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1. 发明专利

JP2005261960A Blood analyzing device 有权
标题翻译：血液分析装置
公开(公告)号：JP2005261960A
公开(公告)日：2005-09-29
申请号：JP2005126179
申请日：2005-04-25
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： NAGATA RYOHEI , TAKANO ATSUSHI , OSADA YOSHIKAZU , OKA MOTOHIRO
IPC分类号： A61B5/151 , A61B5/145 , A61B5/1468 , A61B5/15 , A61B5/157
摘要： PROBLEM TO BE SOLVED: To provide a convenient blood analyzing device which has a blood collecting mechanism by a method not by sucking, and is equipped with a piercing member, an electrode and a displaying part with regard to the blood analyzing device capable of analyzing a material to be detected contained in the blood such as blood sugar level. SOLUTION: The blood analyzing device is equipped with the blood collection mechanism, the piercing member, the electrode and the displaying part. The blood collection mechanism has a means to congest the finger with blood. The piercing member and the electrode are of cartridge types. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决问题：提供一种方便的血液分析装置，其具有通过不抽吸的方法具有采血机构，并且具有针对血液分析装置的穿刺构件，电极和显示部件分析血液中含有的待检测物质，如血糖值。解决方案：血液分析装置配备有采血机构，穿刺构件，电极和显示部。采血机制有手段使血液充血。穿刺构件和电极是盒式的。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005005484A Plating post type wiring board and its manufacturing method 有权
标题翻译：电镀型接线板及其制造方法
公开(公告)号：JP2005005484A
公开(公告)日：2005-01-06
申请号：JP2003167228
申请日：2003-06-12
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KURAMOCHI SATORU , TAKANO ATSUSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thin multilayered wiring board with high-density wiring which has a good planarity on the most outer surface of a build-up wiring layer including plating posts, has no restriction on the mounting position of an LSI chip, has a wide choice of materials for an insulation layer, can reduce the thickness of the entire package by making a core substrate thin, and has little warp of the substrate; and also to provide a method of manufacturing the same.
SOLUTION: The multilayered wiring board 10 comprises the core substrate 11 and the build-up wiring layer which is such that interconnections are stacked on the core substrate via the insulation layers. A coefficient of thermal expansion in the XY direction of the core substrate 11 is 2-20 ppm, and a core material for the core substrate is selected among silicon, ceramics, glass, glass/epoxy composite material, and metal. The upper and lower interconnections arranged via the insulation layers 13a and 13b are connected by the plating posts 15a and 15b. The thickness of the plating posts is 10-100 μm, and that of the core substrate is 10-150 μm.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种具有在包括电镀柱的积聚布线层的最外表面上具有良好平坦度的高密度布线的薄多层布线板，对于安装位置没有限制 LSI芯片具有绝缘层材料的广泛选择，可以通过使芯基板薄而减少整个封装的厚度，并且基板几乎没有翘曲; 并且还提供其制造方法。解决方案：多层布线板10包括芯基板11和积层布线层，使得互连通过绝缘层堆叠在芯基板上。核心基板11的XY方向的热膨胀系数为2-20ppm，核心基板用芯材选自硅，陶瓷，玻璃，玻璃/环氧复合材料和金属。通过绝缘层13a和13b布置的上下互连通过电镀柱15a和15b连接。电镀柱的厚度为10-100μm，芯基板的厚度为10-150μm。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004349603A Multilayer wiring board and its manufacturing method 有权
公开(公告)号：JP2004349603A
公开(公告)日：2004-12-09
申请号：JP2003147352
申请日：2003-05-26
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： AKAZAWA MIYUKI , KURAMOCHI SATORU , TAKANO ATSUSHI , NAKAYAMA KOICHI , YAMAGUCHI MASATAKA , MORI TOSHIAKI , FUKUOKA YOSHITAKA
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board wherein the freedom of wiring design is high and a high density wiring is possible, and a manufacturing method of manufacturing such a multilayer wiring board readily. SOLUTION: In a multilayer wiring board with a wiring of two or more layers via an electric insulating layer on a core substrate, a core substrate having a plurality of through-holes which are filled with a conductive substance and are conductively connected in front-back sides is used. The opening diameter of the through-hole is in the range of 10 to 100 μm and a through-hole inner wall surface is provided with a conductive substance diffusion preventing layer. The wiring of a first layer formed on the core substrate via an electric insulating layer is connected to the conductive substance filled in the through-hole through a via. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2006005053A Electronic component built-in wafer 有权
标题翻译：电子元件内置波形
公开(公告)号：JP2006005053A
公开(公告)日：2006-01-05
申请号：JP2004178089
申请日：2004-06-16
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： YAMAGUCHI MASATAKA , KURAMOCHI SATORU , TAKANO ATSUSHI
IPC分类号： H01L25/18 , H01G4/33 , H01L23/12 , H01L25/065 , H01L25/07
CPC分类号： H01L24/97 , H01L24/82 , H01L2224/24 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2224/82 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electronic component built-in wafer which can manufacture an electronic component built-in module usable in a plurality of stacks. SOLUTION: The electronic component built-in wafer comprises a wafer board 21 which is zoned for forming a plurality of faces by the dicing area 12 of a predetermined width, an electronic component built-in recess 22 every face formation, an electronic component 31 contained in each recess, and a plurality of wires 25 arranged on a wafer board through an insulating layer 24 so as to be connected with a terminal 32 of the electronic component every face formation. These wires have a bump pad 26 or a wire bonding pad, and a both-side conducting pad 27 at a pointed end thereof. The both-side conducting pad 27 is located in the dicing area and has a fine opening 27a at a substantial center, and the wafer board is exposed to this fine opening 27a. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够制造可用于多个堆叠的电子部件内置模块的电子部件内置晶片。电子部件内置晶片包括晶片板21，其被划分为通过预定宽度的切割区域12形成多个面，电子部件内置凹槽22，每个面形成，电子部件每个凹部中包含的部件31和通过绝缘层24布置在晶片板上的多条导线25，以便每个面形成与电子部件的端子32连接。这些线具有凸块焊盘26或引线接合焊盘，以及位于其尖端的双面导电焊盘27。双面导电焊盘27位于切割区域中并且在大致中心处具有微细开口27a，并且晶片板暴露于该微小开口27a。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005253996A Hemanalysis device 审中-公开
标题翻译： HEMANALYSIS设备
公开(公告)号：JP2005253996A
公开(公告)日：2005-09-22
申请号：JP2005126180
申请日：2005-04-25
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： NAGATA RYOHEI , TAKANO ATSUSHI , OSADA YOSHIKAZU , OKA MOTOHIRO
IPC分类号： A61B5/145 , A61B5/1473 , A61B5/15 , A61B5/151 , A61B5/157
摘要： PROBLEM TO BE SOLVED: To provide a convenient hemanalysis device having a mechanism for drawing blood without suction and including a puncture member, an electrode and a display part.
SOLUTION: This hemanalysis device includes: the blood drawing mechanism; the puncture member; the electrode and the display part, wherein the puncture member includes a puncture blade projected to puncture the skin and returned to the initial position, and the blood drawing mechanism has a means for tightening the punctured region to cause congestion and bleeding.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种方便的血液分析装置，其具有用于抽吸血液并且包括穿刺构件，电极和显示部分的机构。解决方案：该血液分析装置包括：抽血机构; 穿刺构件; 所述电极和所述显示部，其中所述穿刺构件包括突出以刺穿皮肤并返回到初始位置的穿刺刀片，并且所述抽血机构具有用于收紧穿刺区域以引起充血和渗血的装置。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004356160A Method of manufacturing wiring board 有权
公开(公告)号：JP2004356160A
公开(公告)日：2004-12-16
申请号：JP2003148812
申请日：2003-05-27
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： AKAZAWA MIYUKI , KURAMOCHI SATORU , TAKANO ATSUSHI , NAKAYAMA KOICHI , YAMAGUCHI MASATAKA , MORI TOSHIAKI , FUKUOKA YOSHITAKA
IPC分类号： B26F1/28 , H01L23/12 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring board by which a wiring board that is reduced in cross talk noise and provided with coaxial through holes capable of making impedance matching can be manufactured easily by securing high insulation reliability and connection reliability. SOLUTION: This method includes a step of coaxially forming a center fine hole 5 and external cylindrical holes 6 into a core substrate 2 by plasma etching from one surface of the substrate 2, a step of forming diffusion-of-conductive-substance preventing layers 7a and 7b and base conductive layers 8a and 8b on the internal wall surfaces of the holes 5 and 6, and a step of packing conductive substances 9a and 9b in the holes 5 and 6. The method also includes a step of forming a center through hole 5 and external through holes 6 by exposing the packed conductive substances 9a and 9b by polishing the surface of the substrate 2; a step of forming via holes connected to the conductive substance 9a packed in the center through hole 5 and, in addition, insulated from the conductive substance 9b packed in the external through holes 6 and, at the same time, forming wiring through an electrical insulating layer. COPYRIGHT: (C)2005,JPO&NCIPI

7. 发明专利

JP2000249114A BANDLIKE SHEET BODY AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000249114A
公开(公告)日：2000-09-12
申请号：JP5139199
申请日：1999-02-26
申请人： DAINIPPON PRINTING CO LTD
发明人： TAKANO ATSUSHI , KIMA YASUNORI
IPC分类号： B29C59/04 , F15D1/02 , F16L9/14
摘要： PROBLEM TO BE SOLVED: To easily manufacture a sheet body used in manufacturing a fluid incurrent tube capable of reducing in frictional resistance. SOLUTION: A fluid incurrent tube has a tube main body, and a sheet body 12 fixed to an inner surface of the tube main body. The sheet body 12 has a bandlike base member, and protrusion portions 33 disposed on an inner surface of the bandlike base member. A sheet body manufacturing device for manufacturing the sheet body 12 has a sheet supplying portion for supplying the bandlike base member 34, a grooved cylinder 20 having at an outer peripheral portion thereof a plurality of spiral grooves 20a, and for forming a plurality of protrusion portions 33 onto the bandlike base member 34, and winding portion 24 for winding the bandlike sheet body 12 from the grooved cylinder 20.

8. 发明专利

JPH09266889A BODY FLUID ANALYZER 失效
公开(公告)号：JPH09266889A
公开(公告)日：1997-10-14
申请号：JP7906196
申请日：1996-04-01
申请人： DAINIPPON PRINTING CO LTD
发明人： NAGATA RYOHEI , TAKANO ATSUSHI
IPC分类号： A61B5/0205 , A61B5/1473 , A61B5/15 , A61B5/151 , A61B5/14
摘要： PROBLEM TO BE SOLVED: To easily and quickly analyze body fluids by needling a finger, taking out body fluids by pressing the finger by a cuff, determining a measured value by converting necessary information into an electric signal from the obtained body fluids, and displaying it on a display unit. SOLUTION: A body fluid analyzer 1 has a rectangular casing 11, and a fastening part 2, a needling part 3, a display unit 4 and a needling switch 53 are arranged in its casing 11. The fastening part 2 is formed in a cylindrical shape so that a finger can be inserted into it, and a cuff 21 to press the finger is arranged inside the fastening part 2. When the needling switch 53 is turned on, a solenoid is driven, and a needling edge 71 projects from a base body 7 through an arm member. The projected needling edge 71 returns to a former position by the action of a leaf spring 74 after wounding the skin of a fingertip. Squeezed-out body fluids contact with an electrode, and information on the body fluids is sent to a computer as an electric signal, and operation is started. A measured value is determined, and is displayed on a display unit.

9. 发明专利

JP2588524B2 失效
公开(公告)号：JP2588524B2
公开(公告)日：1997-03-05
申请号：JP7346987
申请日：1987-03-27
申请人： DAINIPPON PRINTING CO LTD
发明人： TAKANO ATSUSHI , UMEDA KAZUO , SASAKI OSAMU , ASANO MASAAKI
IPC分类号： B41M5/26 , G03C1/725 , G11B7/24 , G11B7/241 , G11B7/243 , G11B7/254 , G11B7/257

10. 发明专利

JP2521069B2 失效
公开(公告)号：JP2521069B2
公开(公告)日：1996-07-31
申请号：JP28577386
申请日：1986-11-29
申请人： DAINIPPON PRINTING CO LTD
发明人： FUJII HITOSHI , TAKANO ATSUSHI , IIJIMA MASAYUKI
IPC分类号： B41M5/26 , B42D15/10 , G11B7/24 , G11B7/241 , G11B7/243 , G11B7/256 , G11B7/257

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