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1. 发明专利

JP2005163050A Liquid composition for forming titanium dioxide coating film for photocatalyst and method for producing the same 审中-公开
标题翻译：用于形成用于光催化剂的二氧化钛涂层膜的液体组合物及其制造方法
公开(公告)号：JP2005163050A
公开(公告)日：2005-06-23
申请号：JP2004368564
申请日：2004-12-20
申请人： Colcoat Kk , Ishihara Sangyo Kaisha Ltd , Toto Ltd , コルコート株式会社 , 東陶機器株式会社 , 石原産業株式会社
发明人： KUMAI HIROSHI , KUDO HIDEJIRO , TOMONARI MASANORI , ZEDO TAKESHI
IPC分类号： B01D53/86 , B01J21/08 , B01J35/02 , B01J37/02 , C09D5/00 , C09D7/12 , C09D183/02
摘要： PROBLEM TO BE SOLVED: To obtain a liquid composition for forming a titanium dioxide coated coating film, and which composition can firmly cover and adhere the titanium oxide powder on the surface of a substrate, wherein the titanium dioxide has catalytic function of oxidizing and reducing organic matters by photoirradiation. SOLUTION: The liquid composition comprises titanium dioxide having 0.001-0.5 μm average particle diameter, a hydrolysate of a hydrolyzable silicon compound represented by the formula (1): Si-X 4 (1) (wherein, X's are each a halogen or a 1-8C alkoxy and may be same or different) and of 50-1,500% hydrolysis rate, and a solvent, wherein the weight ratio of titanium to silicon is, when expressed in terms of TiO 2 and SiO 2 , (30-96):(70-4) (100 in total) and the solid content in the whole composition is less than 30 wt.%. The substrate applied with the liquid composition to impart its photocatalytic function to the surface thereof is provided. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：待解决的问题：为了获得形成二氧化钛涂覆涂膜的液体组合物，并且该组合物可以将钛氧化物粉末牢固地覆盖并粘附在基材的表面上，其中二氧化钛具有催化氧化功能并通过光照减少有机物质。溶液：液体组合物包含平均粒径为0.001-0.5μm的二氧化钛，由式（1）表示的可水解硅化合物的水解产物：Si-X 4（1）（其中X表示卤素或1-8C烷氧基并且可以相同或不同）和水解速率为50-1,500％的溶剂，其中钛与硅的重量比当以TiO 2表示时， SB> 2 和SiO 2 ，（30-96）:( 70-4）（总共100），整个组合物中的固体含量小于30重量％。提供了施加了液体组合物以赋予其光催化功能至其表面的基材。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JPH08164334A TITANIUM DIOXIDE COATING FILM FORMING COMPOSITION FOR PHOTOCATALYST AND ITS PRODUCTION 失效
公开(公告)号：JPH08164334A
公开(公告)日：1996-06-25
申请号：JP33219594
申请日：1994-12-13
申请人： COLCOAT KK , ISHIHARA SANGYO KAISHA
发明人： KUMAI HIROSHI , KUDO HIDEJIRO , TOMONARI MASANORI , ZEDO TAKESHI
IPC分类号： C01G23/04 , B01J21/06 , B01J35/02 , C09D1/00 , C09D183/00 , C09D183/04
摘要： PURPOSE: To obtain the composition from which a titanium dioxide coating film can firmly be formed by using titanium dioxide having a specified average particle size, a hydrolyzate of a hydrolyzable silicon compound represented by a specific formula and a solvent as the components of the composition and adjusting the weight ratio of titanium to silicon and the total solid content of the composition to specified values respectively. CONSTITUTION: This composition consists of powdery titanium dioxide having a 0.001 to 0.5μm average particle size, a hydrolyzate of a hydrolyzable silicon compound represented by the formula (wherein: (n) is 0 or a whole number of 1 to 8; X is a halogen atom or alkoxyl group having 1 to 8 carbon atoms, which atoms or groups are the same or different) and a solvent. In the composition, the weight ratio of titanium to silicon is (30 to 96):(70 to 4) expressed in terms of TiO2 and SiO2 respectively (the total is 100) and the total solid content is

3. 发明专利

JP2007128864A Fluid composition, and electrode, wiring pattern, as well as coating film formed by using it, and decoration goods forming the coating film 有权
标题翻译：流体组合物，电极，接线图，使用它形成的涂膜，以及形成涂膜的装饰品
公开(公告)号：JP2007128864A
公开(公告)日：2007-05-24
申请号：JP2006248944
申请日：2006-09-14
申请人： Ishihara Sangyo Kaisha Ltd , 石原産業株式会社
发明人： TOMONARI MASANORI , SADOHARA HITOMI , GOTO KOJI
IPC分类号： H01B1/22 , C08K9/04 , C08L101/00 , C09D161/28 , C09D163/00 , C09D175/04 , H01B1/00 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a fluid composition for obtaining a rigid coating film with excellent adhesion with a base material even by drying and heating at comparatively low temperature.
SOLUTION: The fluid composition contains at least crosslinking agent and solvent, and sulfuric compound having at least a kind of hydrophilic group selected from a carboxyl group, hydroxyl group, amino group, hydrazide group, and amide group, nitrogen compound, or phosphorus compound are chemically bonded on the surface of metal particles. As the crosslinking agent, an oxazoline system crosslinking agent, carbodiimide system crosslinking agent, blocked isocyanate system crosslinking agent, epoxy system crosslinking agent, and melamine system crosslinking agent are mixed. The fluid composition is suited for forming a fine electrode, a circuit wiring pattern or for forming a mirror-face coating film.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使通过在较低温度下干燥和加热来提供用于获得具有优异的与基材的粘附性的刚性涂膜的流体组合物。解决方案：流体组合物至少含有交联剂和溶剂，以及具有至少一种选自羧基，羟基，氨基，酰肼基和酰胺基的亲水基团的硫化合物，氮化合物或磷化合物化学键合在金属颗粒的表面上。作为交联剂，混合恶唑啉系交联剂，碳二亚胺系交联剂，封端异氰酸酯体系交联剂，环氧体系交联剂，三聚氰胺系交联剂。流体组合物适于形成微细电极，电路布线图案或用于形成镜面涂膜。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2011047021A Method for producing coating film 有权
标题翻译：生产涂膜的方法
公开(公告)号：JP2011047021A
公开(公告)日：2011-03-10
申请号：JP2009198460
申请日：2009-08-28
申请人： Ishihara Sangyo Kaisha Ltd , 石原産業株式会社
发明人： TOMONARI MASANORI , IDA KIYONOBU
IPC分类号： C23C24/08 , B05D3/06 , B05D7/24 , B22F3/105 , B22F7/04 , H01B5/14 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To conveniently produce a coating film having electric conductivity and a metallic color tone by using a metal fine particle dispersion with laser irradiation.
SOLUTION: The coating film is produced by applying a dispersion including at least metal fine particles having an organic compound on particle surfaces and a solvent to a substrate, and is subsequently irradiated with a laser beam in atmosphere. The coating film with low resistance and the metallic color tone is formed by the method. In particular, the method is applicable to base metals such as copper, nickel and so on, and also is applicable to low heat-resistant substrate, such as plastics. The coating film is used for forming a micro electrode and a circuit wiring pattern of a printed wiring board and the like, and for design ornament application utilizing the metallic color tone of the coating film and the like.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过使用激光照射的金属微粒分散体，方便地制造具有导电性和金属色调的涂膜。解决方案：通过将至少包含具有有机化合物的金属细颗粒的分散体施加到基材上并将溶剂涂布在基板上，然后在大气中照射激光束来制造涂膜。通过该方法形成具有低电阻和金属色调的涂膜。特别地，该方法适用于铜，镍等贱金属，也适用于塑料等低耐热性基材。涂膜用于形成印刷线路板等的微电极和电路布线图案，并且用于利用涂膜的金属色调等进行设计装饰应用。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2006073436A Fluid composition and electrode as well as wiring pattern formed using it 有权
标题翻译：流体组合物和电极，如使用其形成的布线图案
公开(公告)号：JP2006073436A
公开(公告)日：2006-03-16
申请号：JP2004257667
申请日：2004-09-03
申请人： Ishihara Sangyo Kaisha Ltd , 石原産業株式会社
发明人： TOMONARI MASANORI , SADOHARA HITOMI
IPC分类号： H01B1/22 , B01J13/00 , B22F9/00 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a fluid composition which is superior in a long-term stability by preventing occurrence of particle lumps in which metal colloid particles have been abnormally grown up in the fluid composition wherein the metal colloid particles are blended in a high concentration. SOLUTION: A reducing substance such as hydrazine or its hydrated material, or aldehydes is blended in the range of 0.1 to 50 pts. wt to 100 pts. wt. of the metal colloid particles with the fluid composition in which at least 5 wt% of the metal colloid particles are blended. Even if this fluid composition is used after it is stored for a long period, the fluid composition is superior in performance such as conductivity, and easy to form uniform coated materials, and this can be utilized especially for formation or the like of a fine electrode or wiring pattern of a printed-circuit board or the like. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种流体组合物，其通过防止在其中混合金属胶体颗粒的流体组合物中金属胶体颗粒异常生长的颗粒块的发生而具有优异的长期稳定性高度集中解决方案：将还原物质如肼或其水合物或醛以0.1-50重量份混合。重量至100点。重量。的具有至少5重量％的金属胶体颗粒的流体组合物的金属胶体颗粒。即使这种流体组合物在长时间储存后使用，流体组合物的性能如导电性也优异，容易形成均匀的涂布材料，特别适用于细电极的形成等或印刷电路板等的布线图案。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005060778A Copper powder, its production method, and copper paste, paint and electrode obtained by using the same 有权
标题翻译：铜粉，其生产方法和使用它的铜膏，油漆和电极
公开(公告)号：JP2005060778A
公开(公告)日：2005-03-10
申请号：JP2003292861
申请日：2003-08-13
申请人： Ishihara Sangyo Kaisha Ltd , 石原産業株式会社
发明人： TOMONARI MASANORI
IPC分类号： B22F1/00 , B22F1/02 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide copper powder which has excellent oxidization resistance, and to provide its production method.
SOLUTION: Silicone oil and a sulfur compound are treated to copper grains, and they are made present on the surface of copper respectively. As the method for the treatment, the one where a copper compound and a reducing agent are reacted in a solvent liquid in the presence of a sulfur compound and a protective colloid to obtain copper grains in which the sulfur compound is made present, and next, the obtained copper grains and silicone oil are brought into dry or wet contact is preferable. As the silicone oil, dimethylpolysiloxane, methylhydrogenpolysiloxane, mercapto modified polysiloxane or the like can be used. Further, as the sulfur compound, mercaptopropionic acid, dodecanethiol, hexanethiol, methyl thioglycolate, cycteine or the like can be used.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供耐氧化性优异的铜粉，并提供其制造方法。解决方案：将硅油和硫化合物处理成铜颗粒，并将它们分别存在于铜的表面上。作为处理方法，在硫化合物和保护胶体的存在下，在溶剂液中使铜化合物和还原剂反应的方法得到存在硫化合物的铜颗粒，接着，获得的铜颗粒和硅油进行干燥或湿接触是优选的。作为硅油，可以使用二甲基聚硅氧烷，甲基氢聚硅氧烷，巯基改性聚硅氧烷等。此外，作为硫化合物，可以使用巯基丙酸，十二烷硫醇，己硫醇，巯基乙酸甲酯，cycteine等。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JPH09255338A PRODUCTION OF EASILY SINTERED HIGH PURITY TITANIUM DIOXIDE 失效
公开(公告)号：JPH09255338A
公开(公告)日：1997-09-30
申请号：JP8768296
申请日：1996-03-15
申请人： ISHIHARA SANGYO KAISHA
发明人： TAKAHASHI HIDEO , AKEDA ISAO , TOMONARI MASANORI , KOYAMA TOSHIHIRO
IPC分类号： C01G23/04
摘要： PROBLEM TO BE SOLVED: To selectively remove silica in ordinary TiO2 and to obtain high purity TiO2 excellent in sinterability by treating the ordinary TiO2 with hydrofluoric acid. SOLUTION: Titanium dioxide contg. >10ppm silica is treated with hydrofluoric acid to attain =99.99% purity and to increase the linear shrinkage at 100 deg.C in TMA by >=13%. The TiO2 as stock may be synthesized by any method and is, e.g. obtd. by hydrolyzing an aq. soln. of a Ti compd. and firing the resultant titanium dioxide hydrate or by oxidizing a Ti compd. in a vapor phase. The TiO2 is preferably treated with 0.1-30wt.% hydrofluoric acid based on the amt. of the TiO2 .

8. 发明专利

JPH08132075A TREATMENT OF AQUEOUS SOLUTION CONTAINING AMMONIA AND/OR AMMONIUM ION 失效
公开(公告)号：JPH08132075A
公开(公告)日：1996-05-28
申请号：JP30293894
申请日：1994-11-10
申请人： ISHIHARA SANGYO KAISHA
发明人： TAKAOKA YOICHI , AKEDA ISAO , TOMONARI MASANORI , CHIBA KATSUICHI
IPC分类号： C02F1/72 , B01J20/10 , B01J20/12 , B01J21/06 , B01J35/02
摘要： PURPOSE: To provide a method for rapidly and efficiently oxidizing an aq. solution containing ammonia and/or ammonium ion. CONSTITUTION: Ammonia and/or ammonium ion is oxidized by allowing the aq. solution containing ammonia and/or ammonium ion to contact with a catalytic body consisting of an adsorbent for adsorbing ammonia and/or ammonium ion and a semiconductor catalyst and irradiating the semiconductor catalyst with light of a wavelength having energy of equal to or above the bandgap thereof.

9. 发明专利

JP2012052241A Copper microparticle and process for producing the same 有权
标题翻译：铜微生物及其生产方法
公开(公告)号：JP2012052241A
公开(公告)日：2012-03-15
申请号：JP2011240015
申请日：2011-11-01
申请人： Ishihara Sangyo Kaisha Ltd , 石原産業株式会社
发明人： TOMONARI MASANORI , HONMA MASATOSHI , KUNIFUSA YOSHIYUKI
IPC分类号： B22F9/20 , B22F1/00 , H01B1/00 , H01B1/22 , H01B5/00 , H01B13/00
CPC分类号： B22F9/20 , H05K1/092
摘要： PROBLEM TO BE SOLVED: To provide copper microparticles that are fine and contain substantially none of agglomerated particles, for example, copper microparticles of 0.005 to 0.5 μm average particle diameter (D) as measured by an electron microscope, 0.005 to 0.5 μm average particle diameter (d) as measured by a dynamic light scattering method particle size distribution measuring apparatus and 0.7 to 1.5 d/D ratio.SOLUTION: In the process for producing copper microparticles, a divalent copper oxide is mixed with a reducing agent in a liquid medium to produce metallic copper microparticles, in the presence of a complexing agent and a protective colloid. Then, at least one of donor atoms of ligand included in the complexing agent is sulfur, and the complexing agent is used in an amount of ≥0.01 and
摘要翻译：要解决的问题为了提供细微的并且基本上不含有附聚颗粒的铜微粒，例如通过电子显微镜测量的0.005至0.5μm平均粒径（D）的铜微粒0.005至0.5μm 通过动态光散射法粒度分布测量装置测量的平均粒径（d）和0.7至1.5d / D比。解决方案：在铜微粒的制造方法中，在络合剂和保护胶体的存在下，将二价氧化铜与液体介质中的还原剂混合，生成金属铜微粒。然后，配位剂中所含的配体的供体原子中的至少一个是硫，配合剂的用量为≥0.01和<0.5重量份。基于1,000 pts.wt. 的二价氧化铜。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2012052240A Copper microparticle and process for producing the same 有权
标题翻译：铜微生物及其生产方法
公开(公告)号：JP2012052240A
公开(公告)日：2012-03-15
申请号：JP2011240008
申请日：2011-11-01
申请人： Ishihara Sangyo Kaisha Ltd , 石原産業株式会社
发明人： TOMONARI MASANORI , HONMA MASATOSHI , KUNIFUSA YOSHIYUKI
IPC分类号： B22F9/20 , B22F1/00 , H01B1/00 , H01B1/22 , H01B5/00 , H01B13/00
CPC分类号： B22F9/20 , H05K1/092
摘要： PROBLEM TO BE SOLVED: To provide copper microparticles that are fine and contain substantially none of agglomerated particles, for example, copper microparticles of 0.005 to 2.0 μm average particle diameter (D) as measured by an electron microscope, 0.005 to 2.0 μm average particle diameter (d) as measured by a dynamic light scattering method particle size distribution measuring apparatus and 0.7 to 2 d/D ratio.SOLUTION: A divalent copper oxide is mixed with a reducing agent in a liquid medium to produce metallic copper microparticles, in the presence of: at least one complexing agent selected from amines, nitrogen-containing heterocyclic compounds, nitriles and cyanogen compounds, ketones, amino acids and alkanolamines, or the salts or derivatives of them; and a protective colloid.
摘要翻译：要解决的问题为了提供细微的铜微粒，并且基本上不含凝聚颗粒，例如通过电子显微镜测量的平均粒径（D）为0.005-2.0μm的铜微粒为0.005-2.0μm 通过动态光散射法粒度分布测定装置测定的平均粒径（d）和0.7〜2d / D比。解决方案：在以下存在下，将二价氧化铜与还原剂在液体介质中混合以制备金属铜微粒：至少一种选自胺，含氮杂环化合物，腈和氰化合物的络合剂，酮，氨基酸和链烷醇胺，或它们的盐或衍生物; 和保护胶体。版权所有（C）2012，JPO＆INPIT

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