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1. 发明专利

JP2013016261A Light source fixing member 有权
标题翻译：光源固定器
公开(公告)号：JP2013016261A
公开(公告)日：2013-01-24
申请号：JP2011146267
申请日：2011-06-30
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , SONE NAOKI , NANBA TAKANORI , INOUE TAKASHI , TANAKA HIDETADA , MATSUMOTO AKIHIRO
IPC分类号： F21S8/10 , F21V19/00 , F21V23/00 , F21V29/00 , F21Y101/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To promptly connect a light source and a control circuit part for controlling lighting of the light source.SOLUTION: A first heat sink for radiating heat of a light-emitting element is attached on a lower surface of an attachment 34. A package fixing part 34f fixes a package having the light-emitting element to the first heat sink by attaching the attachment 34 to the first heat sink. On a circuit housing part 34a, a control circuit board for controlling lighting of the light-emitting element is mounted. The attachment 34 includes a conductive member 64 connected with the control circuit board. The conductive member 64 comes in contact with an electrode of the light-emitting element as the attachment 34 is attached to the first heat sink, and is provided so as to electrically connect the control circuit board and the light-emitting element.
摘要翻译：要解决的问题：及时连接用于控制光源照明的光源和控制电路部分。解决方案：用于散发发光元件的第一散热器附着在附件34的下表面上。封装固定部分34f将具有发光元件的封装通过附接固定到第一散热器附件34到第一散热器。在电路壳体部分34a上安装用于控制发光元件的点亮的控制电路板。附件34包括与控制电路板连接的导电构件64。导电构件64随着附件34附接到第一散热器而与发光元件的电极接触，并且被设置为电连接控制电路板和发光元件。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2017117845A 半導体発光素子およびその製造方法审中-公开
公开(公告)号：JP2017117845A
公开(公告)日：2017-06-29
申请号：JP2015248898
申请日：2015-12-21
申请人：株式会社小糸製作所 , Koito Mfg Co Ltd
发明人： SONE NAOKI , NOMURA AKIHIRO , SUGIMORI SHOGO
IPC分类号： H01L33/06 , C23C16/34
摘要：【課題】ラストバリア層の表面状態を良好にして結晶品質を維持し、発光効率を向上させることが可能な半導体発光素子およびその製造方法を提供する。【解決手段】障壁層と井戸層を交互に積層した多重量子井戸活性層と、多重量子井戸活性層の上に形成された電子ブロック層とを備える半導体発光素子であって、障壁層のうち最上層であるラストバリア層は、他の障壁層よりも厚く、電子ブロック層からの不純物が拡散されている拡散領域と、電子ブロック層からの不純物が到達していない非拡散領域とを備えている。【選択図】図3

3. 发明专利

JP2012074218A Circuit module, light emitting module, and lighting fixture for vehicle 有权
标题翻译：电路模块，发光模块和车辆照明装置
公开(公告)号：JP2012074218A
公开(公告)日：2012-04-12
申请号：JP2010217566
申请日：2010-09-28
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , INOUE TAKASHI , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： F21S8/10 , F21V29/00 , F21V29/02 , F21Y101/02
CPC分类号： F21V19/042 , B60Q1/0408 , F21S41/147 , F21S41/192 , F21S45/43 , F21S45/49 , F21S48/1109 , F21S48/1159 , F21S48/321 , F21S48/325 , F21V23/02 , F21V29/02 , F21V29/677 , F21V29/70 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a technology which can individually optimize heat radiation of a semiconductor light-emitting element and a lighting control circuit.SOLUTION: The circuit module 14 includes a lighting control circuit 22 for controlling lighting of a semiconductor light-emitting element, a first heat radiation member 24 on which the lighting control circuit 22 is mounted, a second heat radiation member 26 which is separated from the first heat radiation member 24 and has a surface 40a on which the semiconductor light-emitting element is mounted, a housing 30 which joins mutually the first heat radiation member 24 and the second heat radiation member 26, and a connection mechanism 28 having a conductive part 32 for transmitting a signal from the lighting control circuit 22 to the semiconductor light-emitting element. The housing 30 is constructed of a material having a thermal conductivity lower than that of the first heat radiation member 24 and the second heat radiation member 26.
摘要翻译：要解决的问题：提供可以单独优化半导体发光元件和照明控制电路的散热的技术。电路模块14包括用于控制半导体发光元件的点亮的点亮控制电路22，安装着照明控制电路22的第一散热构件24，第二散热构件26，与第一散热构件24分离并且具有安装有半导体发光元件的表面40a，将第一散热构件24和第二散热构件26相互连接的壳体30以及具有第一散热构件24的连接机构28，用于将来自点亮控制电路22的信号发送到半导体发光元件的导电部32。壳体30由导热率低于第一散热构件24和第二散热构件26的导热性的材料构成。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2013020935A Vehicle headlight 有权
标题翻译：车辆头灯
公开(公告)号：JP2013020935A
公开(公告)日：2013-01-31
申请号：JP2012002289
申请日：2012-01-10
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： INOUE TAKASHI , SUZUKI TETSUYA , MATSUMOTO AKIHIRO , SONE NAOKI , NANBA TAKANORI , TANAKA HIDETADA
IPC分类号： F21S8/10 , F21V29/00 , F21W101/10 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To suppress an occupied space of a vehicle headlight.SOLUTION: As for a vehicle headlight, a light-emitting module 14 is integrally constructed of a light-emitting element 20 and a control circuit part 42 for controlling lighting of the light-emitting element 20. The control circuit part 42 is arranged at a lower part of a shade so as to avoid a course of light used for formation of a low-beam light distribution pattern out of the light emitted by the light-emitting element 20 further in front of the lamp than the light-emitting element 20. In this case, a main optical axis Ax2 of the light-emitting element 20 is vertical to a lamp optical axis Ax1, and the light-emitting part is arranged so as to project further in a main optical axis Ax2 direction than the control circuit part 42.
摘要翻译：要解决的问题：抑制车辆前灯的占用空间。解决方案：对于车辆前照灯，发光模块14由发光元件20和用于控制发光元件20的点亮的控制电路部42一体地构成。控制电路部分42是布置在阴影的下部，以避免用于在发光元件20发射的光之外用于形成远光配光图案的光线比发光在这种情况下，发光元件20的主光轴Ax2与灯光轴Ax1垂直，发光部配置成比主光轴Ax2方向更远控制电路部分42.版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012074217A Circuit module, light emitting module, and lighting fixture for vehicle 有权
标题翻译：电路模块，发光模块和车辆照明装置
公开(公告)号：JP2012074217A
公开(公告)日：2012-04-12
申请号：JP2010217565
申请日：2010-09-28
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： F21S8/10 , F21Y101/02
CPC分类号： F21V19/042 , B60Q1/00 , B60Q1/0408 , F21S41/147 , F21S41/19 , F21S45/47 , F21V23/00 , F21V23/02 , F21V29/70 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a circuit module and a light-emitting module which contribute to downsizing of a lighting fixture for vehicle.SOLUTION: In the circuit module 14, a support member 24 has an element mounting face which can mount a package 16 and a circuit mounting face and can mount a lighting control circuit 22 for controlling lighting of a semiconductor light-emitting element. The lighting control circuit 22 is mounted on the circuit mounting face. The circuit mounting face is formed to be at right angles or inclined against the element mounting face. Thereby, compared with a circuit module in which the circuit mounting face and the element mounting face are formed on an identical plane, the length in a longitudinal direction of the circuit module can be made shorter.
摘要翻译：要解决的问题：提供有助于车辆用照明器具的小型化的电路模块和发光模块。解决方案：在电路模块14中，支撑构件24具有能够安装封装16和电路安装面的元件安装面，并且可以安装用于控制半导体发光元件的点亮的点亮控制电路22。照明控制电路22安装在电路安装面上。电路安装面形成为直角或相对于元件安装面倾斜。因此，与将电路安装面和元件安装面形成在同一平面上的电路模块相比，电路模块的长度方向的长度可以缩短。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2013105929A Light emitting module, manufacturing method of the same, and lamp fitting for vehicle 有权
标题翻译：发光模块及其制造方法及灯具配件
公开(公告)号：JP2013105929A
公开(公告)日：2013-05-30
申请号：JP2011249386
申请日：2011-11-15
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , MATSUMOTO AKIHIRO , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： H01L33/56 , F21S8/10 , F21W101/10 , F21Y101/02
CPC分类号： H01L33/52 , H01L33/005 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a highly reliable light emitting module which improves mechanical and chemical strength of a metal wire for supplying power to a semiconductor light emitting element.SOLUTION: A light emitting module LM is equipped with an LED element 23, supplies power by a metal wire 3, and includes: a first resin (a sealing material) 4 sealing the metal wire 3 and a second resin (a dam wall) 5 enclosing at least a part of an outer periphery of the first resin. The first resin 4 has lower viscosity and lower elastic modulus compared to the second resin 5. The first resin 4 mechanically and chemically protects the metal wire 3 and the second resin 5 prevents the first resin 4 from flowing out to the periphery and maintains the sealing state of the metal wire 3 which is formed by the first resin 4.
摘要翻译：要解决的问题：获得提供用于向半导体发光元件供电的金属线的机械和化学强度的高度可靠的发光模块。解决方案：发光模块LM配备有LED元件23，通过金属线3供电，并且包括：密封金属线3的第一树脂（密封材料）4和第二树脂（坝壁）5，其包围第一树脂的外周的至少一部分。第一树脂4与第二树脂5相比具有较低的粘度和较低的弹性模量。第一树脂4机械和化学地保护金属丝3，并且第二树脂5防止第一树脂4流出到周边并保持密封由第一树脂4形成的金属丝3的状态。（C）2013，JPO＆INPIT

7. 发明专利

JP2017117844A 半導体発光素子およびその製造方法审中-公开
公开(公告)号：JP2017117844A
公开(公告)日：2017-06-29
申请号：JP2015248896
申请日：2015-12-21
申请人：株式会社小糸製作所 , Koito Mfg Co Ltd
发明人： SONE NAOKI
IPC分类号： H01L33/06 , H01L33/32
摘要：【課題】電子ブロック層の成長初期段階から不純物を適切にドープすることができる半導体発光素子およびその製造方法を提供する。【解決手段】障壁層と井戸層を交互に積層した多重量子井戸活性層と、多重量子井戸活性層の上に形成された電子ブロック層とを備える半導体発光素子であって、障壁層のうち最上層であるラストバリア層は、電子ブロック層にドープされた不純物と同じ不純物をドープしたドープ領域を備えている。【選択図】図3

8. 发明专利

JP2013152852A Vehicular lamp 审中-公开
标题翻译：车灯
公开(公告)号：JP2013152852A
公开(公告)日：2013-08-08
申请号：JP2012013098
申请日：2012-01-25
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： YASUDA YUJI , INOUE TAKASHI , WATANABE SHIGEYUKI , SONE NAOKI , SUZUKI TETSUYA , NANBA TAKANORI , MATSUMOTO AKIHIRO
IPC分类号： F21S8/10 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide a vehicular lamp that can suitably melt snow stuck to a light-transmitting cover.SOLUTION: In a vehicular lamp, a light-transmitting cover 14 forms at least a part of a lamp chamber for storing a light-emitting element 30, and transmits light from the light-emitting element 30 as a lamp light source to make the light irradiated toward front of the lamp. A heater 40 is arranged as a heat source separately from the light-emitting element 30. A fan 42 circulates heat of the heater 40 in the lamp chamber by convection. A PTC heater is adopted as a heater 40. A duct 44 guides air blown off by the fan 42 to an upper part along an internal surface of the light-transmitting cover 14.
摘要翻译：要解决的问题：提供一种能够适当地融化粘附在透光罩上的雪的车辆灯。解决方案：在车灯中，透光罩14形成用于存储发光罩的灯室的至少一部分，发光元件30，并且将来自发光元件30的光作为灯光源透射，以使得朝向灯前方照射的光。加热器40被布置为与发光元件30分开的热源。风扇42通过对流循环加热器40在灯室中的热量。采用PTC加热器作为加热器40.管道44将由风扇42吹出的空气引导到沿着透光罩14的内表面的上部。

9. 发明专利

JP2013016681A Heat radiation member and heat radiation mechanism 审中-公开
标题翻译：热辐射成员和热辐射机制
公开(公告)号：JP2013016681A
公开(公告)日：2013-01-24
申请号：JP2011149018
申请日：2011-07-05
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： SUZUKI TETSUYA , SONE NAOKI , INOUE TAKASHI , TANAKA HIDETADA , NANBA TAKANORI , MATSUMOTO AKIHIRO
IPC分类号： H01L23/34 , H01L23/36 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To properly radiate heat emitted from multiple light sources with a simple structure.SOLUTION: A heat sink 30 is formed into a U-shaped by a first portion 30a and a second portion 30b that are plate like portions facing each other and a third portion 30c disposed between an end part of the first portion 30a and an end part of the second portion 30b. A first light emitting element 40A is attached to the first portion 30a so that the first portion 30a recovers heat of the first light emitting element 40A. The second portion 30b is disposed so as to face the first portion 30a, and a second light emitting element 40B is attached to the second portion 30b so that the second portion 30b recovers heat of the second light emitting element 40B. The third portion 30c has a heat radiation fin 30d radiating heat recovered from the first portion 30a and the second portion 30b. The heat sink 30 is disposed so that the third portion 30c is positioned at the upstream side relative to the first portion 30a and the second portion 30b in an air flow region formed by a duct 24.
摘要翻译：要解决的问题：以简单的结构适当地辐射从多个光源发出的热量。解决方案：通过第一部分30a和第二部分30b将散热器30形成为U形，该第一部分30a和第二部分30b是彼此相对的板状部分，以及设置在第一部分30a的端部与第二部分30a之间的第三部分30c 第二部分30b的端部。第一发光元件40A附接到第一部分30a，使得第一部分30a恢复第一发光元件40A的热量。第二部分30b被设置为面对第一部分30a，并且第二发光元件40B附接到第二部分30b，使得第二部分30b恢复第二发光元件40B的热量。第三部分30c具有散热从第一部分30a和第二部分30b回收的热量的散热片30d。散热器30被布置成使得第三部分30c相对于第一部分30a和第二部分30b位于由管道24形成的空气流动区域中的上游侧。版权所有（C）2013， JPO和INPIT

10. 发明专利

JP2012049303A Light emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2012049303A
公开(公告)日：2012-03-08
申请号：JP2010189484
申请日：2010-08-26
申请人： Koito Mfg Co Ltd , 株式会社小糸製作所
发明人： MATSUMOTO AKIHIRO , SUZUKI TETSUYA , NAKAGAWA TOMOYUKI , SONE NAOKI
IPC分类号： H01L33/48 , F21S2/00 , F21V19/00 , F21V29/00 , F21Y101/02
CPC分类号： F21V31/04 , F21K9/20 , F21V23/006 , F21Y2103/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/8592 , H01L2924/10155 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which has both of a light emitting element and a lighting control unit for controlling lighting-up of the light emitting element, and which appropriately recovers heat produced by them and can be mounted on various lighting fixtures.SOLUTION: In a light emitting device 10, a control circuit 30 controls lighting-up of a semiconductor light emitting element 20. A heat dissipating substrate unit 13 supports the semiconductor light emitting element 20 and the control circuit 30 so as to recover heat dissipated by each of them. The heat dissipating substrate unit 13 supports the semiconductor light emitting element 20 such that a light emitting portion of the semiconductor light emitting element 20 protrudes farther in the direction of the main optical axis of the light emitting portion than the control circuit 30. The heat dissipating substrate unit 13 comprises: a heat dissipating substrate 15 which supports the control circuit 30; and a support member 14 which protrudes from the heat dissipating substrate 15 and supports the semiconductor light emitting element 20. The heat dissipating substrate 15 and the support member 14 are separately formed and fixed to each other by an adhesive having a thermal conductivity equal to or higher than 3 W/mK.
摘要翻译：要解决的问题：提供一种发光装置，其具有用于控制发光元件的点亮的发光元件和照明控制单元两者，并适当地回收由它们产生的热量并且可以安装在各种照明灯具上。解决方案：在发光器件10中，控制电路30控制半导体发光元件20的点亮。散热基板单元13支撑半导体发光元件20和控制电路30以便恢复他们每一个散热。散热基板单元13支撑半导体发光元件20，使得半导体发光元件20的发光部分比控制电路30在发光部分的主光轴的方向上更远地突出。散热基板单元13包括：散热基板15，其支撑控制电路30; 以及从散热基板15突出并支撑半导体发光元件20的支撑部件14.散热基板15和支撑部件14分别形成并且通过热导率等于或等于高于3 W / mK。版权所有（C）2012，JPO＆INPIT

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