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    • 1. 发明专利
    • AUTOMATIC PRECISION POSITIONING SYSTEM
    • JPS60177647A
    • 1985-09-11
    • JP3257684
    • 1984-02-24
    • DISCO ABRASIVE SYSTEMS LTD
    • TAMURA SHINICHIUGA MASANORI
    • H01L21/301G03F9/00H01L21/78
    • PURPOSE:To enable to precisely position a wafer by a method wherein the relative position of the image of the wafer and the linear region in a memory are detected by a system other than a pattern matching system and the wafer is subjected to a primary positioning, and after that, the relative position is detected by the pattern matching system and the wafer is subjected to a secondary positioning. CONSTITUTION:A wafer 2 is held on a movable stand 4, part of the surface of the wafer 2 is enlarged 26 and picked up, the concentration signal of lattice state array picture elements in the image is undergone an A/D conversion 32 and the concentration signal converted is stored in an image frame memory 34. An arithmetic processing 40 of a differentiation 44, a threshold processing and a parity check 48 is performed to the memory 34 to make a binary digital signal, which is memorized in a CPU36, and the relative position of a linear region 18 to the image is detected 42 by said signal. Successively, when the wafer is remaining unchanged on the prescribed position, a key pattern 56, a subkey pattern 57 and the positions thereof, which are displayed on each left and right part of a display screen 50, are memorized 52. The pattern in the image same as the key pattern is detected 54 on the basis of the memories 34 and 52, the matching degree is calculated 36 and the linear region 18 is made to match while the driving 21 of the stand 4 is controlled 64. According to this constitution, the automatic positioning of the wafer can be performed fully, rapidly and accurately.
    • 2. 发明专利
    • AUTOMATIC PRECISE POSITIONING SYSTEM
    • JPS6054454A
    • 1985-03-28
    • JP16203183
    • 1983-09-05
    • DISCO ABRASIVE SYSTEMS LTD
    • TAMURA SHINICHIUGA MASANORI
    • H01L21/301G03F9/00H01L21/78
    • PURPOSE:To automatically position articles to be treated by obtaining a density signal of a picture element of a latticelike array from an image of two portions of the prescribed interval in x direction of a wafer, and detecting the position of a linear region by the binary digital signal formed by converting the density signal. CONSTITUTION:Images of two portions in x direction of a wafer 2 held by a holder 4 are expanded by an expander 26 through holes 30a, 30b, photographed by a photograph 28, a signal which represents a picture element density is A/D-converted by an A/D converter 32, and a multivalue digital signal is stored in a memory 34. This signal is processed by a processor 40 in response to the selection of an operator under the control of a CPU36, first differentiated by a differentiator 42, intensified in the variation in the density, processed in the prescribed slicing width SW, converted into a binary value 44, inspected in coincidence by a detector 46, detected by a detector 50 at the deviation from the center of the width of the region whether the linear line of a linear region 8a is disposed at the upper or lower edge of the region 8a, and controlled and driven by a driver 52 by moving units 14, 16, 18 in x-, y- and theta-directions, respectively. According to this structure, the linear regions 8a, 8b are precisely and reliably positioned automatically to the center of the image in the x- and y-directions.
    • 4. 发明专利
    • METHOD AND APPARATUS FOR DETECTING CONTAMINATION
    • JPH11173993A
    • 1999-07-02
    • JP34013897
    • 1997-12-10
    • DISCO ABRASIVE SYSTEMS LTD
    • TAMURA SHINICHISEKIYA KAZUMA
    • G01N21/88G01N21/94G01N21/956H01L21/66
    • PROBLEM TO BE SOLVED: To obtain a method and an apparatus which can detect a contamination quickly and surely and which can enhance the productivity of a semiconductor wafer by imaging the same part on the surface of the semiconductor wafer in a plurality of different illuminating operations and comparing image-processed result. SOLUTION: Any light source is selected from between a first light source part 23 and a second light source part 24 which constitute an illumination means 17, and semiconductor wafer W is irradiated with light. Reflected light from the surface of the semiconductor wafer W is captured by an optical means 18 so as to be transduced into an electric signal by an imaging means 19. Then, an image processing operation is executed by an image processing means 20, and its image information is stored in a first storage means 21. Then, the same part on the surface of the semiconductor water light which is different from the first light, the same part on the surface of the semiconductor wafer W is irradiated again with, and an image which is acquired in the same manner is stored in a second storage means 22. Then, both stores results are compared or superposed, and a contamination is detected. In this manner, regarding the same part on the surface of the semiconductor wafer W, a plurality of images in which the angle of irradiation, the luminance, the color and the like of the light are different are compared. As a result, even when the contamination is assimilated with the surface the contamination can be detected quickly and surely.