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    • 9. 发明专利
    • SEMICONDUCTOR DEVICE LEAD FRAME
    • JPH0336755A
    • 1991-02-18
    • JP17160389
    • 1989-07-03
    • DAINIPPON PRINTING CO LTD
    • SAGARA HIDEJIFUSE MASAHIROYAGI YUTAKAIZUMIDA KAZUO
    • H01L23/50
    • PURPOSE:To provide a great number of inner leads with pins without being limited by sizes of a mounting semiconductor device and a die pad by employing a specific intermediate connector structure on which an intermediate wiring pattern connected to the inner lead is formed, as a constituent member of the lead frame. CONSTITUTION:In an intermediate connector structure 100, a device hole 20 as a die pad part of a semiconductor device is formed through an insulating film 14 at the center of the same, and an intermediate wiring pattern 13 is formed from the periphery of the hold toward the outer peripheral part of the insulating film 14, and further the insulating film is not existent in the vicinity of the peripheral edge part of the isolating film and a conductor part 12 is exposed. Further, there is provided a bonding window 17 for connecting the intermediate wiring pattern 13 and the inner lead of the lead frame. Bonding of the intermediate wiring pattern 13 and the inner lead 11 of the lead frame is performed by a thermocompression bonding process.