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1. 发明专利

JP2011153253A Electronic device and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2011153253A
公开(公告)日：2011-08-11
申请号：JP2010016844
申请日：2010-01-28
申请人： Denso Corp , Dow Corning Toray Co Ltd , 東レ・ダウコーニング株式会社 , 株式会社デンソー
发明人： HIRASAWA NORIYA , OTANI YUJI , ASAI SHOKI , IMAI HIROKAZU , KUNIEDA HIROYOSHI , KODAMA HARUMI , ONISHI MASAYUKI , SAKAGUCHI RYO , NAKAYOSHI KAZUMI
IPC分类号： C09J183/07 , C09J11/04 , C09J11/06 , C09J183/05 , H01L21/52
CPC分类号： H01L23/4334 , C08G77/04 , C08G77/20 , C08L83/04 , H01L23/296 , H01L23/3121 , H01L23/36 , H01L23/49531 , H01L24/13 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To reduce a emission rate of siloxane gas as much as possible when a silicone adhesive is heated and cured. SOLUTION: The silicone adhesive 30 includes: (A) 100 pts.mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups, wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass%; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 pts.mass of an adhesion promoter; (D) 100 to 2,000 pts.mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. The blending amount of (B) is such that the amount of the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass% of the sum of (A), (B) and (C). COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：当硅氧烷粘合剂被加热和固化时，尽可能地降低硅氧烷气体的排放速率。解决方案：硅氧烷粘合剂30包括：（A）100分钟的一分子中含有至少两个烯基并且不含与硅键合的羟基和烷氧基的有机聚硅氧烷，其中环状硅氧烷的含量为4 至20个硅氧烷单元为0.1质量％以下。（B）在一个分子中含有至少两个与硅键合的氢原子并且不含烯基的有机聚硅氧烷和与硅键合的羟基和烷氧基; （C）至少0.05份粘附促进剂; （D）100至2,000磅的导热填料; 和（E）氢化硅烷化反应催化剂。（B）的配合量使得与（A）的链烯基相比，硅键合的氢原子的量为0.5〜10摩尔的范围，（B）和（C ）为（A），（B）和（C）之和的0.5〜10质量％。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2007294568A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2007294568A
公开(公告)日：2007-11-08
申请号：JP2006118965
申请日：2006-04-24
申请人： Denso Corp , 株式会社デンソー
发明人： ASAI SHOKI , HONDA MASAHIRO , OTA SHINJI
IPC分类号： H01L23/50
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To minimize spread of resin exfoliation occurring on an upper surface of an island in a semiconductor device formed by sealing a semiconductor element provided on the island of a lead frame with molding resin, and exposing a lower surface of the island from the molding resin.
SOLUTION: The semiconductor device 100 includes the lead frame 10 having the island 11 and a terminal 12, a semiconductor element 20 mounted on the upper surface 11a of the island 11 and electrically connected with the terminal 12 through a bonding wire 30, and the molding resin 40 for sealing the respective parts, wherein the lower surface 11b of the island 11 is exposed from the molding resin 40. An annular wall 14 protruding from the upper surface 11a of the island 11 is provided to surround the semiconductor element 20 on a region around the element 20 among the upper surface 11a.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了最小化在通过用模制树脂密封设置在引线框架的岛上的半导体元件形成的半导体器件中在岛的上表面上发生的树脂剥离的扩散，并且暴露下表面岛从成型树脂。解决方案：半导体器件100包括具有岛11的引线框10和端子12，安装在岛11的上表面11a上并通过接合线30与端子12电连接的半导体元件20，以及用于密封各部分的成型树脂40，其中岛11的下表面11b从模制树脂40暴露。设置从岛11的上表面11a突出的环形壁14围绕半导体元件20 在上表面11a中的元件20周围的区域上。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006032773A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2006032773A
公开(公告)日：2006-02-02
申请号：JP2004211595
申请日：2004-07-20
申请人： Denso Corp , 株式会社デンソー
发明人： SUGATA TATSUYA , ASAI SHOKI , HONDA MASAHIRO
IPC分类号： H01L23/34
CPC分类号： H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is small-sized and has high heat radiating property, suppresses damage to a semiconductor element during assembly, and has high connection reliability in mounting.
SOLUTION: The semiconductor device 100 has a plate type island 11, the semiconductor element 30 mounted on the island 11, a lead terminal 12 positioned in the periphery of the island 11, a bonding wire 40 which electrically connects the top surface of the semiconductor element 30 and the lead terminal 12 together, and molding resin 50 sealing them. The island 11 and lead terminal 12 are exposed from the molding resin 50 on the reverse surface side, a metal plate type heatsink frame 20 is arranged on the semiconductor element 30 apart from the semiconductor element 30 across the molding resin 50, and a suspension lead 13 of the island 11 and a fitting lead 21 of the heatsink frame 20 are arranged closely to each other.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供小型化并具有高散热性的半导体器件，在组装期间抑制对半导体元件的损坏，并且在安装中具有高的连接可靠性。解决方案：半导体器件100具有板状岛11，安装在岛11上的半导体元件30，位于岛11的周边的引线端子12，将导线端子12电连接到岛11的上表面半导体元件30和引线端子12在一起，以及模制树脂50密封它们。岛11和引线端子12从背面侧的模制树脂50露出，半导体元件30上的金属板型散热器框架20跨过模制树脂50布置在半导体元件30上，并且悬架引线岛11的13和散热器框架20的嵌合引线21彼此靠近地布置。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2011222813A Wire bonding method 有权
标题翻译：线接法
公开(公告)号：JP2011222813A
公开(公告)日：2011-11-04
申请号：JP2010091411
申请日：2010-04-12
申请人： Denso Corp , 株式会社デンソー
发明人： TERUI KENICHIRO , ASAI SHOKI , KASUGAI HIROSHI , IKUNO YUICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15787 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a wire bonding method using pre-ball bonding which enables the control of wire cutting timing for cutting of a hole portion of a pre-ball while maintaining flatness of the cut surface of the hole portion as much as possible when the hole portion of the pre-ball is cut and a wire is joined onto the cut surface of the hole portion by secondary bonding.SOLUTION: A pre-ball 30 is formed. A hole portion 32 of the pre-ball 30 is cut from one end side to the other end side in a radial direction by a capillary 40 so that a joint portion 34 which is not cut out and thus is joined to a wire 20 is left at the other side. Then, the joint portion 34 is bent so as to extend in a horizontal direction. Further, the wire 20 joined to the joint portion 34 is bonded adjacent to the pre-ball 30 and then the wire 20 is cut.
摘要翻译：要解决的问题：提供一种使用预球接合的引线接合方法，其能够控制用于切割预球的孔部分的线切割正时，同时保持孔部分的切割表面的平坦度为尽可能地切割预球的孔部分，并且通过二次接合将线接合到孔部分的切割表面上。解决方案：形成预球30。前球30的孔部32通过毛细管40从径向的一端侧向另一端侧切断，使得未切断并因此与线20接合的接合部34被留下在另一边然后，接合部34弯曲成在水平方向上延伸。此外，接合到接合部分34的线材20接合在预球30附近，然后切断线材20。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2008300717A Mold package 有权
标题翻译：模具包
公开(公告)号：JP2008300717A
公开(公告)日：2008-12-11
申请号：JP2007146605
申请日：2007-06-01
申请人： Denso Corp , 株式会社デンソー
发明人： OTA SHINJI , ASAI SHOKI , HONDA MASAHIRO
IPC分类号： H01L23/50
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To achieve a constitution suited to fully secure the height of a standoff in a mold package wherein a terminal part is exposed, in a state where the standoff is formed on the lower surface of mold resin. SOLUTION: Portions on the outer peripheral side of an exposed part 12b of the terminal part 12, which are exposed on the lower surface 41 of the mold resin 40, are set as projecting parts 12c projected from the lower surface 41 of the mold resin 40 and a portion which is on the inner peripheral side of the exposed part 12b from the projecting parts 12c is withdrawn from the projection parts 12c. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了在模具树脂的下表面上形成间隔的状态下实现适合于完全确保在终端部分露出的模具包装中的支架的高度的结构。解决方案：露出在模制树脂40的下表面41上的端子部分12的暴露部分12b的外周侧上的部分被设置为从下模41的下表面41突出的突出部分12c 模具树脂40和从突出部12c在露出部12b的内周侧的部分从突起部12c退出。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008244043A Mounting structure of mold package 有权
标题翻译：模具包装的安装结构
公开(公告)号：JP2008244043A
公开(公告)日：2008-10-09
申请号：JP2007080835
申请日：2007-03-27
申请人： Denso Corp , 株式会社デンソー
发明人： SUGATA TATSUYA , ASAI SHOKI , OTA SHINJI , HONDA MASAHIRO
IPC分类号： H01L23/50
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To facilitate making a solder filet on a lead, into an appropriate shape in a mounting structure having a mold package mounted via solder on one of surfaces of a substrate.
SOLUTION: A lower surface 11b of an island section 11 and a lower surface 12b of a lead 12 exposed from a lower surface 32 of molding resin 30 in the mold package 100 are jointed with an island land 201 and a lead land 202 of the substrate 200, respectively, via solder 300. The solder filet 301 is formed on a side face 12c of the lead 12, and a dent 11c dented from one surface 12b of the lead 12 is provided to the lower surface 11b of the island section 11 in the mold package 100.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了便于在引线上制造焊料，在具有通过焊料安装在其上的基板的一个表面上的模具封装的安装结构中形成适当的形状。解决方案：从模具封装100中的模制树脂30的下表面32暴露的岛部11的下表面11b和引线12的下表面12b与岛状区域201和引线接合区域202 通过焊料300分别形成衬底200.焊料片301形成在引线12的侧面12c上，并且从引线12的一个表面12b凹陷的凹陷11c被提供到岛的下表面11b 模具包装100中的第11节。（C）2009年，JPO＆INPIT

7. 发明专利

JP2006269719A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2006269719A
公开(公告)日：2006-10-05
申请号：JP2005085406
申请日：2005-03-24
申请人： Denso Corp , 株式会社デンソー
发明人： OTA SHINJI , HONDA MASAHIRO , IMADA SHINJI , ASAI SHOKI
IPC分类号： H01L21/60 , H01L23/50
CPC分类号： H01L24/73 , H01L2224/32245 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/4848 , H01L2224/48599 , H01L2224/48699 , H01L2224/49 , H01L2224/49109 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2224/85051 , H01L2224/92247 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2224/48465 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To prevent contact between bonding wires and between a bonding wire and a lead terminal in the vicinity of a connection on the side of the lead terminal, in an electronic device consisting of an electronic component and a plurality of lead terminals connected via the bonding wires.
SOLUTION: The electronic device 100 includes the plurality of lead terminals 12 which are provided around a semiconductor element 20 as an electronic component having one of its surfaces 20a serving as a surface for connecting the bonding wires 30 and electrically connected by the bonding wires 30. When the bonding wire 30 connected with the first lead terminal 12a which overlies on one of surfaces 20a of the element 20 in the orthogonal direction is assumed to be the second lead terminal 12b, a region toward a connection 30b of the bonding wire 30 connected with the second terminal 12b is lower than a region toward the connection 30a of the wire 30 connected with the first terminal 12a.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了防止接合线之间的接触，以及在引线端子侧的连接附近的接合线和引线端子之间的接触，在由电子部件和多个引线端子通过接合线连接。解决方案：电子设备100包括多个引线端子12，这些引线端子12设置在作为电子部件的半导体元件20周围，该电子部件的一个表面20a用作连接接合线30的表面，并通过接合电连接当与正交方向的元件20的一个表面20a上覆盖的第一引线端子12a连接的接合线30被认为是第二引线端子12b时，朝向接合线的连接部30b的区域与第二端子12b连接的第一端子12a的连接部30a的连接部30a低于与第一端子12a连接的线30的连接部30a的区域。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006140265A Semiconductor device and manufacturing method of lead frame used therefor 有权
标题翻译：半导体器件及其所用引线框架的制造方法
公开(公告)号：JP2006140265A
公开(公告)日：2006-06-01
申请号：JP2004327669
申请日：2004-11-11
申请人： Denso Corp , 株式会社デンソー
发明人： ASAI SHOKI , HONDA MASAHIRO , NAGASAKA TAKASHI
IPC分类号： H01L23/50
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To suppress the peeling of the inside of a mold resin while suppressing the occurrence of a resin flash on the external connection surface of a lead, in a semiconductor device in which a semiconductor element is mounted on the element mounting part of a lead frame through a die-mount material and which is sealed up with a mold resin so that the external connection surface of the lead of a lead frame is exposed. SOLUTION: A semiconductor device 100 comprises a lead frame 10 composed of an element mounting part 11 and a lead 12, a semiconductor element 30 which is mounted on the upper surface of the element mounting part 11 through a die mount material 20 of resin electrically connected to the lead 12, and a mold resin 50 which seals them so that the external connection surface 12a of the lead 12 is exposed. A roughening process for improving adhesion to resin is applied to a part positioned inside the mold resin 50 among the surface of the lead frame 10 while no roughening process is applied to the external connection surface 12a of the lead 12. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在半导体元件安装在元件上的半导体器件中抑制模制树脂内部的剥离，同时抑制在引线的外部连接表面上发生树脂闪光通过模具安装材料安装引线框架的一部分，并用模制树脂密封，使得引线框架的引线的外部连接表面露出。解决方案：半导体器件100包括由元件安装部分11和引线12组成的引线框架10，半导体元件30通过模具安装材料20安装在元件安装部分11的上表面上电连接到引线12的树脂和密封它们的模制树脂50，使得引线12的外部连接表面12a露出。在引线框架10的表面中，对位于模制树脂50内部的部分施加用于提高与树脂的粘附性的粗糙化方法，而不对引线12的外部连接表面12a施加粗糙化处理。版权所有（ C）2006，JPO＆NCIPI

9. 发明专利

JP2012193968A Warp checking device and warp checking method 有权
标题翻译： WARP检查装置和WARP检查方法
公开(公告)号：JP2012193968A
公开(公告)日：2012-10-11
申请号：JP2011056183
申请日：2011-03-15
申请人： Denso Corp , 株式会社デンソー
发明人： NAKAMURA TOSHIHIRO , ASAI SHOKI , SAGAWA HARUHIDE , UCHIBORI SHINYA , YAMADA MINORU
IPC分类号： G01B5/20 , G01B11/24 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a warp checking device and a warp checking method that can check the warp direction of an object to be checked formed in a planar shape in a simple configuration.SOLUTION: When an external edge part 22 of a planar ceramic substrate 20 mounted on a planar part 11a is pressed by an actuator 12 and the rotation of the ceramic substrate 20 after it is released from the pressing force is detected by a photosensor 13, the warp direction of the ceramic substrate 20 in which a central part 21 is convex toward the planar part 11a relative to the external edge part 22 (a warp direction of being convex downward) is detected.
摘要翻译：要解决的问题：提供一种能够以简单的构造检查形成为平面形状的待检查对象的翘曲方向的翘曲检查装置和翘曲检查方法。解决方案：当安装在平面部分11a上的平面陶瓷基板20的外边缘部分22被致动器12按压时，陶瓷基板20从按压力解除之后的旋转被光电传感器检测到如图13所示，检测中心部21相对于外缘部22向平面部11a凸出的陶瓷基板20的经向（向下凸出的经向）。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2010283047A Method of manufacturing printing structure 有权
标题翻译：制造印刷结构的方法
公开(公告)号：JP2010283047A
公开(公告)日：2010-12-16
申请号：JP2009133700
申请日：2009-06-03
申请人： Denso Corp , 株式会社デンソー
发明人： HIRASAWA NORIYA , MATSUHASHI HAJIME , OTANI YUJI , ASAI SHOKI
IPC分类号： H05K3/34 , B41F15/08 , B41F15/40 , B41F15/44
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printing structure that can suppress formation of air bubbles in paste formed on a printed body as much as possible when an adherend is mounted on the paste.
SOLUTION: A first squeezee 10 which has a tapered surface having an acute angle to an upper surface of a mask 30 as a press surface 12 for paste 4 positioned on the side of a tip part 11 when the tip part 11 is opposed to the upper surface of the mask 30, and a second squeezee 20 which has a groove 23, extending in an onward direction, formed in a tip part 21 are used. An opening part 31 is filled with the paste 4 by pressing and spreading the paste 4 with the press surface 12 of the first squeezee 10 so that a film 4a is formed of the paste 4 on the upper surface of the mask 30. Successively, the paste 4 is pressed and spread with the second squeezee 20 so that the groove 23 of the second squeezee 20 passes over a center part of the opening part 31 from on the film 4a, thereby forming a projection part 4b as a trace of passage of the groove 23 at a center part of an upper surface of the paste 4 positioned at the opening part 31.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造印刷结构的方法，所述印刷结构可以在将粘合剂安装在所述糊料上时尽可能多地抑制在印刷体上形成的糊状物中的气泡的形成。解决方案：第一挤压机10，其具有与掩模30的上表面成锐角的锥形表面，作为当尖端部分11相对时位于尖端部分11侧面上的浆料4的压制表面12 并且使用形成在前端部21中的沿向前方向延伸的槽23的第二挤压机20。通过用第一挤压机10的压制表面12挤压和铺展浆料4，在浆料4上填充有开口部分31，使得在面罩30的上表面上由浆料4形成薄膜4a。接着，糊状物4用第二挤压器20按压并展开，使得第二挤压器20的槽23从膜4a上经过开口部31的中心部分，从而形成突起部4b，作为通过的痕迹凹槽23位于位于开口部分31的糊状物4的上表面的中心部分。版权所有（C）2011，JPO＆INPIT

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