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1. 发明专利

JP2012023328A Semiconductor light-emitting element and manufacturing method of the same 审中-公开
标题翻译：半导体发光元件及其制造方法
公开(公告)号：JP2012023328A
公开(公告)日：2012-02-02
申请号：JP2010254668
申请日：2010-11-15
申请人： Citizen Electronics Co Ltd , Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , シチズン電子株式会社
发明人： SATO TAKAHIKO , TANMACHI KAZUAKI
IPC分类号： H01L33/62 , H01L21/60
CPC分类号： H01L27/15 , H01L24/97 , H01L33/62 , H01L2224/14 , H01L2924/01322 , H01L2924/18161 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element and a manufacturing method of the same capable of omitting a protection element because if a protection element is flip chip mounted on a circuit board, the surrounding area of the protection element becomes dark, while an LED element can be mounted on a circuit board with a protection element because it is easily destroyed by static electricity and it is preferable to flip chip mount an LED element and a protection element on a circuit board, considering heat dissipation, productivity, and mounting area efficiency.SOLUTION: An LED element 13, flip chip mounted on a circuit board 12, comprises an n-side bump 23 as a cathode and a p-side bump 24 as an anode, and a varistor 26 is filled between the n-side bump 23 and the p-side bump 24. As a result, the static electricity countermeasures of the LED element 13 made by the varistor 26 remove the need of the protection element for the circuit board 12.
摘要翻译：要解决的问题：为了提供能够省略保护元件的半导体发光元件及其制造方法，因为如果保护元件被倒装芯片安装在电路板上，则保护元件的周围区域由于容易被静电破坏，LED元件可以安装在具有保护元件的电路板上，并且考虑到散热，优选将LED元件和保护元件倒装在电路板上，生产率和安装面积效率。解决方案：安装在电路板12上的LED元件13，倒装芯片包括作为阴极的n侧凸块23和作为阳极的p侧凸块24，并且在n型凸块23之间填充压敏电阻26。侧凸块23和p侧凸块24.结果，由变阻器26制成的LED元件13的静电对策不需要电路板12的保护元件。（C） 2012年，JPO＆INPIT

2. 发明专利

JP2013089667A Semiconductor light-emitting element 有权
标题翻译：半导体发光元件
公开(公告)号：JP2013089667A
公开(公告)日：2013-05-13
申请号：JP2011226679
申请日：2011-10-14
申请人： Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： KINOSHITA YOSHIMASA , TANMACHI KAZUAKI
IPC分类号： H01L33/36
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element which is resistant to peeling at an opening of an insulation film covering a semiconductor layer even when a stress is applied from the outside to an electrode for connection.SOLUTION: A semiconductor light-emitting element comprises: a p-type semiconductor layer 13 and an n-type semiconductor layer 12 which are connected to a p-side and n-side bump electrodes 17 and 18 by intermediate wirings 19 and 15; and an insulation layer 14 including p-side and n-side openings 19a and 15a which do not overlap the p-side and n-side bump electrodes 17 and 18 in a planar view. As a result, a stress does not concentrate on the openings 19a and 15a and the openings 19a and 15a are resistant to peeling.
摘要翻译：要解决的问题：提供即使当从外部向连接用电极施加应力时，也能够在覆盖半导体层的绝缘膜的开口处耐剥离的半导体发光元件。解决方案：半导体发光元件包括：p型半导体层13和n型半导体层12，其通过中间布线19连接到p侧和n侧凸块电极17和18，并且 15; 以及包括在平面图中不与p侧和n侧凸块电极17和18重叠的p侧和n侧开口19a和15a的绝缘层14。结果，应力不集中在开口部19a，15a上，开口部19a，15a不能剥离。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2011138913A Semiconductor light-emitting element and method for manufacturing the same 审中-公开
标题翻译：半导体发光元件及其制造方法
公开(公告)号：JP2011138913A
公开(公告)日：2011-07-14
申请号：JP2009297736
申请日：2009-12-28
申请人： Citizen Electronics Co Ltd , Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , シチズン電子株式会社
发明人： SATO TAKAHIKO , SEKIGUCHI TORU , TANMACHI KAZUAKI , KINOSHITA YOSHIMASA
IPC分类号： H01L33/32 , H01L21/60 , H01L33/40
摘要： PROBLEM TO BE SOLVED: To solve the following problem: gold-tin eutectic bonding is unstable when a semiconductor light-emitting element having an Au bump formed on a semiconductor layer by electrolytic plating and an Sn layer further formed thereon is flip-chip mounted on a circuit board with a gold finish. SOLUTION: In the semiconductor light-emitting element 10, an Au bump 46, an Sn layer 47 and an Au layer 48 are laminated on a bump 14 from the semiconductor side. As a result, oxidation of the Sn layer is prevented, and Au is uniformly spread, whereby the eutectic bonding is stabilized. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决以下问题：当通过电解电镀形成在半导体层上的具有Au凸块的半导体发光元件和进一步形成在其上的Sn层时，金锡共晶接合不稳定，芯片安装在具有金色表面的电路板上。解决方案：在半导体发光元件10中，从半导体侧将凸块14层叠Au凸块46，Sn层47和Au层48。结果，防止了Sn层的氧化，并且Au均匀地扩散，从而使共晶结合稳定。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2012256678A Semiconductor light-emitting element manufacturing method 有权
标题翻译：半导体发光元件制造方法
公开(公告)号：JP2012256678A
公开(公告)日：2012-12-27
申请号：JP2011128232
申请日：2011-06-08
申请人： Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： TANMACHI KAZUAKI , ISHII HIROHIKO
IPC分类号： H01L33/44 , H01L33/38
摘要： PROBLEM TO BE SOLVED: To provide an easy and efficient manufacturing method of an LED element equipped with connection electrodes with a mother board on an LED die bottom face, in which it is favorable that the connection electrodes protrude for relaxing implementation limits against dust and burrs.SOLUTION: A semiconductor light-emitting element manufacturing method comprises: preparing LED dies 16 each equipped with bump electrodes 12, 13 and a pressure sensitive sheet 31; arranging the LED dies on the pressure sensitive sheet 31 with burying the bump electrodes 12, 13 such that a bottom face of the LED die 16 contacts a pressure sensitive layer 31a of the pressure sensitive sheet 31; and cutting a phosphor layer 11 after covering the LED dies 16 and the pressure sensitive sheet 31 with the phosphor layer to obtain singulated LED dies 10.
摘要翻译：要解决的问题：提供一种在LED模具底面上配备有与母板的连接电极的LED元件的简单而有效的制造方法，其中有利的是连接电极突出以放宽对灰尘和毛刺。解决方案：一种半导体发光元件制造方法，包括：准备各具有凸块电极12,13和压敏片31的LED管芯16; 通过埋入凸起电极12,13将LED管芯设置在压敏敏感片31上，使得LED管芯16的底面接触压敏片31的压敏层31a; 并且在用荧光体层覆盖LED管芯16和压敏片材31之后切割荧光体层11以获得单独的LED管芯10.版权所有：（C）2013，JPO＆INPIT

5. 发明专利

JP2012064841A Semiconductor light emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2012064841A
公开(公告)日：2012-03-29
申请号：JP2010209052
申请日：2010-09-17
申请人： Citizen Electronics Co Ltd , Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , シチズン電子株式会社
发明人： TANMACHI KAZUAKI
IPC分类号： H01L33/62 , H01L33/60
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which solves a problem that an LED device which has a circuit board formed by a flexible printed substrate includes metal patterns on both surfaces and thus the structure of the circuit board is complicated.SOLUTION: A flexible printed substrate 4 comprises: a polyimide film 18; first and second metal patterns 11 and 12 formed on only a lower surface of the polyimide film 18; and first and second recessed parts 1 and 2. An LED element 3 is die-bonded to the first metal pattern 11 which is exposed from the first recessed part 1, and the second metal pattern 12 which is exposed from the second recessed part 2 is connected with an electrode of the LED element 3 with a wire 14.
摘要翻译：解决的问题：为了提供一种半导体发光器件，其解决了具有由柔性印刷基板形成的电路板的LED器件在两面上包括金属图案并且因此电路板的结构复杂的问题。解决方案：柔性印刷基板4包括：聚酰亚胺膜18; 仅形成在聚酰亚胺膜18的下表面上的第一和第二金属图案11和12; 以及第一和第二凹部1和2. LED元件3裸片接合到从第一凹部1露出的第一金属图案11，并且从第二凹部2露出的第二金属图案12为使用导线14与LED元件3的电极连接。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012054383A Semiconductor light-emitting device and manufacturing method of the same 审中-公开
标题翻译：半导体发光器件及其制造方法
公开(公告)号：JP2012054383A
公开(公告)日：2012-03-15
申请号：JP2010195439
申请日：2010-09-01
申请人： Citizen Electronics Co Ltd , Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , シチズン電子株式会社
发明人： TANMACHI KAZUAKI
IPC分类号： H01L33/60 , H01L33/54
CPC分类号： H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an LED device provided with a dam material, which can solve the problem occurring when disposing a reflection member such as a white resist, a silicon resin or the like in a region surrounded by the dam material such that it is necessary to apply photolithography or a printing method of high location accuracy.SOLUTION: A reflective silicon resin 21 is coated by flow coating on a bottom part of a region surrounded by a dam material 11. At this time, a top face of the reflective silicon resin 21 is lower than a top face of an LED 22. It is favorable that a thickness of the reflective silicon resin 21 is approximately 30-50 μm.
摘要翻译：要解决的问题：提供一种设置有堤坝材料的LED装置，其可以解决在由坝材料包围的区域中设置诸如白色抗蚀剂，硅树脂等的反射构件时发生的问题使得需要应用光刻或具有高定位精度的印刷方法。解决方案：反射硅树脂21通过流涂被涂覆在由坝材料11包围的区域的底部上。此时，反射硅树脂21的顶面低于 LED22。反射硅树脂21的厚度大约为30-50μm是有利的。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2013140894A Led device and manufacturing method of the same 有权
标题翻译：其设备及其制造方法
公开(公告)号：JP2013140894A
公开(公告)日：2013-07-18
申请号：JP2012000744
申请日：2012-01-05
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： TANMACHI KAZUAKI
IPC分类号： H01L33/52 , H01L33/50
CPC分类号： H01L2224/16245 , H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an LED device which achieves good emission efficiency, a simple structure, and easy manufacturing in the LED device where an LED die is mounted on a lead frame by a flip chip mounting method, and to a manufacturing method of the LED device.SOLUTION: In an LED device 50, connection electrodes 3 are disposed on a bottom surface, and an LED die 1 is mounted on the electrodes 3 in a flip chip mounting method. A phosphor plate 4 is bonded onto an upper surface of the LED die 1 by a transparent adhesive. A reflective white member 5 seals a side surface of the LED die 1 and a lower surface of the phosphor plate 4 and also seals a lower surface of the LED die 1 and a side surface of the electrode 3. In a manufacturing method of the LED device 50, the multiple LED dies 1 are mounted on a lead frame 3 in a flip chip mounting method firstly. A large cover sheet 6La and an adhesive sheet 6Lb are respectively bonded to the upper surface sides of the LED dies 1 and the electrode side of the lead frame 3L. Then, the inner sides of the cover sheet 6La and the adhesive sheet 6Lb are filled with the white member 5. Subsequently, the large phosphor plate 4L is bonded to the upper surfaces of the LED dies 1 and the multiple LED dies 1 are diced into individual pieces.
摘要翻译：要解决的问题：提供一种LED装置，其通过倒装芯片安装方法在LED引线框架上安装LED管芯，实现良好的发光效率，简单的结构，并且容易地制造LED器件，并且制造方法 LED装置。解决方案：在LED装置50中，连接电极3设置在底面上，并且以倒装芯片安装方式将LED管芯1安装在电极3上。荧光体板4通过透明粘合剂结合到LED管芯1的上表面上。反射白色构件5密封LED管芯1的侧表面和荧光体板4的下表面，并且还密封LED管芯1的下表面和电极3的侧表面。在LED的制造方法中器件50中，多个LED管芯1首先以倒装芯片安装方法安装在引线框架3上。大盖片6La和粘合片6Lb分别接合到LED管芯1的上表面侧和引线框架3L的电极侧。然后，盖板6La和粘合片6Lb的内侧填充有白色构件5.随后，将大荧光体板4L接合到LED管芯1的上表面，并将多个LED管芯1切割成单件。

8. 发明专利

JP2013098427A Semiconductor light-emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2013098427A
公开(公告)日：2013-05-20
申请号：JP2011241469
申请日：2011-11-02
申请人： Citizen Electronics Co Ltd , シチズン電子株式会社 , Citizen Holdings Co Ltd , シチズンホールディングス株式会社
发明人： TANMACHI KAZUAKI
IPC分类号： H01L33/48
CPC分类号： H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To solve such problems that in a conventional stacked LED device having a plurality of LED dies stacked therein, the type and the number of the LED dies to be stacked are limited, and an increase in luminance and an adjustable range of color tones are limited.SOLUTION: In an LED device 10 having a plurality of LED dies 1a to 1d stacked on a circuit board 3 having a wiring electrode, phosphor layers 2a to 2c and dichroic mirrors 6 and 7 are interposed between the LED dies 1a to 1d, and thereby reduction in the size and improvement in the luminance are achieved and stability of color tones and a change with time is achieved.
摘要翻译：解决的问题为了解决在其中堆叠有多个LED管芯的现有的层叠LED器件的问题，限制了要堆叠的LED管芯的种类和数量，亮度的增加和可调范围的色调有限。解决方案：在具有堆叠在具有布线电极的电路板3上的多个LED管芯1a至1d的LED器件10中，在LED管芯1a至1d之间插入荧光体层2a至2c和分色镜6和7 ，从而实现了尺寸的减小和亮度的提高，并且实现了色调的稳定性和随时间的变化。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2012253223A Method for manufacturing semiconductor light-emitting element 有权
标题翻译：制造半导体发光元件的方法
公开(公告)号：JP2012253223A
公开(公告)日：2012-12-20
申请号：JP2011125272
申请日：2011-06-03
申请人： Citizen Holdings Co Ltd , シチズンホールディングス株式会社 , Citizen Electronics Co Ltd , シチズン電子株式会社
发明人： TANMACHI KAZUAKI , ISHII HIROHIKO
IPC分类号： H01L33/54 , H01L33/38
CPC分类号： H01L2224/96
摘要： PROBLEM TO BE SOLVED: To efficiently and easily manufacture an LED element comprising an LED die bottom surface including a connection electrode connected with a mother board, in which the connection electrode should preferably be projected so as to relax mounting restrictions on dust, burrs, and the like.SOLUTION: An LED die 16a is obtained by applying a resist material 31 so as to cover a wafer 30 in each of projecting electrodes 12, 13. By arranging the LED die 16a on an adhesive sheet 32, covering the LED die 16a with a phosphor layer together with the adhesive sheet 32 and removing the resist material 31, and then cutting the phosphor layer 11, LED elements 10 are obtained in a segmented form.
摘要翻译：要解决的问题为了有效且容易地制造包括LED模具底面的LED元件，LED元件底面包括与母板连接的连接电极，其中连接电极应优选地突出以放松对灰尘的安装限制，毛刺等。解决方案：通过施加抗蚀剂材料31以覆盖每个突出电极12,13中的晶片30来获得LED管芯16a。通过将LED管芯16a布置在粘合片32上，覆盖LED管芯16a 将磷光体层与粘合片32一起除去抗蚀剂材料31，然后切割荧光体层11，以分段的形式获得LED元件10。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2012227470A Semiconductor light emitting device and manufacturing method of the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：JP2012227470A
公开(公告)日：2012-11-15
申请号：JP2011096057
申请日：2011-04-22
申请人： Citizen Holdings Co Ltd , Citizen Electronics Co Ltd , シチズンホールディングス株式会社 , シチズン電子株式会社
发明人： FUKAZAWA KOICHI , TANMACHI KAZUAKI , ISHII HIROHIKO
IPC分类号： H01L33/48
摘要： PROBLEM TO BE SOLVED: To reduce the types of members and simplify the manufacturing processes for downsizing a package even in an LED device including an LED element having a sapphire substrate.SOLUTION: An LED device 10 includes a sapphire substrate 14 and an LED element 16 having protruding electrodes 18, 19. A phosphor sheet 11 is placed on an upper surface of the sapphire substrate 14, and the phosphor sheet 11 and the sapphire substrate 14 are bonded to each other through an adhesive layer 13. A side part of the LED element 16 is covered by a white reflection member 17. The protruding electrodes 18, 19 of the LED element 16 serve as connection electrodes to a mother board.
摘要翻译：要解决的问题：即使在包括具有蓝宝石衬底的LED元件的LED器件中，也可以减少部件的种类并简化制造工序。解决方案：LED装置10包括蓝宝石衬底14和具有突出电极18,19的LED元件16.荧光体片11放置在蓝宝石衬底14的上表面上，并且荧光体片11和蓝宝石基板14通过粘合剂层13彼此接合.LED元件16的侧部被白色反射构件17覆盖.LED元件16的突出电极18,19用作母板的连接电极。版权所有（C）2013，JPO＆INPIT

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