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    • 6. 发明专利
    • Electronic apparatus
    • JP5297353B2
    • 2013-09-25
    • JP2009264939
    • 2009-11-20
    • 株式会社日立製作所
    • 義広 近藤忠克 中島浩之 豊田重幸 佐々木昭男 出居重匡 佐藤
    • H05K7/20G06F1/20H05K7/18
    • Y02D10/16
    • PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of mounting thereon a wide variety of high density server modules and capable of cooling a high output electric power source module in a miniaturized and high density electric power source module for the server, a server apparatus capable of dealing with an increased power consumption of a semiconductor element in a high performance server module and a blade server for which the shape is restricted. SOLUTION: The electric power source module is configured such that an electronic substrate mounted with a transformer, a regulator, a capacitor and the like, and a cooling fan are contained in a metal plate case of an electric power source module, and air is blown by the fan module, wherein a heat conducting member such as a heat pipe is connected to each of the transformer and the regulator of the electric power source module, one end of the heat conducting member is connected to the metal plate case of the electric power source module, a heat radiating fin of the fan module is connected to a metal plate case of fan module, and the metal plate case to which the heat conducting member of the electric power source module is connected and the metal plate case to which the heat radiating fin of the fan module is connected are connected via a heat conducting sheet. COPYRIGHT: (C)2011,JPO&INPIT