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    • 1. 发明专利
    • Copper-based bearing material
    • 铜基轴承材料
    • JP2004108466A
    • 2004-04-08
    • JP2002270992
    • 2002-09-18
    • Daido Metal Co LtdDaido Steel Co Ltd大同メタル工業株式会社大同特殊鋼株式会社
    • SAITO KOJIINOUE EISAKUYOSHIDA HIROAKISUZUKI YOSHITAKE
    • F16C33/12C22C38/00C22C38/18
    • PROBLEM TO BE SOLVED: To provide a copper-based bearing material with a titanium or titanium alloy back plate by a continuous sintering method and a continuous roll pressure-welding method suitable for mass production and manufacturable at a low cost.
      SOLUTION: The back plate 3 is formed of Ti or Ti alloy, and an intermediate layer 4 formed of Fe or Fe-Cr alloy is provided between a copper-based bearing layer 2 and the back plate 3. The direct contact of Ti or Ti alloy with metal liable to form an intermetallic compound or with gas is thereby prevented to suppress the formation of the intermetallic compound or a compound with gas. Furthermore, since Fe and Cr used for the intermediate layer 4 are not liable to form an intermetallic compound with Ti at a heat treatment temperature after sintering and pressure welding of a Cu alloy, the copper-based bearing material 1 using Ti or Ti alloy for the back plate 3 can be manufactured without lowering the strength of the copper-based bearing material 1 by the continuous sintering method or the continuous roll pressure-welding method manufacturable at a low cost while allowing sintering and heat treatment.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:通过连续烧结法和连续辊压焊接方法提供具有钛或钛合金背板的铜基轴承材料,适用于大规模生产并以低成本制造。 解决方案:背板3由Ti或Ti合金形成,并且在铜基轴承层2和背板3之间设置由Fe或Fe-Cr合金形成的中间层4。直接接触 因此,可以防止易于形成金属间化合物或气体的金属的Ti或Ti合金抑制金属间化合物或气体化合物的形成。 此外,由于用于中间层4的Fe和Cr在Cu合金的烧结和压接之后在热处理温度下不易与Ti形成金属间化合物,所以使用Ti或Ti合金的铜基轴承材料1 可以通过连续烧结法或连续辊压焊方法在不降低铜基轴承材料1的强度的情况下以低成本制造背板3,同时允许烧结和热处理。 版权所有(C)2004,JPO
    • 5. 发明专利
    • Substrate for thin film formation
    • 薄膜形成基板
    • JP2003051606A
    • 2003-02-21
    • JP2002161786
    • 2002-06-03
    • Daido Steel Co Ltd大同特殊鋼株式会社
    • SUZUKI YOSHITAKEYOSHIDA HIROAKI
    • C23C16/46H01L31/04
    • Y02E10/548
    • PROBLEM TO BE SOLVED: To provide a substrate for thin film formation excellently forming a thin film without damaging the characteristics and will not generating peel off or the like. SOLUTION: For the substrate 10 for the thin film formation, a stainless steel plate composed of SUS430, for instance, is used as the base material, and an Al layer 16 is formed via an Ni layer 14 on both surfaces of it respectively. That is, a structure where the Ni layer 14 is interposed between the base material 12 and the Al layer 16 as a barrier layer is attained, and at heat treatment for forming an Si thin film for a solar battery, for instance, mutual diffusion occurring between the Al layer 16 and the substrate 12 is prevented, and generation of a weak intermetallic compound, based on the mutual diffusion, is suppressed. Thus, the Al layer 16 is prevented from peeling off from the base material 12.
    • 要解决的问题:为了提供优异地形成薄膜而不损害特性并且不产生剥离等的薄膜形成用基板。 解决方案:对于薄膜形成用基板10,使用例如由SUS430构成的不锈钢板作为基材,分别在其两面经由Ni层14形成Al层16。 也就是说,实现了将Ni层14插入在基材12和Al层16之间作为阻挡层的结构,并且在用于形成用于太阳能电池的Si薄膜的热处理中,例如相互扩散 可防止Al层16与基板12之间的相互扩散产生弱的金属间化合物。 因此,防止Al层16从基材12剥离。
    • 7. 发明专利
    • MANUFACTURING METHOD OF ASYMMETRIC CLAD MATERIAL
    • JP2002144051A
    • 2002-05-21
    • JP2000343040
    • 2000-11-10
    • DAIDO STEEL CO LTD
    • SUZUKI YOSHITAKEYOSHIDA HIROAKI
    • B21B1/22B21D1/05B23K20/04
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of an asymmetric clad material having excellent shape by solving the serious problem of warpage in the case of manufacturing an asymmetric clad material of titanium and stainless steel, in particular, a thin foil, thereby straightening the warpage in the width direction and the warpage in the longitudinal direction. SOLUTION: In this manufacturing method of the asymmetric clad material comprising at least two kinds of metal layers different in thermal physical property, the clad rolled material of at least two kinds of metal is repeatedly subjected to cold rolling and annealing and finished to a desired thickness. Then, the clad material is passed through a tension leveler in an elongated status within 0.2-1.0% range, and the tension annealing is performed while applying the tension in a range of 5-25% of the tensile strength at the temperature in a range of 50-60% of the minimum melting point of dissimilar metal (the melting point of the metal of the lower melting point if no eutectic compound is formed between the joined metals, while the melting point thereof if the eutectic compound is formed).