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1. 发明专利

JP2012047674A Dicing substrate for test, probe, and semiconductor wafer testing apparatus 审中-公开
标题翻译：用于测试，探针和半导体测试仪的定位基板
公开(公告)号：JP2012047674A
公开(公告)日：2012-03-08
申请号：JP2010192038
申请日：2010-08-30
申请人： Advantest Corp , Shinko Electric Ind Co Ltd , 新光電気工業株式会社 , 株式会社アドバンテスト
发明人： MATSUMURA SHIGERU , KATO KOHEI , SUGAI KATSUSHI , SHIROYAMA KOICHI , HIGASHI MITSUTOSHI , SHIRAISHI AKINORI , SAKAGUCHI HIDEAKI
IPC分类号： G01R1/073 , G01R31/26 , H01L21/66
CPC分类号： G01R1/07307
摘要： PROBLEM TO BE SOLVED: To provide a dicing substrate for test capable of improving test accuracy and connection reliability.SOLUTION: A dicing substrate 30 for test which is used for testing a semiconductor wafer includes: a main body portion 31; thin portions 321 and 322 extending from the main body portion 31 and being relatively thinner than the main body portion; and a bump 33 provided in the thin portions 321 and 322.
摘要翻译：要解决的问题：提供一种能够提高测试精度和连接可靠性的用于测试的切割基板。解决方案：用于测试半导体晶片的用于测试的切割基板30包括：主体部31; 薄壁部分321和322从主体部分31延伸并且比主体部分相对薄; 以及设置在薄部321和322中的凸块33.版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2004355932A Connector 有权
公开(公告)号：JP2004355932A
公开(公告)日：2004-12-16
申请号：JP2003151536
申请日：2003-05-28
申请人： Advantest Corp , 株式会社アドバンテスト
发明人： MURAYAMA SHIGERU , KANEKO MASANORI , MATSUMURA SHIGERU , SEKIZUKA TAKASHI , HAMA HIROYUKI
IPC分类号： H01R13/658 , H01R12/00 , H01R24/00 , H01R103/00 , H01R107/00 , H01R24/02
CPC分类号： H01R24/52 , H01R12/716 , H01R12/721 , H01R12/725 , H01R13/6581 , H01R13/6585 , H01R31/06 , H01R2103/00 , H01R2201/20
摘要： PROBLEM TO BE SOLVED: To provide a connecter in which the deterioration of a signal, entering of noises from surroundings, or the like can be prevented and the signal can be relayed appropriately on a transmitting line to relay the signal, at a test of an electronic device. SOLUTION: In the connector mounted on a substrate having a plurality of substrate signal wires to transmit the signal and having a substrate grounding wire to be grounded, a plurality of signal terminals respectively installed correspondingly at the plurality of the respective substrate signal wires are provided, and the respective signal terminals have signal core wires linearly extended and formed by a conductor, a shield for the core wire extended in the axial direction of the signal core wire so as to surround the signal core wire and formed by the conductor electrically insulated from the signal core wire, a signal electrode which is extended from the signal core wire and formed and which connects the signal core wire and the substrate signal wire corresponding to the signal terminal, and a plurality of ground electrodes which are extended from the shield for the core wire and formed mutually faced pinching the signal electrode, and which respectively connects the shield for the core wire and the substrate grounding wire. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JPH09246800A SUBSTRATE FOR SEMICONDUCTOR DEVICE MEASUREMENT USE 失效
公开(公告)号：JPH09246800A
公开(公告)日：1997-09-19
申请号：JP4483996
申请日：1996-03-01
申请人： ADVANTEST CORP
发明人： MATSUMURA SHIGERU
IPC分类号： H05K13/08 , G01R31/28 , H05K7/10
摘要： PROBLEM TO BE SOLVED: To enhance the positional accuracy of a socket by a method wherein the outer mounting lead of a device socket is inserted in a through hole for socket use, which is formed in a printed board, and the socket of the shape of a slender cylinder having a gap is pressed into the through hole to connect electrically with a socket mounting substrate at the shortest distance. SOLUTION: A through hole 2 for solder use, which corresponds to the position of an outer mounting lead of a device socket, is formed in an electrical wiring in a printed board 1, while a tabular spring material is formed into the shape of a slender cylinder having a gap and both side parts of the slender cylinder are partially bent to the outside to provide a spring part 3a for press- fitting use in a socket 3. The socket 3 is pressed into the hole 2 to connect electrically with a socket mounting substrate 5 at the shortest distance. Thereby, the positional accuracy of the socket 3, in which the outer mounting lead of the device socket is inserted, can be enhanced.

4. 发明专利

JP2008076308A Interface device for electronic component test equipment 审中-公开
标题翻译：电子部件测试设备接口装置
公开(公告)号：JP2008076308A
公开(公告)日：2008-04-03
申请号：JP2006257922
申请日：2006-09-22
申请人： Advantest Corp , 株式会社アドバンテスト
发明人： MATSUMURA SHIGERU , OSAWA KAZUTAKA , HAMA HIROYUKI , IZUMI YUICHIRO
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01R31/06 , G01R31/2889
摘要： PROBLEM TO BE SOLVED: To provide easily-producible interface device.
SOLUTION: This interface device 5 to be mounted on the top of a test head 4 comprises a power cable 54 with its one end electrically-connected to a socket board 66, a device side connector 541 attached to the other end of the power cable 54, and a relay connector 53 which electrically-connects a test head side connector 41 installed in the test head 4 with the device side connector 541. The relay connector 53 comprises a connector body 531 installed in the bottom of the interface device 5, mating hole 532 made on that connector body 531 to attachably/detachably connect the device side connector 541, and an output terminal 537 to attachably/detachably be connected with the test head side connector 41.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供易于生产的接口设备。解决方案：要安装在测试头4的顶部的该接口装置5包括电源线54，其一端电连接到插座板66，装置侧连接器541连接到插座板66的另一端。电源电缆54和将安装在测试头4中的测试头侧连接器41与设备侧连接器541电连接的中继连接器53.中继连接器53包括安装在接口设备5的底部的连接器主体531 ，在该连接器主体531上形成的可安装/拆卸地连接设备侧连接器541的配合孔532和可拆卸地连接到测试头侧连接器41的输出端子537。（C）2008年， JPO＆INPIT

5. 发明专利

JP2003308744A Method for manufacturing precise foam coaxial cable 有权
标题翻译：制造精密同轴电缆的方法
公开(公告)号：JP2003308744A
公开(公告)日：2003-10-31
申请号：JP2002114451
申请日：2002-04-17
申请人： Advantest Corp , Hirakawa Hewtech Corp , 平河ヒューテック株式会社 , 株式会社アドバンテスト
发明人： YAMAGUCHI TETSUO , IWASAKI MITSUO , ISHIDO TAKAO , KUSAMA TAKAAKI , NANJO MITSUO , MATSUMURA SHIGERU , MURAYAMA SHIGERU
IPC分类号： H01B11/18 , H01B13/00 , H01B13/016
CPC分类号： Y02A30/50
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing precise foam coaxial cable capable of improving precision of characteristic impedance value between an inner conductor and an outer conductor and stabilizing a secondary forming process by executing secondary forming of the outer conductor and a high foam insulator of coaxial cable having high foam insulator (degree of foaming is 60% or more) having porous tape body adapted and equalizing thickness and outer diameters thereof and making an outer shape thereof a complete round. SOLUTION: In manufacturing precise foam coaxial cable having a foam insulator 2 formed on an outer circumference of the inner conductor 1 and having the outer conductor 3 formed on an outer circumference of the form insulator 2, the foam insulator 2 is formed by winding porous tape body of porosity 60% or more around the inner conductor 1. The foam insulator 2 is passed through a forming die having a designated inner diameter to form the same in a complete round of the designated outer diameter, a plurality of conductive fine wires are woven around an outer circumference of the foam insulator 2 to form the outer conductor 3. The outer conductor 3 is passed through an outer conductor forming die having a designated inner diameter to form a complete round of the designated outer diameter. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种能够提高内部导体和外部导体之间的特性阻抗值的精度的精确的泡沫同轴电缆的制造方法，并且通过执行外部导体的二次成形来稳定二次成形工艺，以及具有高泡沫绝缘体（发泡度为60％以上）的同轴电缆的高泡沫绝缘体，其具有适于并均匀其厚度和外径的多孔带体，并使其外形为圆形。解决方案：在制造具有形成在内导体1的外周上并具有形成在成形绝缘体2的外周上的外导体3的泡沫绝缘体2的精密泡沫同轴电缆的情况下，泡沫绝缘体2由围绕内部导体1的孔隙率为60％以上的多孔带状多孔带体。通过具有指定内径的成形模具，使泡沫绝缘体2在指定外径的整个圆周内形成，形成多个导电细电线围绕发泡绝缘体2的外圆周编织以形成外部导体3.外部导体3穿过具有指定内径的外部导体成形模具以形成指定外径的完整圆形。版权所有（C）2004，JPO

6. 发明专利

JP2003151710A IC SOCKET 审中-公开
公开(公告)号：JP2003151710A
公开(公告)日：2003-05-23
申请号：JP2001345630
申请日：2001-11-12
申请人： ADVANTEST CORP
发明人： MATSUMURA SHIGERU
IPC分类号： H01R33/76 , H01L23/32
摘要： PROBLEM TO BE SOLVED: To provide an IC socket of low inductance. SOLUTION: An insulation elastic body 33 through which an accommodation hole 34 opposed to an electrode pad 32 is penetrated/formed is arranged on a base plate 31 in which the electrode pad 32 is arranged/formed corresponding to a bump arrangement of a device and a plurality of conductive balls 35 are accommodated in the respective accommodation holes 34. The conductive balls 35 is made movable and are contacted with the electrode pad 32 respectively. A removal of them is prevented by a small diameter part 34a and a part of the conductive balls is faced to the outside from the small diameter part 34. The bump 13 is electrically conducted to the electrode pad 32 through these conductive balls 35.

7. 发明专利

JPH097661A CONNECTING PIN OF IC SOCKET 失效
公开(公告)号：JPH097661A
公开(公告)日：1997-01-10
申请号：JP17553395
申请日：1995-06-19
申请人： ADVANTEST CORP
发明人： MATSUMURA SHIGERU
IPC分类号： H01R33/76 , G12B9/00 , H01L23/32 , H01R9/09
摘要： PURPOSE: To provide the small-sized and inexpensive form of a connecting pin for IC connector capable of high density connection which is used in the device interface part of an IC tester. CONSTITUTION: In the working form of the connecting pin 2 of an IC socket 1, one or a plurality of bent parts 3 are provided on the connecting pin 2 which is inserted to the pin connector 4 of the device interface part of an IC tester to make an electric connection, and a form enhanced in spring property is provided. The connecting pin 2 may be provided with a slit, a spring rolled into funnel form, or a plurality of bent parts having different directions.

8. 发明专利

JPH08288616A PIN-SOCKET CONNECTOR FOR MOUNTING ON SUBSTRATE 失效
公开(公告)号：JPH08288616A
公开(公告)日：1996-11-01
申请号：JP11393995
申请日：1995-04-14
申请人： ADVANTEST CORP
发明人： MATSUMURA SHIGERU
IPC分类号： G01R31/26 , G01R1/04 , H01R13/64 , H01R33/76 , H05K1/18 , H05K7/10
摘要： PURPOSE: To provide the structure of a pin-socket connector constituting the IC device interface section of an IC tester which can improve the packing density and electrical connection characteristic of the connector and can reduce the cost of the connector. CONSTITUTION: A pin-socket connector is constituted of a bottom 8 which becomes a stopper when the connector is press-fitted to a printed wiring board 15, contacting section 3 which is formed above the bottom 8 and brought into contact with the internal surface of a through hole 16, and spring section 2 which is connected to the contacting section 3 and composed a plurality of conductive spring materials. The through hole 16 is covered from a lower land 20 side.

9. 发明专利

JPH0817500A SOCKET FOR BGAIC AND SPRING PIN FOR USE IN THE SAME 失效
公开(公告)号：JPH0817500A
公开(公告)日：1996-01-19
申请号：JP14924094
申请日：1994-06-30
申请人： ADVANTEST CORP
发明人： WATANABE MASAO , MATSUMURA SHIGERU
IPC分类号： G01R31/26 , G01R1/04 , G01R1/067 , G01R1/073 , H01L23/12 , H01L23/32 , H01R13/04 , H01R33/76
摘要： PURPOSE:To provide a high reliable, long-life, and low-cost spring pin for a socket for use with a high density ball head. CONSTITUTION:A body 11 is formed from a phosphor bronze pipe, and its foremost part is widened as tapered on the inner surface so that a contacting part 12 is formed, wherein the angle theta1 of the tapered inner surface to the body axis is made approx. 30 deg. In the contacting part, four slots 13 stretching axially are provided from the foremost, and the resilience of the split linear part generates resilient contacting with a ball head 15. Even though a spring pin is intruded, the contacting place 21 with the contacting part 12 of the ball head 15 remains constant substantially.

10. 发明专利

JPH0777559A TOOL STRUCTURE FOR MEASURING ELECTRICAL CHARACTERISTICS OF IC MEMORY MODULE 失效
公开(公告)号：JPH0777559A
公开(公告)日：1995-03-20
申请号：JP24635993
申请日：1993-09-08
申请人： ADVANTEST CORP
发明人： MATSUMURA SHIGERU
IPC分类号： G01R31/28
摘要： PURPOSE:To provide a measuring tool structure for enhancing the reliability and durability of contact at the contact point between a measuring tool and the connecting pad on an object to be measured while allowing mounting/ demounting of the measuring tool on/from the object to be smoothly performed in a short time. CONSTITUTION:A guide for mounting an object to be measured, i.e., an IC module, is provided on the base of a measuring tool. The measuring tool comprises a measuring system including a probe pin 8 and a coaxial wiring cable 9, and a guide pin 7, and a block 11 is mounted on a slide bearing 12. A lever is provided at the lower part of the base in order to bring the object close to the entire block 11 and to eventually bring into contact therewith. Positioning is effected by means of the guide pin 7 when the lever is pulled toward an operator and the connecting pad 2 on the IC module 1 comes into contact with a structural part of measuring tool, i.e., the probe pin 8.

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