：湿度传感器
公开(公告)号：JP2008070201A
公开(公告)日：2008-03-27
申请号：JP2006248388
申请日：2006-09-13
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01N27/22 , G01N27/04 , G01N27/12
摘要： PROBLEM TO BE SOLVED: To provide a humidity sensor capable of detecting the relative humidity with high reliability, even in an atmosphere where many miniscule molecules, such as tobacco molecules, float.
SOLUTION: The humidity sensor 10 has a photocatalyst filter 40, which is obtained by spraying a photocatalyst comprising, for example, titanium oxide (TiO
2 ) on a porous filter to coat the porous filter, provided to a case opening 11a so as to cover the case opening 11a. Furthermore, a case 11 housing a humidity detection element 20 is constituted so as to form a recess 12 to the peripheral edge of the case opening 11a, and the photocatalyst filter 40 has a frame member 41, having a protrusion 42 corresponding to the recess 12 of the case 11. The photocatalyst filter 40 is fixed to the case 11, by having the protrusion 42 of the frame member 41 press-fit engagingly in the recess 12 of the case 11.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在诸如烟草分子的许多微小分子浮动的气氛中，提供能够以高可靠性检测相对湿度的湿度传感器。＆lt; P＆gt;解决方案：湿度传感器10具有光催化过滤器40，其通过在多孔过滤器上喷涂包含例如氧化钛（TiO 2 SB 2）的光催化剂以涂覆多孔过滤器而获得，提供到壳体开口11a以覆盖壳体开口11a。此外，容纳湿度检测元件20的壳体11构成为形成到壳体开口11a的周缘的凹部12，光催化剂过滤器40具有框架部件41，具有对应于凹部12的突起部42 通过将框架构件41的突出部42卡合在壳体11的凹部12中，将光催化剂过滤器40固定到壳体11上。（C）2008，JPO＆INPIT

2. 发明专利

JP2008070200A Humidity sensor device 有权
标题翻译：湿度传感器设备
公开(公告)号：JP2008070200A
公开(公告)日：2008-03-27
申请号：JP2006248387
申请日：2006-09-13
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01N27/22
CPC分类号： H01L2224/73204
摘要： PROBLEM TO BE SOLVED: To provide a humidity sensor device constituted so as to reduce the variations in the output characteristics due to the effect of foreign matter exerted on a humidity-sensitive film to detect the humidity accurately.
SOLUTION: The humidity sensor device 100 includes a sensor chip 200, wherein an electrode pad 230 is provided on a humidity-sensitive film forming surface, a circuit board 300 having a land 320 provided on its surface, the bump electrode 400 provided on the electrode pad 230 to electrically connect the electrode pad 230 and the land 320 and an underfill 500 for embedding the gap between the opposed surfaces of the sensor chip 200 and the circuit board 300. Of the underfill 500, the arranging region, excluding the peripheral region of the jointing parts of at least the electrode pad 230, the bump electrode 400 and the land 320 in the underfill 500 contain the same main components as those of the main components which constitute the humidity-sensitive film 216.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种湿度传感器装置，其构成为减少由于施加在湿敏膜上的异物的影响而导致的输出特性的变化以精确地检测湿度。＆lt; P＆gt;解决方案：湿度传感器装置100包括传感器芯片200，其中电极焊盘230设置在湿度感光成膜表面上，电路板300具有设置在其表面上的焊盘320，凸起电极400设置在电极焊盘230上电连接电极焊盘230和焊盘320以及用于在传感器芯片200的相对表面和电路板300之间嵌入间隙的底部填充物500.在底部填充物500中，排列区域底部填充物500中的至少电极焊盘230，突起电极400和焊盘320的接合部的周边区域与构成感温膜216的主要部件的主要部件具有相同的主要部件。（C）2008，JPO＆INPIT

3. 发明专利

JP2006232257A Air-conditioning unit 有权
标题翻译：空调机组
公开(公告)号：JP2006232257A
公开(公告)日：2006-09-07
申请号：JP2005320519
申请日：2005-11-04
申请人： Denso Corp , 株式会社デンソー
发明人： SHIRAISHI HIROAKI , USUI KAZUO , SUGIURA TAKANAO
IPC分类号： B60H1/00 , B60H1/32
CPC分类号： F25B39/02 , F28F2265/30
摘要： PROBLEM TO BE SOLVED: To provide a sensor assembly structure of an air-conditioning unit capable of well demonstrating the vibration absorption effect even when the projecting dimension of a grommet outward of a case is reduced.
SOLUTION: A lead wire 14g of a temperature sensor 14 is inserted in a cylindrically formed grommet 16. A cylindrical seal portion 16a fitted in a hole portion 15 of a case 11 is formed at an end of the grommet 16. The lead wire 14g is fitted relatively displaceably on the inner circumference of the cylindrical seal portion 16a. A cylindrical fixed portion 16d fixed with the lead wire 14g is formed at the other end of the grommet 16. A bellows 16b is formed between the cylindrical seal portion 16a and the cylindrical fixed portion 16d.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使当壳体外部的索环的突出尺寸减小时，也能够提供能够很好地显示振动吸收效果的空调单元的传感器组件结构。解决方案：将温度传感器14的引线14g插入圆柱形的密封件16中。安装在壳体11的孔部分15中的圆柱形密封部分16a形成在护环16的端部。引线线14g相对位移地配合在圆筒形密封部16a的内周上。在导轨14g的另一端形成有固定有引线14g的圆筒形的固定部分16d。在圆柱形密封部分16a和圆柱形固定部分16d之间形成有波纹管16b。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005262989A Temperature detector for heat exchanger 审中-公开
标题翻译：热交换器温度探测器
公开(公告)号：JP2005262989A
公开(公告)日：2005-09-29
申请号：JP2004076995
申请日：2004-03-17
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： B60H1/32 , F25B47/02 , F25B49/02
摘要： PROBLEM TO BE SOLVED: To provide a temperature detector for a heat exchanger capable of detecting the surface temperature of the heat exchanger with high accuracy.
SOLUTION: An infrared ray sensor 20 to detect the surface temperature of an evaporator 10 in a non-contact manner is applied as a temperature detector for the evaporator to detect the surface temperature of the evaporator 10. The surface temperature of the evaporator 10 can be detected with higher accuracy than that of a known temperature sensor while the surface temperature of the evaporator 10 is detected in a non-contact manner. A plurality of infrared ray sensors 20 are arranged in a substantially uniform manner on the leeway side of the evaporator 10, and even when a temperature distribution (the high/low distribution) on the surface of the evaporator 10 is changed, the surface temperature (for example, the lowest temperature) of the evaporator 10 can be detected with high accuracy by one of the infrared ray sensors 20.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够高精度地检测热交换器的表面温度的热交换器的温度检测器。作为用于蒸发器的温度检测器来检测蒸发器10的表面温度，以非接触方式检测蒸发器10的表面温度的红外线传感器20，用于检测蒸发器10的表面温度。蒸发器的表面温度在以非接触的方式检测蒸发器10的表面温度的同时，可以以比已知的温度传感器更高的精度来检测10。多个红外线传感器20在蒸发器10的余留侧基本均匀地配置，即使在蒸发器10的表面上的温度分布（高/低分布）发生变化的情况下，例如，可以通过红外线传感器20之一高精度地检测蒸发器10的最低温度。（C）2005年，JPO＆NCIPI

5. 发明专利

JP2005214738A Sensor and temperature sensor 有权
标题翻译：传感器和温度传感器
公开(公告)号：JP2005214738A
公开(公告)日：2005-08-11
申请号：JP2004020344
申请日：2004-01-28
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01K7/00 , F24F11/02 , F25B49/02 , G01K1/14
摘要： PROBLEM TO BE SOLVED: To provide a temperature sensor improving the reliability of the root part of a harness. SOLUTION: An almost bar-like guide part 28 vertically projecting to a vertical erected wall 20c of a base part 20 is provided. The guide part 28 and the harness 40 are accommodated in a vinyl tube 44, and the harness 40 is fixed to the guide part 28 in a contact condition. Therefore, the harness 40 is hardly bent at the root part taken out from the base part 20 by the rigidity of the guide part 28, and the disconnection of the harness 40 is eliminated. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种提高线束根部的可靠性的温度传感器。解决方案：提供垂直突出到基部20的垂直竖立壁20c的几乎棒状的导向部28。引导部28和线束40容纳在乙烯基管44中，并且线束40在接触状态下固定到引导部28。因此，由于引导部28的刚性，线束40几乎不从基部20取出的根部弯曲，并且线束40的断开被消除。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2010133829A Thermal flow sensor 审中-公开
标题翻译：热流量传感器
公开(公告)号：JP2010133829A
公开(公告)日：2010-06-17
申请号：JP2008310107
申请日：2008-12-04
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01F1/692
摘要： PROBLEM TO BE SOLVED: To provide a thermal flow sensor capable of inhibiting fluctuation of sensor characteristics due to a change in temperature. SOLUTION: The thermal flow sensor includes a sensor chip having a sensing part containing a heater provided on a void region of a substrate via an insulation film and a supporting member to which the sensor chip is fixedly stuck. The sensor chip is fixed to the supporting member with part of a rear face of a heater arrangement surface of the substrate which is part of a region separate from the void region serving as an adhesive region with an adhesive member. A notch opening at least on one of a surface and a rear face of the substrate is formed separately from the void region on a region located between the heater of the sensor chip and the adhesive region on the substrate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够抑制由于温度变化引起的传感器特性波动的热流量传感器。解决方案：热流传感器包括传感器芯片，该传感器芯片具有经由绝缘膜设置在基板的空隙区域上的感应部件和传感器芯片固定在其上的支撑部件。传感器芯片固定到支撑构件上，其一部分基板的加热器布置表面的后表面是与用作粘合剂区域的空隙区域分开的区域的一部分。与位于传感器芯片的加热器和基板上的粘合剂区域之间的区域上的空隙区域形成与基板的表面和背面的至少一个上的切口开口。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2005214739A Sensor and temperature sensor 有权
标题翻译：传感器和温度传感器
公开(公告)号：JP2005214739A
公开(公告)日：2005-08-11
申请号：JP2004020345
申请日：2004-01-28
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01K1/08 , B60H1/32 , F25B49/02
摘要： PROBLEM TO BE SOLVED: To provide a temperature sensor capable of fixing a cylindrical metal case without insert-forming. SOLUTION: The tip of an aluminum case 30 is inserted into a first through-hole 22a of a base part 20, and a flange part 30a of the aluminum case 30 is accommodated in a hollow part 22c of the base part 20. The aluminum case 30 is positioned by abutting a step part 30b on a collision contact part 22 cc. In this state, an opening 30c of the aluminum case 30 is engaged with a hook part 22d, thereby fixing the aluminum case 30 to the base part 20. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够固定圆柱形金属外壳而不插入成型的温度传感器。解决方案：铝壳体30的前端插入基部20的第一通孔22a中，铝壳体30的凸缘部分30a容纳在基部20的中空部分22c中。铝壳体30通过将台阶部分30b抵靠在碰撞接触部分22cc上而定位。在这种状态下，铝外壳30的开口30c与钩部22d接合，从而将铝壳30固定在基部20上。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2015017857A 流量センサ审中-公开
标题翻译：流量传感器
公开(公告)号：JP2015017857A
公开(公告)日：2015-01-29
申请号：JP2013144234
申请日：2013-07-10
申请人：株式会社デンソー , Denso Corp
发明人： USUI KAZUO
IPC分类号： G01F1/684
摘要：【課題】流路に対するセンサチップの位置決めの精度を向上させ、かつ、センサチップに対する回路チップの熱の影響を低減することができる流量センサを提供する。【解決手段】センサアセンブリ21は、回路チップ23が実装されたリードフレーム25と、回路チップ23及びリードフレーム25の一部を封止した本体部26と、センサチップ22が固定されていると共に本体部26から突き出した突き出し部27と、を有している。リードフレーム25は、突き出し部27の先端部39からリードフレーム25の一部が露出した露出部40を有している。そして、露出部40は流路部10の流路11のうち突き出し部27に対向する対向部16に設けられた溝部17に差し込まれることで固定されている。これにより、突き出し部27の位置が固定されると共に、センサアセンブリ21の熱が対向部16に伝達される。【選択図】図1
摘要翻译：要解决的问题：提供一种流量传感器，其中可以提高传感器芯片相对于流路的定位精度，并且可以减少电路芯片的热量对传感器芯片的影响。解决方案：传感器组件21 具有安装有电路芯片23的引线框架25，部分地密封电路芯片23和引线框架25的主体26和固定有传感器芯片22并且从主体26突出的突出部27。引线框架25具有曝光部分40，其中引线框架25的一部分从突出部分27的尖端部分39露出。曝光部分40通过插入到形成在相对部分16中的凹槽部分17中而被固定其从流动通道部分10的流动通道11中与突出部分27相对。以这种方式，不仅突出部分27的位置被固定，而且传感器组件21的热量也被传递到相对的部分 16。

9. 发明专利

JP2014035200A Physical quantity sensor 审中-公开
标题翻译：物理量传感器
公开(公告)号：JP2014035200A
公开(公告)日：2014-02-24
申请号：JP2012174958
申请日：2012-08-07
申请人： Denso Corp , 株式会社デンソー
发明人： SATO KOJI , OTSUKA KIYOSHI , ICHIKAWA YUSUKE , USUI KAZUO , ITO KEIYA , SUZUKI HARUMI
IPC分类号： G01F1/684
摘要： PROBLEM TO BE SOLVED: To provide a physical quantity sensor capable of reducing a variation in a resistance value of a wiring part to temperature.SOLUTION: In a wiring part 14, a resistance value of a first region 14a covered with a protection member 50 is set to be smaller than a resistance value of a second region 14b exposed from the protection member 50. Accordingly, when thermal stress due to a difference in thermal expansion coefficient between a sensor chip 10 and the protection member 50 is caused and the thermal stress is applied to the first region 14a covered with the protection member 50, a variation in resistance value can be reduced in comparison with a case where the resistance value of the first region 14a is equal to the resistance value of the second region 14b. Therefore, the variation in the resistance value of a whole wiring part 14 can be reduced.
摘要翻译：要解决的问题：提供能够减少布线部分的电阻值与温度变化的物理量传感器。解决方案：在布线部分14中，被保护构件50覆盖的第一区域14a的电阻值为设定为小于从保护部件50露出的第二区域14b的电阻值。因此，当由于传感器芯片10和保护部件50之间的热膨胀系数的差异引起热应力，并且热应力为与第一区域14a的电阻值等于第二区域14b的电阻值的情况相比，可以减小与被保护构件50覆盖的第一区域14a的电阻值的变化。因此，可以减少整个布线部14的电阻值的变化。

10. 发明专利

JP2012145496A Air flow rate measurement device 有权
标题翻译：空气流量测量装置
公开(公告)号：JP2012145496A
公开(公告)日：2012-08-02
申请号：JP2011005039
申请日：2011-01-13
申请人： Denso Corp , 株式会社デンソー
发明人： USUI KAZUO
IPC分类号： G01F1/696 , G01F1/68 , G01F1/684 , G01F1/692
摘要： PROBLEM TO BE SOLVED: To provide an air flow rate measurement device with which durability of a membrane of a sensor chip is not deteriorated and flow rate measurement is possible with high accuracy even when airflow is in a large flow rate area.SOLUTION: An airflow measurement device 100 includes: a sensor chip 14 which is constituted by forming a membrane 12 on one end of a semiconductor substrate 11, and having a detection part RK for detecting air flow rate in the membrane 12; and a tubular sub channel 20 which guides a part of airflow to be measured flowing through a main channel 21 to the detection part RK of the sensor chip 14 arranged so as to be exposed to the inside. The airflow measurement device 100 further includes a flow rate calculation element 30 for calculating flow rate of the airflow by inputting a detection signal from the sensor chip 14, and a valve 40 which changes an aperture degree of the sub channel 20; and calculates the detection signal from the sensor chip 14 and information on the aperture degree of the sub channel 20 by the valve 40 together to measure the flow rate of the airflow in the flow rate calculation element 30.
摘要翻译：要解决的问题：为了提供一种空气流量测量装置，其中传感器芯片的膜的耐久性不劣化，并且即使当气流处于大流量区域时也可以以高精度进行流量测量。气流测量装置100包括：传感器芯片14，其通过在半导体基板11的一端上形成膜12，并具有用于检测膜12中的空气流量的检测部RK构成; 以及管状副通道20，其将流过主通道21的被测量气流的一部分引导到布置成暴露于内部的传感器芯片14的检测部RK。气流测量装置100还包括用于通过输入来自传感器芯片14的检测信号来计算气流的流量的流量计算元件30和改变子通道20的开度的阀40; 并且通过阀40计算来自传感器芯片14的检测信号和关于子通道20的孔径度的信息，以测量流量计算元件30中的气流的流量。（C） 2012年，JPO＆INPIT

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