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1. 发明专利

JP2011208007A Resin composite composition and application thereof 有权
标题翻译：树脂复合组合物及其应用
公开(公告)号：JP2011208007A
公开(公告)日：2011-10-20
申请号：JP2010077025
申请日：2010-03-30
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , TAKAHASHI AKIO
IPC分类号： C08G59/40 , C08G59/20 , C08K3/38 , C08L63/00 , H01L23/14 , H01L23/29 , H01L23/31 , H05K1/03 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a resin composite composition having a glass transition point (Tg) of about 200°C or more, a low coefficient of thermal expansion, and excellent heat dissipation, and a semiconductor sealing material and a substrate using the same.SOLUTION: The resin composite composition includes an epoxy resin, a curing agent, and an inorganic filler, wherein the epoxy resin is a polycyclic aromatic epoxy resin having biphenyl structure, anthracene structure, or naphthalene structure, the curing agent is an aromatic amine, and the inorganic filler includes conifer cone-like hexagonal boron nitride obtained when flaky primary particles are not oriented but aggregated and is 30-85 vol.% of the total resin composite composition.
摘要翻译：要解决的问题：为了提供玻璃化转变点（Tg）为约200℃以上，低热膨胀系数和散热性优异的树脂组合物组合物，以及半导体密封材料和使用其的基板解决方案：树脂复合组合物包括环氧树脂，固化剂和无机填料，其中环氧树脂是具有联苯结构，蒽结构或萘结构的多环芳族环氧树脂，固化剂是芳族胺，并且无机填料包括当片状初级颗粒不取向但聚集时获得的针叶锥形六方氮化硼，并且是总树脂复合组合物的30-85体积％。

2. 发明专利

JP2009302187A Insulated metal base circuit board and hybrid integrated circuit module using the same 有权
标题翻译：绝缘金属基板电路板和混合集成电路模块
公开(公告)号：JP2009302187A
公开(公告)日：2009-12-24
申请号：JP2008152965
申请日：2008-06-11
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , MIYAGAWA KENJI , OGATA YOICHI
IPC分类号： H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide an insulated metal base circuit board for reducing a warpage behavior generated by a thermal load in the packaging process of a substrate, and to provide a hybrid integrated circuit module using the circuit board.
SOLUTION: The insulated metal base circuit board takes a maximum rectangular shape possible in the insulated metal base circuit board where the variation ratio of the circuit occupancy rate of a conductor is not smaller than 0.3 and not larger than 3.0 on a circuit board sectional circuit surface vertical to the rectangular shape. The hybrid integrated circuit module uses the circuit board.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于降低由衬底的封装工艺中的热负荷产生的翘曲行为的绝缘金属基底电路板，并提供使用该电路板的混合集成电路模块。
解决方案：绝缘金属基底电路板在绝缘金属基底电路板中可能具有最大矩形形状，其中导体的电路占用率的变化率在电路板上不小于0.3且不大于3.0 截面电路表面垂直于矩形。混合集成电路模块使用电路板。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2006240955A Ceramic substrate, ceramic circuit board, and power control component using the same 审中-公开
标题翻译：陶瓷基板，陶瓷电路板和使用该电路板的功率控制组件
公开(公告)号：JP2006240955A
公开(公告)日：2006-09-14
申请号：JP2005062287
申请日：2005-03-07
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , IBUKIYAMA MASAHIRO
IPC分类号： C04B37/02 , H01L23/12 , H01L23/13 , H01L23/36 , H05K1/02
CPC分类号： H01L2224/32225 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a ceramic substrate capable of suppressing a solder crack even if a metal heat releasing member (heatsink) which is inexpensive, having high thermal conductivity and a high thermal expansion coefficient typified by a copper heat releasing member is used and to provide a ceramic circuit board and a power control component using the substrate. SOLUTION: In the ceramic substrate formed by joining a metal plate on both main surfaces of a ceramic plate, a non-joined part of the ceramic plate and the metal plate is present on the surface where the metal plate on at least one main surface is placed opposite to the ceramic plate. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题的方案为了提供一种能够抑制焊料裂纹的陶瓷基板，即使廉价的金属散热构件（散热器），具有高导热率和以铜散热构件为代表的高热膨胀系数并且提供使用该基板的陶瓷电路板和功率控制部件。解决方案：在通过在陶瓷板的两个主表面上接合金属板而形成的陶瓷基板中，陶瓷板的非接合部分和金属板之间存在于金属板上的至少一个主表面与陶瓷板相对放置。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2011124244A Insulating metal base circuit board and hybrid integrated circuit module using the same 审中-公开
标题翻译：绝缘金属基板电路板和混合集成电路模块
公开(公告)号：JP2011124244A
公开(公告)日：2011-06-23
申请号：JP2008113815
申请日：2008-04-24
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , MIYAGAWA KENJI , OGATA YOICHI
IPC分类号： H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide an insulating metal base circuit board for reducing warpage behavior generated by a heat load in a substrate packaging process, and also to provide a hybrid integrated circuit module using the insulating metal base circuit board.
SOLUTION: In the insulating metal base circuit board in an optional shape, a conductive circuit is provided on a metal foil with an insulating layer therebetween, 50% or more of measurement values have a circuit occupation ratio of 50% or more, and 20% or below of measurement values have a circuit occupation ratio of 20% or below. The hybrid integrated circuit module uses the insulating metal base circuit board.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于降低基板封装工艺中由热负荷产生的翘曲行为的绝缘金属基底电路板，并且还提供使用绝缘金属基底电路板的混合集成电路模块。解决方案：在可选形式的绝缘金属基底电路板中，在金属箔之间设置有绝缘层的导电电路，其中测量值的50％以上具有50％以上的电路占有率， 20％以下的测定值的电路占有率为20％以下。混合集成电路模块采用绝缘金属基板。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2011119289A Insulating metal base circuit board, and hybrid integrated circuit module using the same 审中-公开
标题翻译：绝缘金属基板电路板和混合集成电路模块
公开(公告)号：JP2011119289A
公开(公告)日：2011-06-16
申请号：JP2008068976
申请日：2008-03-18
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , MIYAGAWA KENJI , OGATA YOICHI
IPC分类号： H05K1/05
CPC分类号： H05K1/05 , H05K1/0271 , H05K2201/09136 , H05K2201/09363 , H05K2201/09781
摘要： PROBLEM TO BE SOLVED: To provide a circuit designing method for reducing warpage behavior generated due to heat load in a substrate mounting step, to provide an insulating metal base circuit board using the method, and to provide a hybrid integrated circuit module using the circuit board.
SOLUTION: The insulating metal base circuit board includes a conductor circuit provided on a metal foil through an insulating layer. The conductor circuit has a circuit occupancy of 50% or more at least on one discretionary cross-section which passes the gravity center of a circuit-side plane of the insulating metal base circuit board and vertical to the circuit plane, and has a maximum possible rectangular shape within the plane of the insulating metal base circuit board, and the ratio of the rectangular shape to the plane of the insulating metal base circuit board is 60% or more.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于在基板安装步骤中减少由于热负荷产生的翘曲行为的电路设计方法，以使用该方法提供绝缘金属基板电路板，并提供使用电路板。解决方案：绝缘金属基底电路板包括通过绝缘层设置在金属箔上的导体电路。导体电路的电路占有率至少在一个通过绝缘金属基板电路板的电路侧平面的重心并垂直于电路平面的任意横截面上，并且具有最大可能绝缘金属基底电路板的平面内的矩形形状，矩形形状与绝缘金属基底电路板的平面的比率为60％以上。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011231196A Resin composite composition and application thereof 有权
标题翻译：树脂复合组合物及其应用
公开(公告)号：JP2011231196A
公开(公告)日：2011-11-17
申请号：JP2010101766
申请日：2010-04-27
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , ARAI TORU , MIYAMA AKIRA , TAKAHASHI AKIO
IPC分类号： C08G59/40 , C08K3/22 , C08K3/38 , C08K5/357 , C08L63/02 , H01L23/29 , H01L23/31 , H01L23/36 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide a resin composite composition about 200°C or higher in glass transition point(Tg), low in a coefficient of thermal expansion, and excellent in heat releasability, and to provide a semiconductor sealing material and a board each using the composition.SOLUTION: The resin composite composition comprises: a benzoxazine derivative represented by the formula (wherein, X is -CH-, -C(CH)- or -SO-); an epoxy resin; and an inorganic filler. In the composition, the molar ratio of the epoxy groups in the epoxy resin to the benzoxazine rings is 0.2-0.7; and the inorganic filler contains a pinecone-shaped hexagonal boron nitride whose flaky primary particles are assembled together without alignment. The inorganic filler accounts for 30-85 vol.% of the whole resin composite composition.
摘要翻译：要解决的问题：为了提供玻璃化转变点（Tg）为200℃以上的树脂组合物组合物，热膨胀系数低，散热性优异，并且提供半导体密封材料和每个使用组合的板子。解决方案：树脂复合组合物包含：由下式表示的苯并恶嗪衍生物（其中X为-CH 2， - （CH 3 ） 2 - 或-SO 2 - ）; 环氧树脂; 和无机填料。在组合物中，环氧树脂中的环氧基与苯并恶嗪环的摩尔比为0.2-0.7; 并且无机填料含有一个松散的六方晶氮化硼，其片状初级颗粒组装在一起而不进行排列。无机填充剂占整个树脂复合材料组合物的30-85体积％。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011124241A Insulating metal base circuit board and hybrid integrated circuit module using the same 审中-公开
标题翻译：绝缘金属基板电路板和混合集成电路模块
公开(公告)号：JP2011124241A
公开(公告)日：2011-06-23
申请号：JP2008097718
申请日：2008-04-04
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI
IPC分类号： H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a circuit designing method for reducing warpage behavior generated by a heat load in a substrate packaging process, and also to provide an insulating metal base circuit board using the circuit designing method, and a hybrid integrated circuit module using the insulating metal base circuit board.
SOLUTION: The insulating metal base circuit board has a conductive metal on a metal foil with an insulating layer therebetween. In the insulating metal base circuit board, the area of the conductive metal is not less than 50% of the area of a circuit surface of the insulating metal base circuit board. In the circuit designing method, an occupation ratio of the area of a circuit part to the area of the conductive metal is not more than 50%. The circuit designing method is applied to the hybrid integrated circuit module. The insulating metal base circuit board is used for the hybrid integrated circuit module.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于降低基板封装工艺中由热负载产生的翘曲行为的电路设计方法，并且还提供使用电路设计方法的绝缘金属基板电路板和混合集成电路模块采用绝缘金属基板。解决方案：绝缘金属基底电路板在其间具有绝缘层的金属箔上具有导电金属。在绝缘金属基底电路板中，导电金属的面积不小于绝缘金属基底电路板的电路面积的50％。在电路设计方法中，电路部分的面积与导电金属的面积的占有率不大于50％。电路设计方法应用于混合集成电路模块。绝缘金属基电路板用于混合集成电路模块。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009302188A Insulated metal base circuit board and hybrid integrated circuit module using the same 审中-公开
标题翻译：绝缘金属基板电路板和混合集成电路模块
公开(公告)号：JP2009302188A
公开(公告)日：2009-12-24
申请号：JP2008152973
申请日：2008-06-11
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , OGATA YOICHI , MIYAGAWA KENJI
IPC分类号： H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide an insulated metal base circuit board for reducing a warpage behavior generated by a thermal load in the packaging process of a substrate, and to provide a hybrid integrated circuit module using the circuit board.
SOLUTION: In the insulated metal base circuit board having a conductor circuit on metal foil via an insulating layer, a conductor circuit metal is formed around an insulated metal base circuit board circuit surface. The hybrid integrated circuit module uses the insulated metal base circuit board.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于降低由衬底的封装工艺中的热负荷产生的翘曲行为的绝缘金属基底电路板，并提供使用该电路板的混合集成电路模块。解决方案：在金属箔上通过绝缘层具有导体电路的绝缘金属基底电路板中，在绝缘金属基底电路板电路表面周围形成导体电路金属。混合集成电路模块采用绝缘金属基板。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2004064050A Module structure and circuit board suitable for it 有权
公开(公告)号：JP2004064050A
公开(公告)日：2004-02-26
申请号：JP2003107270
申请日：2003-04-11
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , KATO KAZUO , IBUKIYAMA MASAHIRO
IPC分类号： H01L23/473 , H01L23/36 , H01L23/373
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a module structure suitable for realizing miniaturization, space saving, and high heat dissipation. SOLUTION: The module structure comprises a circuit board which has a circuit on the front surface thereof and a metal plate on the rear surface thereof, and a heat radiation member provided while facing the metal plate. The rear surface of the circuit board or the metal plate on the rear surface and the heat radiation member form a closed space. The rear surface of the circuit board or the metal plate on the rear surface at the circuit part where an electronic component of the circuit board is mounted is arranged so as to be exposed to the closed space. Further, a gateway for fluid, leading to the closed space, formed at the heat radiation member itself and/or a joining part of the radiation member and the circuit board, is provided. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2005039113A Surface mounting method and hybrid integrated circuit using it 审中-公开
标题翻译：使用它的表面安装方法和混合集成电路
公开(公告)号：JP2005039113A
公开(公告)日：2005-02-10
申请号：JP2003275980
申请日：2003-07-17
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KADOTA KENJI , IBUKIYAMA MASAHIRO , OGATA YOICHI
IPC分类号： H05K3/28 , H01L23/12 , H05K1/05 , H05K1/18 , H05K3/34
CPC分类号： Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit which can prevent generation of an abnormality such as cracking at or in the vicinity of a joining material such as solder or conductive resin even when undergoing repetitive cycles of temperature increase and decrease. SOLUTION: In a surface mounting method for mounting an electronic component on a plurality of circuits on a circuit substrate so as to straddle the circuits, the electronic component is mounted so that an insulating layer (A) is disposed in a gap between the circuits under the electronic component. A hybrid integrated circuit to which the method is applied and a circuit substrate for it are provided. COPYRIGHT: (C)2005,JPO&NCIPI

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