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    • 2. 发明专利
    • Visual examination method
    • 视觉检查方法
    • JP2008139088A
    • 2008-06-19
    • JP2006323781
    • 2006-11-30
    • Daido Steel Co Ltd大同特殊鋼株式会社
    • SONE TOSHINORITARUOKA EIICHI
    • G01N21/956G01B11/24H01L21/66
    • PROBLEM TO BE SOLVED: To provide a visual examination method which enables the detection of a local flaw with high inspection precision while permitting the size irregularity of an inspection target such as an electrode pattern or the like in the visual examination of a semiconductor emission element or the like.
      SOLUTION: In a case that the planned shape of the inspection target subjected to quality judgment is a linear symmetric shape having at least one symmetric axis, the reference line corresponding to the symmetric axis of the inspection target is set in the image of the inspection target and one image of the inspection target based on the reference line is compared with the other image of the inspection target to judge the quality of the inspection target.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种视觉检查方法,其能够以高检查精度检测局部缺陷,同时在半导体的目视检查中允许诸如电极图案等的检查对象的尺寸不规则 发光元件等。 解决方案:在质量判断的检查对象的计划形状为具有至少一个对称轴的直线对称形状的情况下,将与检查对象的对称轴对应的基准线设定为 将检查对象和基于参考线的检查对象的一个​​图像与检查对象的其他图像进行比较,以判断检查对象的质量。 版权所有(C)2008,JPO&INPIT