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1. 发明专利

JP2012162018A Thermal head 有权
标题翻译：热头
公开(公告)号：JP2012162018A
公开(公告)日：2012-08-30
申请号：JP2011024820
申请日：2011-02-08
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MAKINO MITSUO , FUDO HEISHIRO , SAKUMA HIROSHI , HIBINO IKUO , MIKI YASUHIRO
IPC分类号： B41J2/335 , H01C7/00
摘要： PROBLEM TO BE SOLVED: To provide a cost-efficient thermal head with excellent workability in production, having a heating resistor layer made of glass mainly composed of zinc oxide and formed by calcining a paste containing a conductive substance and a dispersion preventive substance, thereby preventing variation in resistance values of a heating resistor and improving product quality.SOLUTION: The thermal head includes: an insulating substrate; an electrode layer formed in a predetermined pattern on the insulating substrate; the heating resistor layer formed on the electrode layer; and a protective layer covering the electrode layer and the heating resistor. In the thermal head, the heating resistor layer is made of the glass mainly composed of zinc oxide and formed by calcining the paste containing the conductive substance and the dispersion preventive substance.
摘要翻译：要解决的问题：为了提供具有优异的制造加工性的成本效益高的热敏头，具有由主要由氧化锌组成的玻璃制成的加热电阻层，并且通过煅烧含有导电物质和防分散物质的糊料从而防止加热电阻器的电阻值的变化，并提高产品质量。解决方案：热敏头包括：绝缘基板; 绝缘基板上以规定图案形成的电极层; 所述加热电阻层形成在所述电极层上; 以及覆盖电极层和发热电阻体的保护层。在热敏头中，加热电阻层由主要由氧化锌组成的玻璃制成，并通过煅烧含有导电物质和分散防止物质的糊料形成。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2007189040A Resistive paste, resistance object, and circuit board using the same 审中-公开
标题翻译：电阻，电阻对象和电路板使用相同
公开(公告)号：JP2007189040A
公开(公告)日：2007-07-26
申请号：JP2006005502
申请日：2006-01-13
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： SAKUMA HIROSHI
IPC分类号： H01C7/00 , C03C8/16 , H01B1/20
摘要： PROBLEM TO BE SOLVED: To provide a resistive paste which has especially less variation in a resistance value and forms a resistance object whose temperature coefficient is small, and also to provide the resistance object formed by using the resistive paste, and a circuit board formed by using the resistance object. SOLUTION: The resistive paste comprises; a glass composition which does not contain lead; RuO 2 ; Ru 2 Nd 2 O 7 ; and an organic vehicle. Since the synthetic temperature of Ru 2 Nd 2 O 7 is so high as approximately 1,100°C-1,300°C, it is not decomposed at the temperature for calcinating the resistive paste. As a result, a resistance object with less variation in resistance value is formed. The temperature coefficient of Ru 2 Nd 2 O 7 is negative, and the temperature coefficient of RuO 2 is positive. By mixing them, the absolute value of the temperature coefficient of the resistance object is made small appropriately and simply. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供电阻值变化特别小，并且形成温度系数小的电阻对象的电阻膏，并且还提供使用电阻膏形成的电阻对象，以及电路使用电阻对象形成的板。电解浆料包括：不含铅的玻璃组合物; 的RuO 2 ; 茹 2 钕 2 0 7 ; 和有机车辆。由于Ru 2 2 O 7 的合成温度高达约1100℃-1.300℃，因此不会在用于煅烧电阻浆料的温度。结果，形成电阻值变化小的电阻对象。 Ru 2 2 7 的温度系数为负，RuO 2 的温度系数为正。通过混合它们，使电阻对象的温度系数的绝对值适当和简单地变小。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2008091874A Ceramic circuit substrate and method for manufacturing the same 审中-公开
标题翻译：陶瓷电路基板及其制造方法
公开(公告)号：JP2008091874A
公开(公告)日：2008-04-17
申请号：JP2007200813
申请日：2007-08-01
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： SAKUMA HIROSHI , SHIMIZU YUICHI , KOSAKA KUNIO
IPC分类号： H05K3/34 , H01L23/12 , H01L23/13 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a ceramic circuit substrate that can surely bond a solder ball to a pad electrode with a high separation resistance and can be also thinned without any interruption and a method for manufacturing the same. SOLUTION: The ceramic substrate where the solder ball 11 as an external terminal is bonded to the pad electrode 12 provided at a mounting principal plane 10a of an LTCC substrate 10, wherein a periphery of the pad electrode 12 is formed into the mounting principal plane 10a side that is inclined so as to be bell-bottom to be an inclined periphery 12b, and a glass coat layer (insulator layer) 13 that covers the inclined periphery 12b while enclosing the pad electrode 12 is provided at the mounting principal plane 10a to position the pad electrode 12 and the surfaces of the glass coat layer 13 opposite to the mounting principal plane 10a in substantially the same plane. The ceramic substrate of the configuration is obtained by pressing with an isohydraulic pressing device on a manufacturing stage that press-fits a multilayered green sheet 20. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种陶瓷电路基板，其能够将焊球可靠地粘接到具有高分离电阻的焊盘电极，并且还可以在不中断的情况下变薄并且其制造方法。＆lt; P＆gt;解决方案：作为外部端子的焊球11的陶瓷基板与设置在LTCC基板10的安装主面10a的焊盘电极12接合，其中焊盘电极12的周边形成为安装主平面10a侧以倾斜的底部倾斜成为倾斜周边12b，并且在安装主平面上设置覆盖倾斜周边12b的玻璃涂层（绝缘体层）13，同时封装焊盘电极12 10a将衬垫电极12和玻璃涂层13的与安装主面10a相对的表面定位在基本相同的平面内。通过在压制多层生片20的制造台上用等压压装置进行压制，得到该结构的陶瓷基板。（C）2008，JPO＆INPIT

4. 发明专利

JP2001345641A VOLTAGE CONTROLLED OSCILLATOR 失效
公开(公告)号：JP2001345641A
公开(公告)日：2001-12-14
申请号：JP2000166138
申请日：2000-06-02
申请人： ALPS ELECTRIC CO LTD
发明人： YOSHISATO AKIYUKI , INOUE AKIHIKO , SAKUMA HIROSHI
IPC分类号： H03B1/00 , H03B5/02 , H03B5/12 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To provide a voltage controlled oscillator suitable for size reduction. SOLUTION: Circuit elements, including capacitors C1-C10, resistors R1-R4, and coils L1-L4, and a conductive pattern P connected with these circuit elements are formed in thin film on an alumia substrate 1. Semiconductor bare chips 4, i.e., a diode D1 and transistors Tr1, Tr2, are then wire bonded onto the alumia substrate 1 wherein the area of connection lands 5 for mounting these semiconductor bare chips 4 is set smaller than the lower surface area of the semiconductor bare chips 4.

5. 发明专利

JP2001339242A ELECTRONIC CIRCUIT UNIT 失效
公开(公告)号：JP2001339242A
公开(公告)日：2001-12-07
申请号：JP2000160239
申请日：2000-05-30
申请人： ALPS ELECTRIC CO LTD
发明人： YOSHISATO AKIYUKI , INOUE AKIHIKO , UEDA KAZUHIKO , SAKUMA HIROSHI
IPC分类号： H01C7/00 , H01F17/00 , H01F27/00 , H01G4/33 , H01G4/40 , H01P5/02 , H03B5/02 , H03B5/12 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To provide a surface mount type electronic circuit unit which is suitably made compact. SOLUTION: On an alumina substrate 1, circuit elements including capacitors C1 to C7, resistances R1 to R3, and inductance elements L1 to L3 and a conductive pattern P connected to those circuit elements are formed as a thin film; and a semiconductor bare chip of a diode D1 and a transistor Tr1 is bonded by wires to the connection land of the conductive pattern P and an end surface electrode 3 which is connected to the ground electrode and input/output electrode of the conductive pattern P is provided on the side face of the alumina substrate 1.

6. 发明专利

JP2001345640A VOLTAGE CONTROLLED OSCILLATOR 失效
公开(公告)号：JP2001345640A
公开(公告)日：2001-12-14
申请号：JP2000166124
申请日：2000-06-02
申请人： ALPS ELECTRIC CO LTD
发明人： YOSHISATO AKIYUKI , INOUE AKIHIKO , SAKUMA HIROSHI
IPC分类号： H03B1/00 , H03B5/02 , H03B5/12 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To provide a surface mount voltage controlled oscillator suitable for size reduction. SOLUTION: Circuit elements, including capacitors C1-C10, resistors R1-R4, and coils L1-L4, and a conductive pattern P connected with these circuit elements are formed in thin film on an alumia substrate 1. Semiconductor bare chips, i.e., a diode D1 and transistors Tr1, Tr2, are then wire bonded to the connection lands of the conductive pattern P and an end face electrode 3 being connected with the ground electrode and the I/O electrode of the conductive pattern is formed, in thick film, of a low temperature firing material on the side face of the alumia substrate 1.

7. 发明专利

JP2001339035A ELECTRONIC CIRCUIT UNIT 失效
公开(公告)号：JP2001339035A
公开(公告)日：2001-12-07
申请号：JP2000160278
申请日：2000-05-30
申请人： ALPS ELECTRIC CO LTD
发明人： YOSHISATO AKIYUKI , INOUE AKIHIKO , SAKUMA HIROSHI
IPC分类号： H01L23/13 , H01L23/12 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To provide a surface mounting type electronic circuit unit which is suitable for miniaturization. SOLUTION: In this electronic circuit unit, circuit elements containing capacitors C1-C7, resistors R1-R3, inductance elements L1-L3, etc., and a conductive pattern P connected the circuit elements, are formed on an alumina substrate 1 in the form of thin films. A bare semiconductor chip 4 of a diode D1 and a transistor Tr1 is wire-bonded. The areas of connecting lands 5 on which the bare semiconductor chips 4 are mounted are made smaller than the bottom areas of the chips 4.

8. 发明专利

JP2001345642A VOLTAGE CONTROLLED OSCILLATOR 失效
公开(公告)号：JP2001345642A
公开(公告)日：2001-12-14
申请号：JP2000166146
申请日：2000-06-02
申请人： ALPS ELECTRIC CO LTD
发明人： YOSHISATO AKIYUKI , INOUE AKIHIKO , SAKUMA HIROSHI , IGARASHI YASUHIRO
IPC分类号： H03B1/00 , H03B5/02 , H03B5/12 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To provide a voltage controlled oscillator suitable for size reduction. SOLUTION: Circuit elements including capacitors C1-C10 resistors R1-R4, and inductance elements L1-L4 are formed in thin film on an alumia substrate 1. Semiconductor bare chips 4, i.e., a diode D1 and transistors Tr1, Tr2, are then wire bonded and the inductance element L2 out of the thin film inductance elements L1-L4 is formed spirally as an inductance element for setting a resonance frequency. The inductance element L3 connected with the inductance element L2 is formed as a conductive pattern for adjusting resonance. Resonance frequency is adjusted by trimming the inductance element L3 and increasing the number of turns of the inductance element L2.

9. 发明专利

JP2001339243A ELECTRONIC CIRCUIT UNIT 失效
公开(公告)号：JP2001339243A
公开(公告)日：2001-12-07
申请号：JP2000160282
申请日：2000-05-30
申请人： ALPS ELECTRIC CO LTD
发明人： YOSHISATO AKIYUKI , INOUE AKIHIKO , SAKUMA HIROSHI , IGARASHI YASUHIRO
IPC分类号： H01F17/00 , H03B5/02 , H03B5/12 , H03B5/18
摘要： PROBLEM TO BE SOLVED: To provide a surface mount type electronic circuit unit which is suitably made compact. SOLUTION: On an alumina substrate 1, circuit elements including capacitors C1 to C7, resistances R1 to R3, inductance elements L1 to L3, etc., are formed as a thin film and a semiconductor bare chip of a diode D1 and a transistor Tr1 is bonded by a wire; and the inductance element L2 among the thin-film formed inductance elements L1 to L3 is formed spirally into an inductance element for resonance frequency setting and the inductance element L3 connected to the inductance element L2 is formed into a conductive pattern for adjustment and trimmed to increase the number of turns of the inductance element L2, thereby adjusting the resonance frequency.

10. 发明专利

JP2001339039A ELECTRONIC CIRCUIT UNIT 失效
公开(公告)号：JP2001339039A
公开(公告)日：2001-12-07
申请号：JP2000160252
申请日：2000-05-30
申请人： ALPS ELECTRIC CO LTD
发明人： YOSHISATO AKIYUKI , INOUE AKIHIKO , SAKUMA HIROSHI , IGARASHI YASUHIRO
IPC分类号： H01L23/12 , H01L25/00 , H01L25/04 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide an electronic circuit unit which is suitable for miniaturization and the output of which can be adjusted easily. SOLUTION: In this electronic circuit unit, circuit elements containing capacitors C1-C7, resistors R1-R3, inductance elements L1-L3, etc., and a conductive pattern P connected to the circuit elements are formed on an alumina substrate 1 in the form of thin films, and a bare semiconductor chip of a diode D1 and a transistor Tr1 is wire-bonded to the connecting lands of the pattern. The electronic circuit unit is also constituted to adjust its output by only trimming the emitter resistor R3 out of the voltage dividing resistors R1 and R2 for base biasing and emitter resistor R3 of the transistor Tr1.

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