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1. 发明专利

JP2012074497A Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：JP2012074497A
公开(公告)日：2012-04-12
申请号：JP2010217515
申请日：2010-09-28
申请人： Denso Corp , 株式会社デンソー
发明人： NAKANO TAKASHI , FUJII TETSUO , INABA SHIGENOBU
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board which can reduce local stress applied to a circuit chip.SOLUTION: A circuit board 10 in which a wiring part including a conductor pattern 30 and an interlayer connection veer 41 is provided on an insulation substrate 20, comprises a heat sink 60 provided on one face of the insulation substrate 20 perpendicular to a thickness direction of the insulation substrate 20, a semiconductor chip 50 embedded in the insulation substrate 20 and having a dummy electrode 51b disposed on one face on the heat sink 60 side and an electrode 51a disposed on a rear face and electrically connected to the wiring part, heat radiation connection veer 42 thermally connecting the dummy electrode 51b of the semiconductor chip 50 with the heat sink 60, and a plate-like member 90 disposed between the semiconductor chip 50 and the heat sink 60 and connected to the semiconductor chip 50 and the heat sink 60 via the heat radiation connection veer 42 and having heat conductivity higher than that of the insulation substrate 20 and thicker than the conductor pattern 30.
摘要翻译：要解决的问题：提供可以减少施加到电路芯片的局部应力的电路板。解决方案：在绝缘基板20上设置有包括导体图案30和层间连接调节器41的布线部分的电路板10包括设置在垂直于绝缘基板20的绝缘基板20的一个面上的散热器60 绝缘基板20的厚度方向，嵌入在绝缘基板20中并具有设置在散热器60一侧的虚设电极51b的半导体芯片50和设置在背面上的电连接电连接到布线部将半导体芯片50的虚设电极51b与散热片60热连接的热辐射连接调节器42以及设置在半导体芯片50和散热器60之间并与半导体芯片50连接的板状部件90，经由热辐射连接调节器42的散热器60，其导热率高于绝缘基板20的导热率，并且比导体图案30厚。 P>版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2010080572A Electronic equipment 审中-公开
标题翻译：电子设备
公开(公告)号：JP2010080572A
公开(公告)日：2010-04-08
申请号：JP2008245348
申请日：2008-09-25
申请人： Denso Corp , 株式会社デンソー
发明人： KUNIEDA HIROYOSHI , OTA SHINJI , HIROSE SHINICHI , INABA SHIGENOBU , MAEDA YUKIHIRO
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H01L2224/16225 , H01L2924/15311
摘要： PROBLEM TO BE SOLVED: To appropriately dissipate heat from a heating element without incorporating a thicker heat sink, compared with individual layers of a multilayer substrate in the multilayer substrate, in electronic equipment configured such that the heating element is provided on one surface of the multilayer substrate. SOLUTION: Electronic equipment is equipped with: a multilayer substrate 10 made by stacking a plurality of layers 1 to 6; and a heating element 20 provided on one surface 11 of the multilayer substrate 10. A heat diffusion layer 15, which has a thermal conductivity and consists of a graphite sheet or the like thinner than the individual layers 1 to 6, is provided between adjacent layers 1 to 6 inside the multilayer substrate 10. Inside the multilayer substrate 10, heat dissipation vias 14 are extended in the stacking direction of the layers 1 to 6 to thermally connect the heating element 20 and the heat diffusion layers 15. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了适当地从加热元件散热而不加入较厚的散热器，与多层基板中的多层基板的各层相比，在电子设备中，使得加热元件设置在一个表面上的多层基板。解决方案：电子设备配备有：通过堆叠多个层1至6而制成的多层基板10; 以及设置在多层基板10的一个表面11上的加热元件20.在相邻层之间设置有具有导热性并由石墨片等构成的散热层15，其比单层1-6更薄。在多层基板10的内部，多层基板10内的散热通路14沿层1〜6的层叠方向延伸，热连接加热元件20和热扩散层15。（C）2010，JPO＆INPIT

3. 发明专利

JP2011159876A Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2011159876A
公开(公告)日：2011-08-18
申请号：JP2010021496
申请日：2010-02-02
申请人： Denso Corp , 株式会社デンソー
发明人： OTA SHINJI , INABA SHIGENOBU , KUNIEDA HIROYOSHI
IPC分类号： H01L21/56 , H01L23/29
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To prevent resin burr irrespective of the accuracy of flatness of a heat sink in a semiconductor device which exposes the surface on the opposite side to the semiconductor element of a heat sink bonded to a semiconductor element from a mold resin. SOLUTION: In a metallic mold 100, a first hole 105 and a second hole 106 communicating with the outside and inside of a cavity are made at regions corresponding to the periphery of the other surface 12 among contact surfaces with the other surface 12 of a heat sink 10 in a cavity 103, and the first and second holes 105 and 106 are arranged in order toward the peripheral side from the inside of the other surface 12. Air is blown into the cavity 103 through the first holes 105, and it is blown out from the second hole 106. Thus, the flow of a fluid flowing to the peripheral side from the inside of the other surface 12 of the heat sink 10 is formed within the cavity 103, and a mold resin 50 is put into the cavity 103. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止树脂毛刺，与半导体器件的散热器的平坦度的精度无关，该半导体器件将与半导体元件接合的散热片的半导体元件的相对侧的表面从模具露出树脂。解决方案：在金属模具100中，在与另一表面12的接触表面中的与另一表面12的周边相对应的区域处，形成与空腔的外部和内部连通的第一孔105和第二孔106 在空腔103中具有散热器10，并且第一孔105和第二孔106依次从另一表面12的内侧朝向周边侧布置。空气通过第一孔105吹入空腔103，并且从第二孔106吹出。因此，在空腔103内形成从散热片10的另一个表面12的内部流到周边的流体的流动，并将模制树脂50放入空腔103.版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010147382A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2010147382A
公开(公告)日：2010-07-01
申请号：JP2008325350
申请日：2008-12-22
申请人： Denso Corp , 株式会社デンソー
发明人： INABA SHIGENOBU , MAEDA YUKIHIRO , OTA SHINJI , HIROSE SHINICHI , KUNIEDA HIROYOSHI
IPC分类号： H01L23/34 , H01L23/12
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To make it possible to directly radiate heat from a radiating board to a first substrate without passing through a second substrate in an electronic device configured by mounting the second substrate on the first substrate, mounting an electronic component on the second substrate and thermally connecting the electronic component and the radiating board on the second substrate. SOLUTION: In the electronic device including the first substrate 10, the second substrate 20 wherein the electronic component 30 is mounted on one surface side and the other surface side is thermally connected to the first substrate 10, and the radiating board 40 arranged on the one surface side of the second substrate 20 and thermally connected to the electronic component 30, an extension part 70 directly thermally connected to the first substrate 10 is formed at the peripheral part of the radiating board 40. The extension part 70 includes projection sections 41, projecting from the peripheral part of the radiating board 40, of which the tip portions are respectively inserted into through holes 21 of the second substrate 20 and exposed to the other surface side of the second substrate 20, and solder portions 50 for thermally connecting the tip portions of the projection sections 41 to the first substrate 10 on the other surface side of the second substrate 20. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了能够在通过将第二基板安装在第一基板上构成的电子设备中而不通过第二基板将散热板直接辐射到第一基板，将电子部件安装在所述第二基板并且将所述电子部件和所述散热板热连接在所述第二基板上。解决方案：在包括第一基板10的电子设备中，其中电子部件30安装在一个表面侧并且另一个表面侧的第二基板20热连接到第一基板10，并且散热板40被布置在第二基板20的一个表面侧上并且热连接到电子部件30，在辐射板40的周边部分处形成有直接热连接到第一基板10的延伸部70.延伸部70包括突出部如图41所示，从辐射板40的周边部分突出，其顶端部分分别插入到第二基板20的通孔21中并暴露于第二基板20的另一表面侧，以及用于热连接的焊接部分突起部分41的顶端部分连接到第二基板20的另一表面侧上的第一基板10.版权所有（C）2010 ，JPO＆INPIT

5. 发明专利

JP2012253118A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2012253118A
公开(公告)日：2012-12-20
申请号：JP2011123200
申请日：2011-06-01
申请人： Denso Corp , 株式会社デンソー
发明人： OTA SHINJI , INABA SHIGENOBU
IPC分类号： H01L23/36 , H01L23/12
CPC分类号： H01L2224/32225 , H01L2924/15311
摘要： PROBLEM TO BE SOLVED: To perform electric connection between an upper surface of a semiconductor element and one surface side of a circuit substrate and heat radiation from the upper surface of the semiconductor element, while preventing adhesion of resin burrs on a heat sink, in a semiconductor device which electrically connects the circuit substrate and the upper surface of the semiconductor element mounted on the circuit substrate via a connection member and in which the heat sink, which radiates heat, is provided on the upper surface of the semiconductor element.SOLUTION: The connection member is a plate-shaped lead frame 30. The lead frame 30 includes one end portion 31 electrically connected to a peripheral portion of an upper surface 21 of a semiconductor element 20, and the other end portion 32 extending to one surface 11 of the circuit substrate 10 and electrically connected to the side of the one surface 11 of the circuit substrate 10. The heat sink 30 is connected to a central part of the upper surface 21 of the semiconductor element 20 and an upper surface 30b on the side of the one end portion 31 of the lead frame 30 via a heat-radiation connection member 50.
摘要翻译：要解决的问题：为了在半导体元件的上表面和电路基板的一个表面侧之间进行电连接以及来自半导体元件的上表面的热辐射，同时防止树脂毛刺粘附在散热器在半导体装置中，半导体装置通过连接构件将安装在电路基板上的电路基板和半导体元件的上表面电连接，并且在半导体元件的上表面上设置放射热的散热片。连接构件是板状引线框架30.引线框架30包括与半导体元件20的上表面21的周边部分电连接的一个端部31，并且另一端部32延伸到电路基板10的一个表面11，并且电连接到电路基板10的一个表面11的侧面。散热器30连接到半导体元件20的上表面21的中心部分，上表面 30b通过散热连接部件50在引线框架30的一个端部31的侧面上。（C）2013，JPO＆INPIT

6. 发明专利

JP2009170454A Mold package and structure for mounting the same 有权
标题翻译：模具包装和结构安装
公开(公告)号：JP2009170454A
公开(公告)日：2009-07-30
申请号：JP2008003452
申请日：2008-01-10
申请人： Denso Corp , 株式会社デンソー
发明人： ASAI SHOKI , HONDA MASAHIRO , INABA SHIGENOBU
IPC分类号： H01L23/50 , H01L23/12
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To achieve a package suitable for miniaturizing of a printed circuit board by reducing a formation region of a large current wire on a package mounting surface of the printed circuit board while minimizing enlargement of the package in mounting a mold package having a terminal for external connection exposed on a lower surface of molded resin on the printed circuit board.
SOLUTION: A terminal 12 includes a first terminal 121 and a second terminal 122 with a larger area than that of the first area 121. The second terminal 122 is located around an inner periphery of the lower surface 32 of the molded resin 30 as viewed from above the upper surface 11a of an island 11.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了通过在印刷电路板的封装安装表面上减小大电流线的形成区域来实现适合于印刷电路板的小型化的封装，同时最小化安装模具时的封装的扩大封装，其具有暴露在印刷电路板上的模制树脂的下表面上的用于外部连接的端子。解决方案：端子12包括具有比第一区域121的面积大的面积的第一端子121和第二端子122.第二端子122位于模制树脂30的下表面32的内周边周围从上方观察岛11的上表面11a。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009152281A Through substrate 有权
标题翻译：通过基板
公开(公告)号：JP2009152281A
公开(公告)日：2009-07-09
申请号：JP2007327096
申请日：2007-12-19
申请人： Denso Corp , 株式会社デンソー
发明人： INABA SHIGENOBU , ASAI SHOKI , HONDA MASAHIRO
IPC分类号： H05K3/46 , B32B17/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a through substrate having improved solder connection reliability by reducing the influence of irregularities by glass cloth in the through substrate where wiring provided on both of the front and rear of the substrate made of prepreg is allowed to conduct electricity by a through-hole penetrating the substrate in a thickness direction. SOLUTION: The through substrate is provided with: a substrate section 10 made of the prepreg 13 where resin 12 is impregnated to the glass cloth 11; a laminar surface-layer section 20 made of prepreg provided by laminating both of the front and rear of the substrate section 10; and the through-hole 50 that penetrates the substrate section 10 and the surface layer section 20 and electrically connects surface-layer wiring 40 and inner-layer wiring 30. Yarn 11a for composing the glass cloth 11 of the surface-layer section 20 is flatter than yarn 11a for composing the glass cloth 11 of the substrate section 10, and the outer surface of the surface-layer section 20 has irregularities smaller than those on the surface of the prepreg 13 for composing the substrate section 10. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有改进的焊接连接可靠性的通过基板，通过减少玻璃布在通孔基板中的不规则性的影响，其中将设置在由预浸料坯制成的基板的前后两侧的布线允许通过在厚度方向穿过基板的通孔进行电力通电。贯通基板设置有：由预浸料坯13制成的基板部分10，树脂12浸渍到玻璃布11上; 由基板部分10的前后两层层叠而成的预浸料坯制成的层状表面层部分20; 以及贯通基板部10和表面层部20并使表层布线40和内层布线30电连接的通孔50.用于构成表面层部20的玻璃布11的纱线11a更平坦与用于构成基板部分10的玻璃布11的纱线11a相比，表层部分20的外表面具有小于用于构成基材部分10的预浸料坯13的表面上的凹凸。
版权所有：（C）2009，JPO＆INPIT

8. 发明专利

JP2013065887A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2013065887A
公开(公告)日：2013-04-11
申请号：JP2012281273
申请日：2012-12-25
申请人： Denso Corp , 株式会社デンソー
发明人： INABA SHIGENOBU , MAEDA YUKIHIRO , OTA SHINJI , HIROSE SHINICHI , KUNIEDA HIROYOSHI
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To enable heat to be directly radiated from a heat sink to a first substrate without transmitting the heat to a second substrate in an electronic device formed by mounting the second substrate on the first substrate, mounting an electronic component on the second substrate, and thermally connecting the electronic component with the heat sink on the second substrate.SOLUTION: An electronic device includes: a first substrate 10; a second substrate 20 where an electronic component 30 is provided on one surface side and the other surface side is thermally connected with the first substrate 10; and a heat sink 40 provided on the one surface side of the second substrate 20 and thermally connected with the electronic component 30. In the electronic device, an extension part 70, directly and thermally connecting with the first substrate 10, is provided at a peripheral part of the heat sink 40, and the extension part 70 is composed of: a protruding part 41 which protrudes from the peripheral part of the heat sink 40 and has a tip inserted into a through hole 21 of the second substrate 20 and exposed on the other surface side of the second substrate 20; and solder 50 thermally connecting the tip of the protruding part 41 with the first substrate 10 on the other surface side of the second substrate 20.
摘要翻译：要解决的问题：为了使热能够从散热器直接辐射到第一基板，而不将热量传递到通过将第二基板安装在第一基板上形成的电子设备中的第二基板，安装电子部件并且将所述电子部件与所述散热器热连接在所述第二基板上。电子设备包括：第一基板10; 电子部件30设置在一个表面侧而另一个表面侧与第一基板10热连接的第二基板20; 以及设置在第二基板20的一个表面侧并与电子部件30热连接的散热器40.在电子设备中，在周边设置有与第一基板10直接且热连接的延伸部70 散热器40的一部分，延伸部70由以下部分构成：突出部41，其从散热片40的周边部突出，并且具有插入第二基板20的通孔21的端部，第二基板20的另一表面侧; 以及在第二基板20的另一表面侧将突出部分41的顶端与第一基板10热连接的焊料50。（C）2013，JPO＆INPIT

9. 发明专利

JP2012009505A Semiconductor device manufacturing method and semiconductor device 有权
标题翻译：半导体器件制造方法和半导体器件
公开(公告)号：JP2012009505A
公开(公告)日：2012-01-12
申请号：JP2010141803
申请日：2010-06-22
申请人： Denso Corp , 株式会社デンソー
发明人： INABA SHIGENOBU , MAEDA YUKIHIRO , NAKANO TAKASHI , FUJII TETSUO
IPC分类号： H01L23/12
CPC分类号： H01L2224/16225 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device including a semiconductor chip mounted by flip chip bonding, the semiconductor chip being encapsulated by a resin, and a heat radiation member of a silicone material thermally connected to the semiconductor chip, and to provide a manufacturing method of the semiconductor device in simple manufacturing steps while suppressing damage of the heat radiation member.SOLUTION: The semiconductor device manufacturing method comprises the steps of disposing semiconductor chips 50 in holes, disposing a heat radiation member 60 as a surface layer, disposing a resin film having a conductive paste between the individual semiconductor chips 50 and the heat radiation member 60, and laminating a plurality of resin films, a plurality of semiconductor chips 50 and the heat radiation member 60 by disposing thermoplastic resin films 22a-22c at least every one sheet so as to touch both faces of the semiconductor chips 50 and one face of the heat radiation member 60. This multilayer is pressed and heated from upside and downside, and subsequently diced together with the heat radiation member into individual semiconductor devices.
摘要翻译：要解决的问题：提供一种半导体器件，包括通过倒装芯片接合安装的半导体芯片，半导体芯片被树脂封装，以及与半导体芯片热连接的硅酮材料的散热构件，并且在简单的制造步骤中提供半导体器件的制造方法，同时抑制散热构件的损坏。解决方案：半导体器件制造方法包括以下步骤：将半导体芯片50设置在孔中，设置作为表面层的散热构件60，在各个半导体芯片50之间设置具有导电膏的树脂膜和散热通过将热塑性树脂膜22a-22c设置在至少每一个片材上，以便接触半导体芯片50的两个面和一个表面，从而层叠多个树脂膜，多个半导体芯片50和散热构件60 该多层由上下侧压制和加热，随后与散热构件一起切割成单独的半导体器件。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2010097966A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2010097966A
公开(公告)日：2010-04-30
申请号：JP2008264846
申请日：2008-10-14
申请人： Denso Corp , 株式会社デンソー
发明人： OTA SHINJI , INABA SHIGENOBU , HIGUCHI SHINGO
IPC分类号： H01L23/34 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To improve a heat release property in a semiconductor device including a heat sink thermally connected to one plate surface of a semiconductor chip, the semiconductor chip being connected to a substrate by its other plate surface. SOLUTION: A semiconductor wafer 200 having a plurality of chip forming areas 1 defined by dicing lines 2 on one surface side is prepared, a plate-like heat sink 20 formed in a plate-like shape the same as the chip forming areas 1 and having a projection part 21 projecting in a direction orthogonal to the plate surface on the outer circumferential end is prepared, a hole part 11 is formed in a position crossing each dicing line 2 in the semiconductor wafer 200, metal films 10a having solder wettability are disposed simultaneously on each chip forming area 1 and the inner surface of the hole part 11, a solder 60 is arranged thereon, the heat sink 20 is mounted on each chip forming area 1 while inserting the projection part 21 to the hole part 11, the solder 60 is melted to solder the heat sink 20, and the semiconductor wafer 200 is diced. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题为了提高包括热连接到半导体芯片的一个板表面的散热器的半导体器件的散热特性，半导体芯片通过其另一个板表面连接到基板。解决方案：制备具有在一个表面侧由切割线2限定的多个芯片形成区域1的半导体晶片200，形成为与芯片形成区域相同的板状形状的板状散热器20 准备具有在与外周端的板面正交的方向突出的突出部21的突起部21，在半导体晶片200的与切割线2交叉的位置形成有孔部11，具有焊料润湿性的金属膜10a 同时设置在每个芯片形成区域1和孔部分11的内表面上，焊料60被布置在其上，散热器20安装在每个芯片形成区域1上，同时将突出部分21插入到孔部分11中，焊料60熔化以焊接散热器20，并且切割半导体晶片200。版权所有（C）2010，JPO＆INPIT

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