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1. 发明专利

JP2015056562A 半導体装置及び放射線装置审中-公开
标题翻译：半导体器件和辐射器件
公开(公告)号：JP2015056562A
公开(公告)日：2015-03-23
申请号：JP2013189818
申请日：2013-09-12
申请人：株式会社東芝 , Toshiba Corp , 東芝メディカルシステムズ株式会社 , Toshiba Medical Systems Corp
发明人： KADOTA TOMOKO , KUNO KATSUMI , KUGIMIYA TETSUYA , HIROHATA KENJI , HONGO TAKUYA , YAMAYORI YU
IPC分类号： H01L23/36 , H05K7/20
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要：【課題】熱疲労を低減することと、振動・衝撃・荷重から保護することとを両立させることができる半導体装置及び放射線装置を提供する。【解決手段】実施形態の半導体装置は、半導体素子と、ゲルと、鈍化部材と、を有する。ゲルは、半導体素子周辺を予め定められた強度で絶縁して封止する。鈍化部材は、ゲル内に設けられ、潜熱及び外部からの制御の少なくともいずれかにより、予め定められた温度範囲に対し、ゲルの温度の上昇及び下降における温度変化を鈍らせる。【選択図】図3
摘要翻译：要解决的问题：提供一种可以实现热疲劳降低和防止振动，冲击和负载的半导体器件和辐射装置。解决方案：半导体器件具有半导体元件，凝胶和钝化元件。凝胶以预定强度绝缘并密封半导体元件的周边。在凝胶体中设置有钝化部件，通过潜热和外部控制中的至少任意一种使凝胶的温度在预定温度范围的上升和下降之间变差。

2. 发明专利

JP2013178061A Flying object 审中-公开
标题翻译：飞行对象
公开(公告)号：JP2013178061A
公开(公告)日：2013-09-09
申请号：JP2012043108
申请日：2012-02-29
申请人： Toshiba Corp , 株式会社東芝
发明人： NINOMIYA SHUICHI , KUGIMIYA TETSUYA , HISAKUNI YOSUKE , HOSOKI TOMOHIRO , NOFUJI MASATO
IPC分类号： F42B10/46 , B64C1/36 , H01Q1/28 , H01Q1/42
摘要： PROBLEM TO BE SOLVED: To provide a flying object having a radome capable of enduring aerodynamic heating and aerodynamic load, and having superior transmission performance to electric waves of broadband.SOLUTION: A flying object 1 flying toward a target, includes a body section 10 for storing a propulsion mechanism inside, an electronic scanning antenna 20 fixed to a front part of the body section 10 and orienting the target, and a radome 30 having a tapered curved shape at its outer peripheral section and covering the electronic scanning antenna 20. A body section 31 of the radome 30 is made of a resin composite material, and has an outer skin configuring an outer wall surface of the radome 30, an inner skin made of a resin composite material and configuring an inner wall surface of the radome 30, a core material held between the outer skin and the inner skin, and a reinforcement member surrounded by the outer skin, the inner skin and the core material, and disposed on a region of insufficient strength near the body section 10.
摘要翻译：要解决的问题：提供具有能够承受空气动力学加热和空气动力学负载的天线罩的飞行物体，并且对宽带电波具有优异的传输性能。解决方案：朝向目标飞行的飞行物体1包括：主体部分10，其用于在内部存储推进机构，固定到主体部10的前部并定向目标的电子扫描天线20以及在其外周部具有锥形弯曲形状的天线罩30，并覆盖电子扫描天线20.主体天线罩30的部分31由树脂复合材料制成，并且具有构成天线罩30的外壁表面的外皮，由树脂复合材料制成的内表面，并且配置天线罩30的内壁表面，保持在外皮和内皮之间的芯材，以及被外皮，内皮和芯材包围的加强件，在身体部分10附近具有足够的强度。

3. 发明专利

JP2010171253A Semiconductor device, and manufacturing method thereof 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010171253A
公开(公告)日：2010-08-05
申请号：JP2009013140
申请日：2009-01-23
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAYORI YU , KUGIMIYA TETSUYA , HIROHATA KENJI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is high in reliability by reducing stress concentration due to singularity of an end of an interface between an under-bump metal layer and an insulating film at a junction part between a semiconductor chip and a package substrate, and to provide a manufacturing method thereof. SOLUTION: The semiconductor device includes: a semiconductor chip 20 having a plurality of electrode pads 23 for semiconductor formed on a surface of a multilayer wiring layer 22 on a semiconductor substrate 21, an insulating film 24 having openings wherein the electrode pads 23 are exposed, and a plurality of under-bump metal layers 25 formed from on the electrode pads 23 to regions reaching the insulating film 24 nearby the openings corresponding to the pads 23; and a substrate 31 having solder bumps 26 formed on the under-bump metal layer 25 and a plurality of electrode pads 32 for substrate formed at the electrode pads 23, the solder bumps 26 being joined to the electrode pads 32 for substrate. A groove 27 having a cavity inside is formed in the insulating film 24 to be right below an end of the under-bump metal layer 25. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件，其通过在半导体芯片之间的接合部分处减小由凸块状金属层和绝缘膜之间的界面的端部的奇异性引起的应力集中，从而可靠性高和封装基板，并提供其制造方法。解决方案：半导体器件包括：具有形成在半导体衬底21上的多层布线层22的表面上的多个用于半导体的电极焊盘23的半导体芯片20，具有开口的绝缘膜24，其中电极焊盘23 以及从电极焊盘23形成的多个凸块下金属层25到达与焊盘23对应的开口附近的到达绝缘膜24的区域; 以及形成在凸块状金属层25上的焊料凸块26和形成在电极焊盘23上的多个用于基板的电极焊盘32的基板31，焊料凸点26与基板用电极焊盘32接合。在绝缘膜24内形成有内腔的凹槽27，其正好位于凸块下金属层25的正下方。版权所有：（C）2010，JPO＆INPIT

4. 发明专利

JP2008294397A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2008294397A
公开(公告)日：2008-12-04
申请号：JP2007326350
申请日：2007-12-18
申请人： Toshiba Corp , 株式会社東芝
发明人： ITANI KOJI , YOSHINO KENICHI , ITO TAKAYUKI , KAWAKAMI TAKASHI , KUGIMIYA TETSUYA
IPC分类号： H01L21/265 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can conduct heat treatments, while reducing wafer cracking.
SOLUTION: A method of manufacturing a semiconductor device that involves a heat treatment of a semiconductor substrate 11; removes a superficial layer from an upper surface 34 of an edge part of the semiconductor substrate 11, bevel surfaces 32 and 33 of the edge part of the semiconductor substrate and a side surface 31 of the edge part of the semiconductor substrate 11; and conducting the heat treatment of the semiconductor substrate 11, by irradiating the semiconductor substrate 11 with a light having a pulse width range of 0.1 ms to 100 ms from a light source, after the superficial layer is removed.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造可以进行热处理的半导体器件的方法，同时减少晶片破裂。解决方案：一种制造涉及半导体衬底11的热处理的半导体器件的方法; 从半导体衬底11的边缘部分的上表面34，半导体衬底的边缘部分的斜面32和33以及半导体衬底11的边缘部分的侧表面31去除表面层; 并且在去除表面层之后，通过从光源照射具有0.1ms至100ms脉冲宽度范围的光的半导体衬底11，对半导体衬底11进行热处理。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2007163965A Display device 审中-公开
标题翻译：显示设备
公开(公告)号：JP2007163965A
公开(公告)日：2007-06-28
申请号：JP2005361999
申请日：2005-12-15
申请人： Toshiba Corp , 株式会社東芝
发明人： OMORI TAKAHIRO , KUGIMIYA TETSUYA , TAKAHASHI HIROYUKI
IPC分类号： G09F9/00 , G02F1/1333
CPC分类号： G06F1/1601 , G06F2200/1612
摘要： PROBLEM TO BE SOLVED: To provide a display device which has a flat display panel prevented from being broken due to the increase in bending of an image display face in a direction crossing the image display face, which is caused by impulsive force in this direction, even in the case of the increase in external dimensions of the flat display panel and has a simple structure not to raise material costs and assembling costs.
SOLUTION: The display device 10 includes; a flat display panel 12 including an image display face 12a, at least two edges 12b which cross a direction in which the image display face is directed and are directed in opposite directions to each other, and support parts 12d which are provided integrally with at least the two edges throughout at least the two edges; and a housing 14 including at least two fixing parts 14d or 14g which support and fix respective support parts of at least the two edges of the flat display panel in the direction in which the image display face of the flat display panel is directed, throughout the support parts.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种显示装置，其具有防止由于图像显示面在与图像显示面相交的方向上的弯曲的增加而被破坏的显示面板，其由冲击力引起该方向即使在平板显示面板的外部尺寸增加的情况下也具有简单的结构，不能提高材料成本和组装成本。解决方案：显示装置10包括：包括图像显示面12a的平坦显示面板12，与图像显示面朝向彼此相反的方向的至少两个边缘12b以及至少一体地设置的支撑部12d 两个边缘至少在两个边缘; 以及包括至少两个固定部分14d或14g的壳体14，所述至少两个固定部分14d或14g在平面显示面板的图像显示面的方向上支撑并固定平面显示面板的至少两个边缘的各个支撑部分，支持部件。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2012181966A Lighting apparatus 有权
标题翻译：照明设备
公开(公告)号：JP2012181966A
公开(公告)日：2012-09-20
申请号：JP2011043040
申请日：2011-02-28
申请人： Toshiba Corp , 株式会社東芝
发明人： KUNO KATSUMI , KATO MITSUAKI , SUZUKI TOMOYUKI , TAKAMATSU TOMONAO , KUGIMIYA TETSUYA
IPC分类号： F21S2/00 , F21Y101/02
CPC分类号： F21V29/004 , F21K9/232 , F21V3/00 , F21V29/74 , F21V29/773 , F21V29/83 , F21V29/89 , F21Y2105/10 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a lighting apparatus with temperature rise restrained of a light-emitting element and a power source circuit, and achieving a wide light distribution.SOLUTION: The lighting apparatus is provided with a board, base, globe, housing, and a cap part. The board is provided with a light-emitting element. The base has a first and a second sides, the former having the board mounted and thermally connected with the same. The globe is fitted to the base so as to cover the light-emitting element. The housing is provided with a cylindrical radiating body with a first and a second end parts opened for air to distribute, mounted on the second side so as the first end part to be set opposed to the second side and yet to allow a gap between the first end part and the base, and is thermally connected with the base. The cap part is mounted on the housing in opposition to the second end part and so as to allow a gap against the second end part. The first end part is positioned further toward a cap part side than the maximum diameter part of the globe where a length of the globe in a radial direction gets maximum.
摘要翻译：解决的问题：为了提供一种抑制发光元件和电源电路的温升的照明装置，并且实现宽的光分布。
解决方案：照明装置设置有板，基座，球体，壳体和帽部。板上设有发光元件。底座具有第一侧和第二侧，前者具有安装板并与其热连接。将球体安装在基座上以覆盖发光元件。壳体设置有圆柱形辐射体，其具有第一和第二端部部分，该第一和第二端部部分开放以便分布，安装在第二侧上，使得第一端部被设置为与第二侧面相对并且还允许第一端部和底座，并且与基座热连接。帽部分与第二端部相对地安装在壳体上，以便允许与第二端部部分的间隙。第一端部被定位成比球形体的最大直径部分更靠近帽部分侧，其中球形体在径向上的长度最大。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2010023889A Shock-absorbing material and packing box 有权
标题翻译：防震材料和包装盒
公开(公告)号：JP2010023889A
公开(公告)日：2010-02-04
申请号：JP2008188669
申请日：2008-07-22
申请人： Toshiba Corp , 株式会社東芝
发明人： YAOITA AKIKO , KUGIMIYA TETSUYA , MUKAI MINORU
IPC分类号： B65D81/107 , B65D85/38 , B65D85/68
摘要： PROBLEM TO BE SOLVED: To provide a shock-absorbing structure achieved in the at miniaturization of a shock-absorbing material formed of a corrugated board in transportation package using a space between a packed object and an outer package box effectively. SOLUTION: The shock-absorbing material formed of a corrugated board sheet or a pulp mold is a square tube with upper and lower openings and with sidewalls with nearly isosceles trapezoid shape adjacent to each other, four faces are connected turning upside down the upper base and the lower base of the isosceles trapezoid shape, wherein impact energy is absorbed utilizing a break of a member constituting the shock-absorbing material and also an impact stroke is assured by evacuating folded and piled broken members in the vertical surface in a loading direction. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种在包装物和外包装盒之间有效地使用运输包装中由波纹板形成的减震材料在小型化中实现的减震结构。解决方案：由瓦楞纸板或纸浆模具形成的减震材料是具有上下开口的方管，并且具有彼此相邻的近似等腰梯形的侧壁，四个面相互连接，上底座和下底座的等腰梯形，其中利用构成冲击吸收材料的构件的断裂吸收冲击能量，并且通过在垂直表面中以负载方式抽空折叠和堆叠的断裂构件来确保冲击行程方向。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2008242044A Variable geometry mirror 审中-公开
标题翻译：可变几何镜
公开(公告)号：JP2008242044A
公开(公告)日：2008-10-09
申请号：JP2007081923
申请日：2007-03-27
申请人： Topcon Corp , Toshiba Corp , 株式会社トプコン , 株式会社東芝
发明人： MASUNISHI KATSURA , KOGA AKIHIRO , FURUKAWA RYO , KUGIMIYA TETSUYA , KOBAYASHI AKIO , KAWASHIMA HIROYUKI
IPC分类号： G02B5/10 , G02B26/02
CPC分类号： G02B26/0825
摘要： PROBLEM TO BE SOLVED: To provide a variable geometry mirror which can change its shape into a complicated shape (high order shape).
SOLUTION: This variable mirror has a base plate 2, electrodes 4
1 -4
n set up on this plate; a spacer 8 fixed on the plate and having a first opening set up surrounding the electrode and extending from the surface facing the plate to the other surface of the plate, and level difference steps on the surface opposite to the plate; a membrane 12 covering those level difference steps and facing the electrodes; a case 14 having an opening on its bottom to expose the membrane and supporting it; a driver 10 having a reflective film 16 set up on the membrane; and voltage generators 20 to generate predetermined voltage patterns on the electrodes, respectively.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供可以将其形状改变成复杂形状（高阶形状）的可变几何镜。
解决方案：该可变镜具有底板2，设置在该板上的电极4 -4 n 固定在所述板上并具有围绕所述电极并从面向所述板的表面延伸到所述板的另一表面的第一开口以及与所述板相对的表面上的水平差步骤的间隔件8; 覆盖这些水平差步骤并面向电极的膜12; 在其底部具有开口以暴露膜并支撑其的壳体14; 具有设置在膜上的反射膜16的驱动器10; 和电压发生器20，分别在电极上产生预定的电压图形。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2007034939A Electronic equipment 审中-公开
标题翻译：电子设备
公开(公告)号：JP2007034939A
公开(公告)日：2007-02-08
申请号：JP2005220867
申请日：2005-07-29
申请人： Toshiba Corp , 株式会社東芝
发明人： OE TOSHIO , OMORI TAKAHIRO , TAKAHASHI HIROYUKI , KUGIMIYA TETSUYA , MUKAI MINORU
IPC分类号： G06F1/16 , G02F1/1333 , G09F9/00
CPC分类号： G06F1/1616 , G02F1/133308 , G02F2201/46 , G06F1/1637
摘要： PROBLEM TO BE SOLVED: To provide a display device fixed structure capable of relaxing a load applying to an inplane direction along the display surface of the display device. SOLUTION: A portable computer 1 comprises the display device 6, a housing and metal fittings 33. The display device has four outer edge parts 612, 623, 634 and 641 and four corner parts 61, 62, 63 and 64 composed of the four outer edge parts. The housing has a back wall 31b covering the back face of the display device and outer circumferential wall 31a surrounding the outer circumference of the display device. The metal fittings have fixing pieces 33a and are fixed to the display device. The back wall has a first area A1 and a second area A2. The first area is an area located between the four outer edge parts and the outer circumferential wall. The second area is an area located between the corner parts and the outer circumferential wall other than the first area and an area facing the back face of the display device. The fixing pieces of the metal fittings are fixed to the second area. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种显示装置固定结构，其能够沿着显示装置的显示表面放松施加到面内方向的负载。解决方案：便携式计算机1包括显示装置6，壳体和金属配件33.显示装置具有四个外边缘部分612,663,634和641以及由四个角部分61,62,63和64组成的四个角部分61,62,63和64，四个外缘部分。壳体具有覆盖显示装置的背面的后壁31b和围绕显示装置的外周的外周壁31a。金属配件具有固定片33a并且固定到显示装置。后壁具有第一区域A1和第二区域A2。第一区域是位于四个外边缘部分和外周壁之间的区域。第二区域是位于角部与除第一区域以外的外周壁和面向显示装置的背面的区域之间的区域。金属配件的固定件固定到第二区域。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2005165480A Portable electronic device 审中-公开
标题翻译：便携式电子设备
公开(公告)号：JP2005165480A
公开(公告)日：2005-06-23
申请号：JP2003400913
申请日：2003-11-28
申请人： Toshiba Corp , 株式会社東芝
发明人： KUGIMIYA TETSUYA
IPC分类号： G06F15/02 , G06F1/16
摘要： PROBLEM TO BE SOLVED: To provide a portable electronic device which can be made more resistant against an impact of fall. SOLUTION: The portable electronic device has electronic equipment 3 with a mechanical precision mechanism that should be protected against an external impact. The electronic equipment 3 is held in a casing 1 that has a generally flat bottom surface. A pair of protruding strips 4 are formed around an area of a projection defined by projecting the electronic equipment 3 to the plane of the casing's bottom surface 1a. The pair of protruding strips 4 are located in proximity to opposite sides and extend toward the opposite sides 6. COPYRIGHT: (C)2005,JPO&NCIPI

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