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1. 发明专利

JP2009041037A Rubber-modified rigid silicone resin 有权
标题翻译：橡胶改性刚性硅树脂
公开(公告)号：JP2009041037A
公开(公告)日：2009-02-26
申请号：JP2008272203
申请日：2008-10-22
申请人： Dow Corning Corp , ダウ・コ−ニング・コ−ポレ−ションDow Corning Corporation
发明人： KATSOULIS DIMITRIS ELIAS , KERYK JOHN ROBERT , MCGARRY FREDERICK JEROME , SCHMIDT RANDALL GENE , SUBRAMANIAN RAMNATH , VINCENT HAROLD LEWIS , ZHU BIZHONG
IPC分类号： C08L83/04 , C08L83/05 , C08L83/07
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/26 , C08G77/70 , C08L83/00
摘要： PROBLEM TO BE SOLVED: To provide a silicone resin excellent in fracture toughness.
SOLUTION: A rubber-modified rigid silicone resin includes a copolymerized reaction product of an organosilicon composition (A) selected from the group consisting of an organosilicon resin (I), a hydrolysable precursor (II) of formula (I), and a hydrolyzate (III) of (II) and a silicone rubber (B), wherein the organosilicon composition (A) and the silicone rubber (B) exist by such relative amounts that the rubber-modified rigid silicone resin has a Young's modulus of at least 6.9×10
8 Pa.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供断裂韧性优异的硅树脂。解决方案：橡胶改性的刚性有机硅树脂包括选自有机硅树脂（I），式（I）的可水解前体（II）的有机硅组合物（A）和式（I）的可水解前体（II）的共聚合反应产物和（II）的水解产物（III）和硅橡胶（B），其中有机硅组合物（A）和硅橡胶（B）的存在量相对于橡胶改性的刚性有机硅树脂的杨氏模量为至少6.9×10 8 Pa。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2011219768A Rubber-modified rigid silicone resin and method of making the same 有权
标题翻译：橡胶改性刚性硅树脂及其制备方法
公开(公告)号：JP2011219768A
公开(公告)日：2011-11-04
申请号：JP2011153138
申请日：2011-07-11
申请人： Dow Corning Corp , ダウコーニングコーポレーションDow Corning Corporation
发明人： KATSOULIS DIMITRIS ELIAS , KERYK JOHN ROBERT , MCGARRY FREDERICK JEROME , SCHMIDT RANDALL GENE , SUBRAMANIAN RAMNATH , VINCENT HAROLD LEWIS , ZHU BIZHONG
IPC分类号： C08L83/04 , C08L83/05 , C08G77/38 , C08L83/07 , C08L83/10
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/26 , C08G77/70 , C08L83/00
摘要： PROBLEM TO BE SOLVED: To provide a silicone resin excellent in fracture toughness.SOLUTION: The rubber-modified rigid silicone resin comprises a reaction product obtained by copolymerizing: (A) an organosilicon composition selected from (I) an organosilicone resin, (II) a hydrolyzable precursor of formula (I), and (III) a hydrolysate formed of (II); and (B) a silicone rubber, in a relative amount to make the prepared rubber-modified silicone resin have 6.9×10Pa Young's modulus.
摘要翻译：要解决的问题：提供断裂韧性优异的硅树脂。橡胶改性的刚性有机硅树脂包括通过共聚合获得的反应产物：（A）有机硅组合物，其选自（I）有机硅氧烷树脂，（II）可水解的式（I）前体和（III ）由（II）形成的水解产物; 和（B）硅橡胶，其相对量使得制备的橡胶改性的有机硅树脂的比例为6.9×10 -6 Pa杨氏模量。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011252175A Silicone composition, method for the preparation thereof and silicone elastomer 审中-公开
标题翻译：硅酮组合物，其制备方法和硅氧烷弹性体
公开(公告)号：JP2011252175A
公开(公告)日：2011-12-15
申请号：JP2011204538
申请日：2011-09-20
申请人： Dow Corning Corp , ダウコーニングコーポレーションDow Corning Corporation
发明人： LEE YEONG-JOO , LIVINGSTON MICHAEL DEAN , ZHANG HONGXI , SCHMIDT RANDALL GENE
IPC分类号： C08L83/07 , C08K3/00 , C08K5/5415 , C08L83/04 , C08L83/05 , H01L23/29
CPC分类号： H01L23/296 , C08G77/12 , C08G77/16 , C08G77/20 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , C08L83/00 , C08L2666/44 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a silicone composition that is small in coefficient of thermal expansion and modulus in the temperature range corresponding to the amorphous-crystalline phase transition temperature from -50 to -40°C, is free of stickiness, shrinkage and the like after curing, and is suitable for use as encapsulants in chip scale packages.SOLUTION: A silicone composition comprises: (A) 100 pts.wt. of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 75 to 150 pts.wt. of an organopolysiloxane resin having a number-average molecular weight of from 2,000 to 5,000 and comprising RRSiOunits and SiOunits, wherein each Ris independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation group, Ris selected from Rand alkenyl, the mole ratio of RRSiOunits to SiOunits is from 0.6:1 to 1.1:1, and the resin contains an average of from 2.5 to 7.5 mol% of alkenyl groups; (C) an organohydrogenpolysiloxane having an average of at least three silicon-bonded hydrogen atoms per molecule in an amount to provide from one to three silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; (D) an adhesion promoter in an amount to effect adhesion of the composition to a substrate; and (E) a hydrosilylation catalyst in an amount to cure the composition.
摘要翻译：要解决的问题：为了提供对应于-50至-40℃的非晶相转变温度的温度范围内的热膨胀系数和模量小的硅酮组合物，没有粘性，固化后的收缩等，适用于芯片级封装中的密封剂。解决方案：硅氧烷组合物包含：（A）100重量份的每分子平均含有至少两个硅键合的烯基的聚二有机硅氧烷; （B）75〜150重量份的数均分子量为2,000至5,000的有机聚硅氧烷树脂，并且包含R 2 “POST”> 4 SiO 1/2 单位和SiO 4/2 单位，其中每个R 3 独立地选自不含脂肪族不饱和基团的一价烃和一价卤代烃基，R 4 “POST”> 3 和烯基，R 3的摩尔比 2 R 4/2 单位，“> 4 SiO 1/2 为0.6：1至1.1： 1，树脂平均含有2.5〜7.5摩尔％的烯基; （C）每分子平均具有至少三个与硅键合的氢原子的有机氢聚硅氧烷，其量在组合物（A）和（B）中每个烯基上提供一至三个与硅键合的氢原子; （D）粘合促进剂，其量使组合物粘附到基材上; 和（E）固化组合物的量的氢化硅烷化催化剂。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JPH10195308A ORGANIC POLYMER MODIFIED WITH THERMOPLASTIC RESIN AND SILICONE BLEND 失效
公开(公告)号：JPH10195308A
公开(公告)日：1998-07-28
申请号：JP23300897
申请日：1997-08-28
申请人： DOW CORNING
发明人： CHEN WEI , LUPTON KEVIN EDWARD , ROMENESKO DAVID JOSEPH , SCHMIDT RANDALL GENE , ZHANG HONGXI
IPC分类号： C08L23/00 , C08L23/02 , C08L33/06 , C08L39/02 , C08L67/02 , C08L75/04 , C08L77/00 , C08L83/04 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To obtain a composition which can give a highly hydrophobic molding when extruded or injected through a metallic die by mixing a thermoplastic resin with a specified silicone blend in a specified mixing ratio. SOLUTION: This composition comprises 100 pts.wt. thermoplastic resin selected among polyolefins, etc., and 0.3-10 pts.wt. silicone mixture containing an organosilicon resin of formula I [wherein a and d are positive numbers; b and c are each 0 or a; the sum of a to d is 1; 0 =0.8 and R' is OH or an alkyl, and at least 60% of R's are CH3 groups) in such relative amounts that the resulting blend has a specified dynamic shear modulus. When the composition is molded, the silicone blend migrates to the surface of the thermoplastic resin to give hydrophobicity and the suitability for casting to the entire.

5. 发明专利

JPH10212410A RUBBER-MODIFIED HARD SILICONE RESIN 失效
公开(公告)号：JPH10212410A
公开(公告)日：1998-08-11
申请号：JP28598
申请日：1998-01-05
申请人： DOW CORNING
发明人： KATSOULIS DIMITRIS ELIAS , KERYK JOHN ROBERT , MCGARRY FREDERICK JEROME , SCHMIDT RANDALL GENE , SUBRAMANIAN RAMNATH , VINCENT HAROLD LEWIS , ZHU BIZHONG
IPC分类号： C08L83/05 , C08L83/04 , C08L83/07
摘要： PROBLEM TO BE SOLVED: To obtain the subject silicone resin improved in fracture toughness, comprising a reaction product prepared by copolymerizing a specific organosilicon composition with a prescribed silicone rubber in specified relative amounts. SOLUTION: This silicone resin comprises a reaction product obtained by copolymerizing (A) an organosilicon composition selected from (i) an organosilicone resin of formula I [(a) is a positive number; (b) and (c) are each, a positive number and 0.8 to R are each H, OH, a monofunctional group such as an alkyl (oxy), an alkenyl, an alkoxy, oxy, etc.], (ii) a hydrolyzable precursor of the component (i) and (iii) a hydrolyzate formed from the component (ii) and a silicone rubber of formula II (R is an alkyl or an aryl; R is H, OH, a monofunctional group such as an alkenyl, an alkoxy or an alkyloxy, etc.,; (p) is 1-3; (q) is 1 or 2; (x) is >=6; (y) is 0-10) in a relative amount to make the prepared rubber-modified silicone resin have 6.9×10 Pa Young's modulus.

6. 发明专利

JP2000129132A SILICONE COMPOSITION, ITS PRODUCTION AND SILICONE ELASTOMER 失效
公开(公告)号：JP2000129132A
公开(公告)日：2000-05-09
申请号：JP30563599
申请日：1999-10-27
申请人： DOW CORNING
发明人： LEE YEONG-JOO , LIVINGSTON MICHAEL DEAN , ZHANG HONGXI , SCHMIDT RANDALL GENE
IPC分类号： C08L83/07 , C08L83/04 , C08L83/05 , H01L23/29
摘要： PROBLEM TO BE SOLVED: To obtain a silicone composition suitable for the use as an encapsulant or the like for a chip-scale package. SOLUTION: This silicone composition comprises (A) 100 pts.wt. polydiorganosiloxane having two or more alkenyl groups bonded to silicon per molecule in average, (B) 75-150 pts.wt. organopolysiloxane resin having 2,000-5,000 Mn, comprising an R32R4SiO1/2 unit and an SiO4/2 unit [each R3 is independently selected from a monovalent hydrocarbon group and a monovalent halogenated hydrocarbon group not containing an aliphatic unsaturated group; R4 is selected from R3 and an alkenyl group; the molar ratio of the R32R4SiO1/2 unit to the SiO4/2 unit is (0.6:1)-(1.1:1)] and containing 2.5-7.5 mol% alkenyl group in average in the resin, (C) an organohydrogenpolysiloxane capable of providing 1-3 hydrogens bonded to the silicon per alkenyl group in the components A and B, (D) an adhesion promoter, and (E) a hydrosilylation catalyst.

7. 发明专利

JPH10120794A PRODUCTION OF NON-SOLVENT, THERMOPLASTIC SILICONE PELLET 失效
公开(公告)号：JPH10120794A
公开(公告)日：1998-05-12
申请号：JP23260397
申请日：1997-08-28
申请人： DOW CORNING
发明人： COOK LEON NEAL , HESSICK JR RICHARD ALLEN , LUPTON KEVIN EDWARD , ROMENESKO DAVID JOSEPH , SCHMIDT RANDALL GENE , ZHANG HONGXI
IPC分类号： B29B9/12 , B29C47/00 , C08J3/12 , C08J3/20 , C08L83/04
摘要： PROBLEM TO BE SOLVED: To obtain the subject pellets of high bulk density and excellent handleability by homogeneously mixing specific different kinds of silicone resins at a specific ratio, forming a dense block by compression-molding the mixture at a specific temperature and pelletizing the dense block at a specific temperature. SOLUTION: (A) An organosilicon resin having a formulation represented by formula I (a, d>0; b, c>=0; a+b+c+d=1; 0 =0.8; R' is R] and a polymerization degree of >=10 are homogeneously mixed at such a ratio that the complex viscosity of the mixture becomes cp at the compression molding temperature (Tm), and the dynamic shear elasticity of the objective pellet becomes >=5×10 dyne/cm at 10radian/sec frequency and a temperature lower than the schedules maximum storage temperature (Ts), and then compression- molded at Tm to form a dense polymer block, which is cooled down at a temperature lower than Ts and pelletized.

8. 发明专利

JPH10195387A CURABLE SILICONE RELEASE COATING COMPOSITION 失效
公开(公告)号：JPH10195387A
公开(公告)日：1998-07-28
申请号：JP27798
申请日：1998-01-05
申请人： DOW CORNING
发明人： CHUNG KYUHA , EKELAND ROBERT ALAN , SCHMIDT RANDALL GENE
IPC分类号： C09K3/00 , C09D183/04 , C09D183/05 , C09D183/07 , C09J7/02 , C09J121/00 , C09J133/00 , C09J183/04 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a silicone release coating having high releasability. SOLUTION: This composition comprises (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) a linear organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom; (C) a siloxane resin represented by the formula: (R3 SiO1/2 )a (HR2 SiO1/2 )b (SiO4/2 )c , wherein R represents a monovalent 1-10C hydrocarbon group, a is a number of 1 to 25, b is a number of 2 to 10 and c is a number of 1 to 50, wherein, when a monovalent R3 SiO1/2 unit and a HR2 SiO1/2 unit are represented by M unit and a tetravalent SiO4/2 unit is represented by Q unit, a molar ratio of M unit to Q unit is 0.6/1 to 4/1; and (D) a platinum group metal catalyst.

9. 发明专利

JPH10140006A DISPERSION OF SILICONE COMPOSITION IN ORGANIC THERMOPLASTIC MATERIAL 失效
公开(公告)号：JPH10140006A
公开(公告)日：1998-05-26
申请号：JP23222097
申请日：1997-08-28
申请人： DOW CORNING
发明人： CHEN WEI , LUPTON KEVIN EDWARD , ROMENESKO DAVID JOSEPH , SCHMIDT RANDALL GENE , ZHANG HONGXI
IPC分类号： C08J3/07 , C08L23/00 , C08L83/04 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide a method for uniformly and physically dispersing a silicone composition in an organic thermoplastic material by forming a fine silicone domain by previously forming a organic silicone resin alloy by intimately blending an organic silicone resin with linear silicone fluid. SOLUTION: The method for dispersing silicone composition comprises a step for substantially uniformly blending (A) an organic silicone resin of formula I [(a) and (d) are each positive number; (b) and (c) are 0 or a positive number with the proviso that (a)+(b)+(c)+(d)=1 and 0 =0.8; R' is H, hydroxy, etc.; a polymerization number of component B is larger than 10} to form an organic silicone resin alloy, and a step for mixing the silicone resin alloy with an organic thermoplastic material at a prescribed temperature and shearing strain rate.

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