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    • 1. 发明专利
    • Image recognition apparatus and an image recognition method
    • JP3570201B2
    • 2004-09-29
    • JP3838898
    • 1998-02-20
    • 松下電器産業株式会社
    • 寿樹 安部
    • G01B11/00G06T1/00G06T7/00G06T7/60
    • PROBLEM TO BE SOLVED: To provide an image recognition device and an image recognition method capable of efficiently performing pattern matching with a stable recognition accuracy. SOLUTION: In this image recognition method for picking up an image of a recognition object by a camera 1, for storing image data in an image storage part 32 and for obtaining a matching degree of the registrated pattern of a detection target stored in a registration pattern storage part 4 and the image of the image storage part 3; matching degrees between plural images of the recognition object and the registered pattern are calculated, the matching degree of the respective images is obtained and the distribution of the correlation value of the matching degree is indicated by a contour line. The first image of the highest matching degree and second image of the second highest matching degree in matching degree distribution are specified, and based on the matching degree distribution of the first image and the highest matching degree of the second image, a sampling interval capable of surely identifying the two images is obtained and defined as a skip value. Thus, pattern matching is performed at a high speed without causing an erroneous recognition, the efficiency of image recognition is improved and image recognition is performed with a stable recognition accuracy.
    • 4. 发明专利
    • Automatic assembly equipment and automated assembly method
    • 空值
    • JP3384335B2
    • 2003-03-10
    • JP24806298
    • 1998-09-02
    • 松下電器産業株式会社
    • 寿樹 安部宏志 有吉倫史 江口
    • H04N5/225B23P19/00G05B19/401G06T1/00G06T7/00H01L21/52H04N7/18H05K13/02
    • G05B19/401G05B2219/33259G05B2219/37555G06T7/70Y10T29/49133Y10T29/4978Y10T29/53004Y10T29/53087
    • A die bonder equipped with an image recognition unit having a zoom optical system for placing a chip to a correct location in accordance with recognition results delivered from the image recognition unit. Data related with the recognition offset data that specify a relationship in the relative location between optical coordinates system and mechanical coordinates system, and the pixel rate, etc. are stored in advance in a correction magnification index memory section, maintaining linkage to respective zoom magnification indices. Results of recognition are converted from a location information in terms of an optical coordinates system into a location information in actual dimensions in terms of a mechanical coordinates system of the die bonder, using a datum selected among the data in accordance with a magnification index at which the chip was pictured by a camera of an image recognition section. The data setting operations, which were required to be done at each time when the zoom magnification rate is changed, are made automatically to an increased operational advantage.
    • 一种具有图像识别单元的管芯接合器,具有根据从图像识别单元传送的识别结果的用于将芯片放置到正确位置的变焦光学系统。 与指定光学坐标系和机械坐标系之间的相对位置的关系的识别偏移数据和像素速率等相关的数据预先存储在校正放大率索引存储部中,保持与各个变焦倍率指数的连接 。 根据光学坐标系的位置信息将切片结果从芯片接合机的机械坐标系中按照实际尺寸从位置信息中转换出来,使用从数据中选出的数据,根据其中的数据, 该芯片由图像识别部分的相机拍摄。 自动进行变焦放大率变更时每次要进行的数据设定动作,提高操作优势。