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    • 2. 发明专利
    • Silicone composition, method for the preparation thereof and silicone elastomer
    • 硅酮组合物,其制备方法和硅氧烷弹性体
    • JP2011252175A
    • 2011-12-15
    • JP2011204538
    • 2011-09-20
    • Dow Corning Corpダウ コーニング コーポレーションDow Corning Corporation
    • LEE YEONG-JOOLIVINGSTON MICHAEL DEANZHANG HONGXISCHMIDT RANDALL GENE
    • C08L83/07C08K3/00C08K5/5415C08L83/04C08L83/05H01L23/29
    • H01L23/296C08G77/12C08G77/16C08G77/20C08L83/04H01L2924/0002H01L2924/09701C08L83/00C08L2666/44H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a silicone composition that is small in coefficient of thermal expansion and modulus in the temperature range corresponding to the amorphous-crystalline phase transition temperature from -50 to -40°C, is free of stickiness, shrinkage and the like after curing, and is suitable for use as encapsulants in chip scale packages.SOLUTION: A silicone composition comprises: (A) 100 pts.wt. of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 75 to 150 pts.wt. of an organopolysiloxane resin having a number-average molecular weight of from 2,000 to 5,000 and comprising RRSiOunits and SiOunits, wherein each Ris independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation group, Ris selected from Rand alkenyl, the mole ratio of RRSiOunits to SiOunits is from 0.6:1 to 1.1:1, and the resin contains an average of from 2.5 to 7.5 mol% of alkenyl groups; (C) an organohydrogenpolysiloxane having an average of at least three silicon-bonded hydrogen atoms per molecule in an amount to provide from one to three silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; (D) an adhesion promoter in an amount to effect adhesion of the composition to a substrate; and (E) a hydrosilylation catalyst in an amount to cure the composition.
    • 要解决的问题:为了提供对应于-50至-40℃的非晶相转变温度的温度范围内的热膨胀系数和模量小的硅酮组合物,没有粘性, 固化后的收缩等,适用于芯片级封装中的密封剂。 解决方案:硅氧烷组合物包含:(A)100重量份 的每分子平均含有至少两个硅键合的烯基的聚二有机硅氧烷; (B)75〜150重量份 的数均分子量为2,000至5,000的有机聚硅氧烷树脂,并且包含R 2 “POST”> 4 SiO 1/2 单位和SiO 4/2 单位,其中每个R 3 独立地选自不含脂肪族不饱和基团的一价烃和一价卤代烃基,R 4 “POST”> 3 和烯基,R 3的摩尔比 2 R 4/2 单位,“> 4 SiO 1/2 为0.6:1至1.1: 1,树脂平均含有2.5〜7.5摩尔%的烯基; (C)每分子平均具有至少三个与硅键合的氢原子的有机氢聚硅氧烷,其量在组合物(A)和(B)中每个烯基上提供一至三个与硅键合的氢原子; (D)粘合促进剂,其量使组合物粘附到基材上; 和(E)固化组合物的量的氢化硅烷化催化剂。 版权所有(C)2012,JPO&INPIT