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1. 发明专利

JP2010186998A Semiconductor wafer testing apparatus 审中-公开
标题翻译：半导体测试仪器
公开(公告)号：JP2010186998A
公开(公告)日：2010-08-26
申请号：JP2010027476
申请日：2010-02-10
申请人： Advantest Corp , 株式会社アドバンテスト
发明人： KIYOKAWA TOSHIYUKI , NAITO TAKASHI
IPC分类号： H01L21/66 , G01R31/28
CPC分类号： G01R31/2893 , G01R31/2886 , G01R31/2887 , G01R31/2891 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer testing apparatus capable of saving space and reducing cost. SOLUTION: The semiconductor wafer testing apparatus includes a plurality of test heads 32a to 32d in which probe cards 321 are electrically connected, wafer trays 2 which can retain semiconductor wafers W, and an alignment device 5 which relatively positions the semiconductor wafers W retained by the wafer trays 2 with respect to the probe cards 321 and arranges the wafer trays 2 opposite to the probe cards 321. The wafer trays 2 have a depressurizing mechanism which pulls the wafer trays 2 to the probe cards 321, and the alignment device 5 moves along the arrangement directions of the test heads 32a to 32d. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供能够节省空间并降低成本的半导体晶片测试装置。解决方案：半导体晶片测试装置包括多个测试头32a至32d，其中探针卡321电连接，可保留半导体晶片W的晶片托盘2和相对定位半导体晶片W的对准装置5 由晶片托盘2相对于探针卡321保持，并且将晶片托盘2布置在与探针卡片321相对的位置。晶片托盘2具有将晶片托盘2拉到探针卡321的减压机构，并且对准装置 5沿测试头32a至32d的排列方向移动。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2007333697A Method of calibrating electronic component test apparatus 审中-公开
标题翻译：校准电子元件测试装置的方法
公开(公告)号：JP2007333697A
公开(公告)日：2007-12-27
申请号：JP2006169177
申请日：2006-06-19
申请人： Advantest Corp , 株式会社アドバンテスト
发明人： KIKUCHI ARITOMO , KIYOKAWA TOSHIYUKI , TOKITA HITOSHI , IKEDA KATSUHIKO
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a method of calibration capable of accurately calibrating the relative position of an imaging means to a socket.
SOLUTION: This method of calibration comprises the placing step of placing a tool 60 on the socket 71 while inserting contact pins 72 into insertion holes 62, the moving step of moving the tool 60 to an alignment device 43, the first imaging step of imaging the tool 60 positioned at the alignment device 43 by a device camera 434, the second imaging step of imaging the socket 71 by a socket camera 414, a first recognizing step of recognizing the relative position of the device camera 434 to the socket 71 according to the image information imaged in the first step, and the second recognizing step of recognizing the relative position of the socket camera 414 to the socket 71 according to the image information imaged in the second imaging step.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够精确校准成像装置相对于插座的位置的校准方法。解决方案：这种校准方法包括将工具60放置在插座71上的放置步骤，同时将接触针72插入到插入孔62中，将工具60移动到对准装置43的移动步骤，第一成像步骤通过装置照相机434对位于对准装置43的工具60进行成像，通过插座照相机414对插座71进行成像的第二成像步骤，识别装置照相机434相对于插座71的相对位置的第一识别步骤根据在第一步骤中成像的图像信息，以及第二识别步骤，根据在第二成像步骤中成像的图像信息，识别插座照相机414相对于插座71的相对位置。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2013219299A Semiconductor wafer testing method, semiconductor wafer test device, and wafer tray 有权
标题翻译：半导体波形测试方法，半导体波形测试设备和波导托盘
公开(公告)号：JP2013219299A
公开(公告)日：2013-10-24
申请号：JP2012090854
申请日：2012-04-12
申请人： Advantest Corp , 株式会社アドバンテスト , Japan Electronic Materials Corp , 日本電子材料株式会社
发明人： KIYOKAWA TOSHIYUKI , TAKANO DAISUKE , SHOJI TSUTOMU
IPC分类号： H01L21/66 , G01R1/073 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer testing method capable of preheating a contactor of a probe card even in a decompression system using a wafer tray.SOLUTION: The semiconductor wafer testing method includes a first step S12 for decompressing a sealed space 54 formed between a wafer tray 50 holding a semiconductor wafer 100 and a probe card 30, a second step S13 for forming a prescribed interval D between a tip of a probe needle 32 belonging to the probe card 30 and an electrode pad 110 of the semiconductor wafer 100 by placing a stopper 33 between the probe card 30 and the wafer tray 50, and a third step S14 for bringing the probe needle 32 into contact with the electrode pad 110 by shortening the stopper 33.
摘要翻译：要解决的问题：提供一种即使在使用晶片托盘的减压系统中也可以预热探针卡的接触器的半导体晶片测试方法。解决方案：半导体晶片测试方法包括用于对形成的密封空间54进行减压的第一步骤S12 在保持半导体晶片100的晶片托盘50和探针卡30之间，在属于探针卡30的探针32的前端和半导体晶片100的电极焊盘110之间形成规定间隔D的第二步骤S13 通过在探针卡30和晶片托盘50之间设置止动件33，以及通过缩短止动件33使探针32与电极垫110接触的第三步骤S14。

4. 发明专利

JPH11271389A Ic testing device 失效
标题翻译： IC测试设备
公开(公告)号：JPH11271389A
公开(公告)日：1999-10-08
申请号：JP7395198
申请日：1998-03-23
申请人： Advantest Corp , 株式会社アドバンテスト
发明人： KIYOKAWA TOSHIYUKI
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To realize the temperature decrease of an IC during test in an inexpensive constitution in an IC testing device for testing an IC heated by a thermostatic tank by bringing the IC into contact with an IC socket.
SOLUTION: A socket guide SKG to be exchanged for each kind of an IC to be tested is provided at the upper part of an IC socket SK, and a frame body 11 formed of materials with high thermal conductivity mounted on the peripheral edge of an opening part formed in a thermostatic tank TEP is brought into contact with the socket guide SKG. A heater HE and a temperature sensor ST are mounted on the frame body 11, and the frame body 11 is heated in a prescribed temperature, and the heat is transmitted to the socket guide SKG, and the heat is transmitted to an IC which is being tested.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：通过使IC与IC插座接触，在用于测试由恒温槽加热的IC的IC测试装置中以廉价的结构实现IC的温度降低。解决方案：在IC插座SK的上部设置有用于每种待测试IC的交换的插座导向器SKG，以及安装在开口的周边边缘上的具有高导热性的材料形成的框体11，形成在恒温槽TEP中的部分与插座导向件SKG接触。加热器HE和温度传感器ST安装在框体11上，框架体11在规定温度下被加热，并且热量传递到插座导向件SKG，并且热量传递到IC 测试。

5. 发明专利

JPH09175647A SEMICONDUCTOR DEVICE CONVEYANCE AND PROCESS DEVICE 失效
公开(公告)号：JPH09175647A
公开(公告)日：1997-07-08
申请号：JP28412496
申请日：1996-10-25
申请人： ADVANTEST CORP
发明人： KIYOKAWA TOSHIYUKI , MURAYAMA TAKAO
IPC分类号： G01R31/26 , B65G47/80 , B65G47/90 , B65G49/00 , B65G49/07 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an IC handler which can give sufficiently long heat suction time or cool section time to an IC to be tested. SOLUTION: Recessed sections 5 for positioning for circular arrangement are formed in N row coaxially on a turn table 4. An IC to be tested which is stored in a tray is supplied sequentially into the recessed sections 5 for positioning for recessed section arrangement for positioning at outermost periphery or innermost periphery at an IC loading position. Every time the IC to be tested turns by one revolution in accordance with the rotation of the turn table 4, it is transferred to the other recessed section 5 for positioning of the recessed arrangement for positioning at the above IC loading position. After the IC to be tested is loaded in the above tray at the above-mentioned loading position and is turned by one revolution at least, a scope of angle from the loading position to a position where it is fed to a test section 7 is further moved to feed it into the test section 7.

6. 发明专利

JPH09124150A IC CONVEYING DEVICE FOR IC TEST 失效
公开(公告)号：JPH09124150A
公开(公告)日：1997-05-13
申请号：JP28163495
申请日：1995-10-30
申请人： ADVANTEST CORP
发明人： KIYOKAWA TOSHIYUKI
IPC分类号： G01R31/26 , B65G47/80 , B65G47/91 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To expose an IC to be tested to the temperature atmosphere for the sufficient long time by housing a plurality of ICs in positioning recessed parts formed on a turn table and by conveying them. SOLUTION: ICs are moved in a conveying process from the angle position A to B in a state where two ICs are housed in a positioning recessed parts 5. Two suction heads 15 suspended from a contact arm suck the ICs housed in the positioning recessed part 5 at the angle position B and feed them to a test part. When the IC positioned on the upper part of the positioning recessed part 5 is sucked, a rising and lowering stand 11 is lowered to the lower position by a driving means 12. The upper IC is sucked in that state and fed to the test part. When the upper IC is discharged, the rising and lowering stand 11 is moved to the higher position by driving the driving means 12. Therefore, the suction heads 15 suspended from the contact arm can suck the lower IC by that movement.

7. 发明专利

JPH08306765A TRAY MOUNTING TABLE FOR HANDLER 失效
公开(公告)号：JPH08306765A
公开(公告)日：1996-11-22
申请号：JP12984895
申请日：1995-04-28
申请人： ADVANTEST CORP
发明人： KIYOKAWA TOSHIYUKI
IPC分类号： G01R31/26 , B65G57/00 , B65G59/02 , G01R1/067 , H01L21/673 , H01L21/677 , H01L21/68 , H05K13/00
摘要： PURPOSE: To provide a tray mounting table for handler in which a tray is sustained horizontally in order to realize accurate attraction or handling regardless of the profile of tray. CONSTITUTION: The tray mounting table for handler is arranged, in two directions, with a positioning tray guide bar 15 for mounting a plurality of trays 90 on a tray slide base 5. Positioning in X-Y direction is performed by means of a tray adjusting bar 25 in accordance with the profile of the tray 90 which is pushed by means of a tray pusher 26. An elevator 35 for pushing up the tray 90 has a wide irregular plane except the part where the tray adjusting bar 25 is shifted. The main base 80 of handler is provided with a plurality of tray/reference bars 50, 51, 52, 53. The tray 90 is pushed up and inserted by means of the elevator 35 and transferred to the tray/reference bars 50, 51, 52, 53 thus sustaining the tray 90 horizontally.

8. 发明专利

JPH08166425A ROTARY MECHANISM FOR OBJECTIVE DEVICE IN IC TESTER HANDLER 失效
公开(公告)号：JPH08166425A
公开(公告)日：1996-06-25
申请号：JP33264994
申请日：1994-12-13
申请人： ADVANTEST CORP
发明人： KIYOKAWA TOSHIYUKI
IPC分类号： G01R31/26 , H01L21/66
摘要： PURPOSE: To obtain a rotary mechanism for device in an IC tester handier in which the rotary mechanism is eliminated from a suction head or a contact chuck and thereby a sequence software for controlling the operational sequence of the rotary mechanism is eliminated. CONSTITUTION: A plurality of change kits 5, each having intrinsic size and shape corresponding with each type of objective device 1 and rotational function, are provided for each buffet stage 2 on the loading side 3 and unloading side 4. The base part 6 of change kit is coupled through a bearing 13 with the rotary part 7 of change kit and a wire rope 9 is wound around a pulley 8. The winding length is regulated at a stopper part 10 and a fixed part 11 is provided on a main frame. Furthermore, the base part 6 of change kit and the pulley 8 are secured at the opposite ends thereof and the pulley 8 is imparted constantly with rotating torque from a coil spring 12.

9. 发明专利

JPH05297060A 失效
公开(公告)号：JPH05297060A
公开(公告)日：1993-11-12
申请号：JP10470792
申请日：1992-04-23
申请人： ADVANTEST CORP
发明人： KIYOKAWA TOSHIYUKI , OSHIMA TAKASHI
IPC分类号： G01R31/26 , H01L21/66
摘要： PURPOSE:To simply and accurately adjust a reference position by a method wherein a contact chuck in which a counterbored hole having a strict fitting size has been formed is used as one part of a calibration jig. CONSTITUTION:A counterbored hole 54 having a strict fitting size to a circuilar jig 53 is formed in the central position of a contact chuck 52 for calibration. The counterbored hole 54 is connected to a suction hole used to suck an IC. Also the contact chuck 52 itself is fixed to an X-Y arm at an X-Y conveyance divide in a state that it has been positioned with high accuracy by means of a guide pin 51. When a calibration jig constituted in this manner and an operating program for calibration are used, the suction height of the IC on a buffer stage 2 and the relative relationship between a CCD camera 12 in a contact height and the suction center of the IC are measured. Then, a calibration operation is executed in respective heights.

10. 发明专利

JP2002174658A HANDLER, AND TESTING DEVICE FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JP2002174658A
公开(公告)日：2002-06-21
申请号：JP2000370790
申请日：2000-12-05
申请人： ADVANTEST CORP
发明人： KIYOKAWA TOSHIYUKI
IPC分类号： G01R31/26 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a handler and a testing device that can efficiently convey and test electronic components, and that can be simplified and made small. SOLUTION: Either of a column space-variable function for electronic component holding parts 314, 323 and a line space-variable function therefor, is imparted to each of a first loader part conveyer 310 and a second loader part conveyer 320 provided with matrix-like electronic component holding parts 314, 323. Two unloader part conveyers 420, 430 provided with matrix-like electronic component holding parts 422, 433 are provided, and either of a column space-variable function for electronic component holding parts 422, 433 or a line space-variable function therefor is imparted to each of the first unloader part conveyer 420 and the second unloader part conveyer 430.

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