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1. 发明专利

JP2011238760A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2011238760A
公开(公告)日：2011-11-24
申请号：JP2010108529
申请日：2010-05-10
申请人： Denso Corp , 株式会社デンソー
发明人： SONE HIROKI , YAMADA AKIRA , SAKAI TAKESHI , NAKANO TAKASHI , KATADA MITSUTAKA
IPC分类号： H01L27/08 , H01L21/762 , H01L21/822 , H01L21/8234 , H01L27/04 , H01L27/06 , H01L29/06
摘要： PROBLEM TO BE SOLVED: To prevent malfunction of a circuit due to a displacement current which charges or discharges a parasitic capacitor composed of an insulating film between a supporting substrate and an active layer by a dv/dt surge.SOLUTION: On the outer periphery of isolated semiconductor elements constituting a low potential reference circuit LV and a high potential reference circuit HV, an n-type guard ring 42c, and the like, are formed, and a deep n-type diffusion region 42b having the same conductivity type as that of the n-type guard ring buried layer 42c is formed on the buried insulating film 2b side of an active layer 2c. Furthermore, a p-type well 42d, and the like, are formed in an n-type layer 42a, and the like, composed of the active layer 2c, and a semiconductor element is formed in the p-type well 42d. Potentials of the n-type guard ring 42c, and the like, and the p-type well 42d, and the like, are fixed to become reverse bias or the same potential, respectively.
摘要翻译：要解决的问题：为了防止由于通过dv / dt浪涌而在支撑衬底和有源层之间由绝缘膜构成的寄生电容器充电或放电的位移电流来防止电路发生故障。解决方案：在构成低电位参考电路LV和高电位参考电路HV的隔离半导体元件的外周上形成n型保护环42c等，并且形成深n型扩散在有源层2c的埋入绝缘膜2b侧形成具有与n型保护环掩埋层42c相同的导电类型的区域42b。此外，p型阱42d等形成在由有源层2c和半导体层构成的n型层42a中，元件形成在p型阱42d中。 n型保护环42c等的电位和p型阱42d等的电位分别固定为反向偏压或相同的电位。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2008014320A Electric compressor 有权
标题翻译：电动压缩机
公开(公告)号：JP2008014320A
公开(公告)日：2008-01-24
申请号：JP2007247694
申请日：2007-09-25
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： NAKAJIMA MASAFUMI , KATO HIROYASU , SAKAI TAKESHI , SANUKI MASAMI , IRIYAMA KENJI , TSUMAGARI YUICHI , UCHIDA KAZUHIDE
IPC分类号： F04C29/00 , F04C18/02 , H02K5/04 , H02K5/16 , H02K5/24 , H02K7/14
摘要： PROBLEM TO BE SOLVED: To reduce the axial dimension of an electric compressor by positioning at least a part of a compressor mechanism part in a stator.
SOLUTION: In this electric compressor, a crank part 125a and both bearings 126, 127 are positioned in a coil end part 112a, and a thrust receiving surface 112a and a pin 137a (rotation preventing mechanism 137) are positioned outside the stator 123. Consequently, the axial dimension of the electric compressor 100 can be reduced while preventing the thrust receiving surface 112a and the pin 137a (rotation preventing mechanism 137) from being damaged.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过将压缩机构部件的至少一部分定位在定子中来减小电动压缩机的轴向尺寸。解决方案：在该电动压缩机中，曲柄部125a和两个轴承126,127位于线圈端部112a中，并且推力接收表面112a和销137a（防止旋转机构137）位于定子的外侧因此，可以减小电动压缩机100的轴向尺寸，同时防止推力承受面112a和销137a（防止转动机构137）的损坏。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007032577A Composite compressor 有权
标题翻译：复合压缩机
公开(公告)号：JP2007032577A
公开(公告)日：2007-02-08
申请号：JP2006298721
申请日：2006-11-02
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： NAKAJIMA MASAFUMI , KATO HIROYASU , OGAWA HIROSHI , SAKAI TAKESHI
IPC分类号： F04B35/01 , F04B35/00 , F04C29/00
摘要： PROBLEM TO BE SOLVED: To provide a composite compressor capable of harmonizing each characteristic of an engine, an electric motor part, and a compression mechanism mutually. SOLUTION: Driving force (rotation) of the electric motor part 130 is reduced by a gear shift mechanism 180 constituted by a planetary gear mechanism to transmit it to a ring gear 183 connected with a rotor 117 of the compression mechanism 110, and driving force (rotation) of a pulley is increased to transmit it to the ring gear 183. Consequently, discharge capacity V c of the compression mechanism 110 is increased without increasing size of the electric motor part 130, and the compression mechanism 110 can be operated while rotational speed n of the compression mechanism 110 is reduced. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够相互协调发动机，电动机部件和压缩机构的每个特性的复合压缩机。解决方案：通过由行星齿轮机构构成的变速机构180将电动机部件130的驱动力（旋转）减小，将其传递到与压缩机构110的转子117连接的环形齿轮183，以及滑轮的驱动力（旋转）增加以将其传递到环形齿轮183.因此，压缩机构110的放电容量V SB> SB>增加，而不增加电动机部件130的尺寸，并且可以在压缩机构110的转速n减小的同时操作压缩机构110。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2005024210A Vapor compression type refrigerating machine 审中-公开
标题翻译：蒸气压缩式制冷机
公开(公告)号：JP2005024210A
公开(公告)日：2005-01-27
申请号：JP2003270040
申请日：2003-07-01
申请人： Denso Corp , 株式会社デンソー
发明人： KAWAMURA SUSUMU , SAKAI TAKESHI , IWASE AKIHIRO
IPC分类号： F25B1/00 , F25B9/00 , F25B41/00 , F25B47/02
CPC分类号： F25B41/00 , F25B9/008 , F25B47/022 , F25B2309/061 , F25B2341/0012 , F25B2400/23 , F25B2600/2501 , F25B2700/197 , F25B2700/2106 , F25B2700/21175
摘要： PROBLEM TO BE SOLVED: To provide a vapor compression type refrigerating machine capable of optimizing the volume of a hot gas supplied to an evaporator and the volume of the hot gas supplied to a gas-liquid separator 50.
SOLUTION: A fixed restriction 63 is mounted at a liquid-phase refrigerant outlet side of the gas-liquid separator 50. As the fixed restriction 63 is mounted in this invention, the flow rate of the hot gas Q1 supplied to the evaporator 30 and the hot gas Q2 supplied to the gas-liquid separator 50 can be optimized, contrast to that it is difficult to achieve the optimum flow rate in a vapor compression type refrigerating machine free from the fixed restriction 63, since the flow rate of hot gas Q1 supplied to the evaporator 30 and the hot gas Q2 supplied to the gas-liquid separator 50 is determined in the course of nature.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够优化供应到蒸发器的热气体积和提供给气液分离器50的热气体积的蒸气压缩式制冷机。解决方案：固定限制件63安装在气液分离器50的液相制冷剂出口侧。由于在本发明中安装了固定限制器63，所以提供给蒸发器30的热气体Q1的流量和热气体可以将供给气液分离器50的Q2优化，与不进行固定限制63的蒸气压缩式制冷机难以达到最佳流量的对比，因为供给到气液分离器50的热气体Q1的流量在自然过程中确定蒸发器30和供给到气液分离器50的热气Q2。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004361046A Heat pump hot water supply apparatus 审中-公开
标题翻译：热泵热水设备
公开(公告)号：JP2004361046A
公开(公告)日：2004-12-24
申请号：JP2003162325
申请日：2003-06-06
申请人： Denso Corp , 株式会社デンソー
发明人： KAWAMURA SUSUMU , SAKAI TAKESHI , MURAYAMA MASATO , IWASE AKIHIRO
IPC分类号： F24H1/00 , F25B30/02
摘要： PROBLEM TO BE SOLVED: To provide a heat pump hot water supply apparatus, avoiding an operation stop due to an increase in high pressure side pressure of a compressor and surely securing the required hot water supply capability. SOLUTION: This heat pump hot water supply apparatus is provided with a temperature detection means 26 for detecting the high pressure side temperature T of a refrigerant in a heat pump cycle 2. A control means 100 controls the valve opening K of a pressure reducing device 23 or the refrigerant discharge capability of the compressor 21 so that the high pressure side temperature T obtained by the temperature detecting means 26 falls within a predetermined specified temperature range T2 to T1. Even if the valve opening K of the pressure reducing device 23 is opened to a specified opening K1, when the high pressure side temperature T exceeds the upper limit side T1 of the specified temperature range T2 to T1, the refrigerant discharge capability of the compressor 21 is controlled to be changed to decreasing. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种热泵热水供应装置，避免由于压缩机的高压侧压力的增加而导致的操作停止，并确保所需的热水供应能力。解决方案：该热泵热水供给装置设置有用于检测热泵循环2中的制冷剂的高压侧温度T的温度检测装置26.控制装置100控制阀开度K的压力减压装置23或压缩机21的制冷剂排出能力，使得由温度检测装置26获得的高压侧温度T落在预定的规定温度范围T2至T1内。即使减压装置23的开阀K向规定的开度K1打开，当高压侧温度T超过规定温度范围T2〜T1的上限侧T1时，压缩机21的制冷剂排出能力被控制改变为减少。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004144415A Vapor compression type refrigerator 审中-公开
公开(公告)号：JP2004144415A
公开(公告)日：2004-05-20
申请号：JP2002310819
申请日：2002-10-25
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAI TAKESHI , KAWAMURA SUSUMU
IPC分类号： F24H1/00 , F24D17/02 , F25B1/00 , F25B9/00 , F25B30/02
CPC分类号： F24D17/02 , F24D2200/20 , F25B9/008 , F25B30/02 , F25B2309/061
摘要： PROBLEM TO BE SOLVED: To reduce energy consumption of a vapor compression type refrigerator for a water heater. SOLUTION: Air heated by a heater 60 using residual hot water of a bathtub 70 is supplied to an evaporator 40. By this, from a viewpoint of the evaporator 40, a low pressure side refrigerant pressure rises from a broken line state to a solid line state as though outside air temperature has risen. Consequently, a compression ratio of a compressor 10 becomes small, an inclination of an isentropic curve becomes large, and power consumption in the compressor 10, that is, a difference between enthalpy in a suction side and enthalpy in a discharge side of the compressor 10 becomes small. Accordingly, in such an embodiment, the power consumption of the compressor 10 is reduced by effectively using waste heat of conventionally drained hot water of the bathtub 70, and efficiency (a performance factor) of the vapor compression type refrigerator 1 can be improved. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2004116807A Ejector system pressure reducing device 有权
标题翻译：喷射器系统减压装置
公开(公告)号：JP2004116807A
公开(公告)日：2004-04-15
申请号：JP2002277363
申请日：2002-09-24
申请人： Denso Corp , 株式会社デンソー
发明人： KAWAMURA SUSUMU , SAKAI TAKESHI , IWASE AKIHIRO
IPC分类号： F25B1/00
CPC分类号： F25B2341/0012 , F25B2400/23 , F25B2500/01
摘要： PROBLEM TO BE SOLVED: To provide a novel ejector system pressure reducing device improving ejector efficiency by smoothly making a refrigerant flow while restraining the occurrence of a loss such as a vortex loss. SOLUTION: An inner wall forming a passage in a nozzle 41 is composed of a smooth curved surface having no corner part. Particularly, a divergent part 41b is set so that a rate of change of the passage cross-sectional area to the flowing direction of the refrigerant becomes almost constant. A refrigerant passage reaching an outlet of a diffuser 43 from a mixing part 42 is also composed of a smooth curved surface having no corner part. At the same time, the diffuser 43 is expanded by setting the rate of change of the passage cross-sectional area almost constant, and an outer wall surface 41c of the nozzle 41 is formed in a curved surface shape recessed to the inside refrigerant passage side. Thus, since the refrigerant can be made to smoothly flow while restraining the occurrence of the loss, the ejector efficiency can be improved. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种新颖的喷射器系统减压装置，通过平滑地制造制冷剂流动同时抑制诸如涡流损失的损失的发生来提高喷射器的效率。解决方案：在喷嘴41中形成通道的内壁由没有角部的平滑曲面构成。特别地，设置发散部41b，使得通道截面积相对于制冷剂的流动方向的变化率变得几乎恒定。从混合部42到达扩散器43的出口的制冷剂通路也由没有角部的平滑曲面构成。同时，通过使通道横截面积的变化率几乎恒定来扩散扩散器43，并且喷嘴41的外壁面41c形成为向内侧制冷剂通路侧凹入的曲面形状。因此，由于可以使制冷剂在抑制损失的发生的同时平稳地流动，所以能够提高喷射效率。版权所有（C）2004，JPO

8. 发明专利

JP2004085183A Vapor compression type refrigerator 审中-公开
公开(公告)号：JP2004085183A
公开(公告)日：2004-03-18
申请号：JP2003153073
申请日：2003-05-29
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAI TAKESHI , KAWAMURA SUSUMU , OKINOYA TAKESHI , KOJIMA CHIYA , TANAKA KATSUYA
IPC分类号： F24H1/00 , F25B1/00 , F25B30/02 , F25B40/00 , F25B41/00 , F28D7/00
CPC分类号： F25B41/00 , F25B40/00 , F25B2341/0012 , F28D7/0008
摘要： PROBLEM TO BE SOLVED: To improve the efficiency of a vapor compression type refrigerator while suppressing the rise of the cost of manufacture of the refrigerator. SOLUTION: A high-pressure coolant pipe 61 for carrying the coolant flowing out from a radiator 20 is brazed to a low-pressure coolant pipe 62 for carrying the coolant flowing out from an evaporator 40, and the joint part is covered with a heat insulating material 63. According to this, the efficiency of the vapor compression type refrigerator can be improved without providing an exclusive internal heat exchanger. The efficiency of the vapor compression type refrigerator can be improved while suppressing the rise of the cost of manufacture of the refrigerator. Since the pipes 61 and 62 are heat-insulated from the atmosphere by the heat insulating material 63, the heat exchange between the coolant carried in the pipe 62 and the coolant carried in the pipe 61 can be surely performed. Since the pipe 61 is integrated to the pipe 62 by brazing, the contact thermal pressure between both the pipes 61 and 62 can be minimized. COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2014146833A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2014146833A
公开(公告)日：2014-08-14
申请号：JP2014080239
申请日：2014-04-09
申请人： Denso Corp , 株式会社デンソー
发明人： SONE HIROKI , YAMADA AKIRA , SAKAI TAKESHI , NAKANO TAKASHI , KATADA MITSUTAKA
IPC分类号： H01L27/08 , H01L21/762 , H01L21/822 , H01L21/8234 , H01L27/04 , H01L27/06 , H01L29/06 , H01L29/861 , H01L29/868
摘要： PROBLEM TO BE SOLVED: To prevent malfunction of a circuit due to a displacement current which charges or discharges a parasitic capacitor composed of an insulating film between a supporting substrate and an active layer by a dv/dt surge.SOLUTION: On the outer periphery of isolated semiconductor elements constituting a low potential reference circuit LV and a high potential reference circuit HV, an n-type guard ring 42c, and the like, are formed, and a deep n-type diffusion region 42b having the same conductivity type as that of the n-type guard ring buried layer 42c is formed on the buried insulating film 2b side of an active layer 2c. Furthermore, a p-type well 42d, and the like, are formed in an n-type layer 42a, and the like, composed of the active layer 2c, and a semiconductor element is formed in the p-type well 42d. Potentials of the n-type guard ring 42c, and the like, and the p-type well 42d, and the like, are fixed to become reverse bias or the same potential, respectively.
摘要翻译：要解决的问题：为了防止由于由dv / dt浪涌在支撑衬底和有源层之间由绝缘膜构成的寄生电容器充电或放电的位移电流引起的电路的故障。解决方案：在外部形成构成低电位参考电路LV和高电位参考电路HV，n型保护环42c等的隔离半导体元件，以及具有与n型保护环42c相同的导电类型的深n型扩散区42b n型保护环埋层42c形成在有源层2c的埋入绝缘膜2b侧。此外，p型阱42d等形成在p型阱42d中形成的n型层42a等中，由有源层2c和半导体元件构成。 n型保护环42c等的电位和p型阱42d等的电位分别固定为反向偏压或相同的电位。

10. 发明专利

JP2013084903A Semiconductor device comprising lateral element 有权
标题翻译：包含横向元件的半导体器件
公开(公告)号：JP2013084903A
公开(公告)日：2013-05-09
申请号：JP2012154884
申请日：2012-07-10
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAI TAKESHI , YAMADA AKIRA , TAKAHASHI SHIGEKI , ASHIDA YOICHI , SHIRAKI SATOSHI
IPC分类号： H01L29/861 , H01L21/336 , H01L29/06 , H01L29/41 , H01L29/78 , H01L29/786 , H01L29/868
CPC分类号： H01L29/7394 , H01L21/765 , H01L29/0696 , H01L29/0834 , H01L29/404 , H01L29/405 , H01L29/41725 , H01L29/8611 , H01L29/868
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a lateral element capable of reducing breakdown voltage irregularity and increasing product yield.SOLUTION: SRFP21, which is included in a lateral element, such as a lateral FWD, is prepared so as to have impurity concentration of 1×10cmor more. When SRFP21 included in a lateral FWD7 and the like is prepared so as to have the impurity concentration of 1×10cmor more, it becomes possible to reduce breakdown voltage irregularity and manufacture products which can obtain target breakdown voltage appropriately. Accordingly, product yield can be increased.
摘要翻译：要解决的问题：提供一种包括能够降低击穿电压不规则性并提高产品产量的侧向元件的半导体器件。
解决方案：制备包含在横向元件中的SRFP21，例如横向FWD，以使杂质浓度为1×10 18 =“POST”> - 3 或更多。当包含在横向FWD7等中的SRFP21被制备成使杂质浓度为1×10 3 >以上，可以降低击穿电压不规则性，并且可以适当地获得能够获得目标击穿电压的制品。因此，可以提高产品收率。版权所有（C）2013，JPO＆INPIT

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