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1. 发明专利

JP2017092223A 多層配線基板の製造方法有权
公开(公告)号：JP2017092223A
公开(公告)日：2017-05-25
申请号：JP2015220003
申请日：2015-11-10
申请人：日本特殊陶業株式会社 , Ngk Spark Plug Co Ltd
发明人： NAGAYA YOSHIAKI , MIYAMOTO TAKU , IMANISHI YUTAKA , IWATA MUNEYUKI , MORI NAOKO
IPC分类号： H05K3/46
摘要：【課題】セラミック基板の上に配線層を片面に有する複数の単位樹脂絶縁層を積層して載置するに際し、位置ズレを確実に抑制ないし低減して、不用意な短絡やオープン不良を可及的に生じにくくした多層配線基板の製造方法を提供する。【解決手段】下側圧着治具7の上に拘束したセラミック基板12の上面に、複数の単位樹脂絶縁層J1〜J3、熱硬化性樹脂層1および金属箔3からなる複数の単位樹脂緩衝層J0とこれらの間に挟まれた熱可塑性樹脂層18とからなるクッション材Cn、および、上側圧着治具20を、垂直方向にのみ移動可能に順次積層して、複合積層体HSを形成する工程と、かかる複合積層体HSを下側加熱治具22と上側加熱治具23との間に挟み、該上側加熱治具23を下側加熱治具22側に押圧しつつ真空熱圧着する工程と、含む、多層配線基板30の製造方法。【選択図】図3

2. 发明专利

JP2015002226A 多層配線基板及びその製造方法有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2015002226A
公开(公告)日：2015-01-05
申请号：JP2013125266
申请日：2013-06-14
申请人：日本特殊陶業株式会社 , Ngk Spark Plug Co Ltd
发明人： IWATA MUNEYUKI , MIYAMOTO TAKU , NAGAYA YOSHIAKI , IMANISHI YUTAKA , HIRANO SATOSHI , MORI NAOKO
IPC分类号： H05K3/46
摘要：【課題】セラミック配線基板上に配線構造体を位置精度よく積層し、信頼性の高い多層配線基板を提供すること。【解決手段】多層配線基板10は、基板主面41及び基板裏面42を有するセラミック配線基板40と、セラミック配線基板40の基板主面41上に積層される配線構造体20,21とを備える。配線構造体20,21は、樹脂絶縁層22,23、配線層24,25及びビア導体26を備える。樹脂絶縁層22,23は、熱硬化性樹脂からなる第1樹脂層31と、第1樹脂層31の両面に積層され、熱可塑性樹脂からなる第2樹脂層32とにより構成されている。セラミック配線基板40の基板主面41には、基板中央部54を高所としかつ基板外周部55を低所とする高低差が設けられている。【選択図】図1
摘要翻译：要解决的问题：提供一种具有高可靠性的多层布线板，其中布线结构以高定位精度层压在陶瓷布线板上。解决方案：多层布线板10包括具有板主表面41的陶瓷布线板40 和板背面42以及层叠在陶瓷布线基板40的基板主面41上的布线结构体20,21。布线结构体20,21包括树脂绝缘层22,23，布线层24,25以及通路导体树脂绝缘层22和23分别由由热固性树脂构成的第一树脂层31和层压在第一树脂层31的两面并由热塑性树脂构成的第二树脂层32构成。在陶瓷布线板40的板主表面41上设置有板中心部分54为高位的高度差和板外周55为低的位置。

3. 发明专利

JP2014049701A Wiring board and method for manufacturing the same 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2014049701A
公开(公告)日：2014-03-17
申请号：JP2012193608
申请日：2012-09-03
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： IWATA MUNEYUKI , MIYAMOTO TAKU , NAGAYA YOSHIAKI , IMANISHI YUTAKA , MORI NAOKO
IPC分类号： H05K3/46 , H01L23/12 , H05K1/11 , H05K3/00 , H05K3/40
CPC分类号： H01L2924/15174
摘要： PROBLEM TO BE SOLVED: To improve adhesion between a through conductor and a wiring conductor layer, and to provide a wiring board with excellent connection reliability.SOLUTION: A wiring conductor layer 23 and a through hole 26 continuously penetrating resin insulating layers 21 and 22 are formed on a wiring board 10 for electronic component inspection. A via conductor 27 connected to the wiring conductor layer 23 is formed by filling the through hole 26 with a conductive paste. A through hole 26 portion penetrating the wiring conductor layer 23 includes a small diameter hole 51 located on surface sides of the resin insulating layers 21 and 22 and formed by an inner wall surface of the wiring conductor layer 23 and a large diameter part 52 provided in a position more away from surfaces of the resin insulating layers 21 and 22 than the small diameter part 51 and formed so that a diameter of the inner wall surface of the wiring conductor layer 23 is enlarged to the small diameter part 51.
摘要翻译：要解决的问题：提高贯通导体和布线导体层之间的粘附性，并提供具有良好连接可靠性的布线板。解决方案：连续穿透树脂绝缘层21和22的布线导体层23和通孔26是形成在用于电子部件检查的布线板10上。连接到布线导体层23的通孔导体27通过用导电膏填充通孔26而形成。贯通布线导体层23的通孔26包括位于树脂绝缘层21,22的表面侧的小直径孔51，由布线导体层23的内壁面和大直径部52构成，与树脂绝缘层21,22的表面比小直径部51更远的位置，形成为使布线导体层23的内壁面的直径扩大到小直径部51。

4. 发明专利

JP2013232474A Wiring board for mounting light emitting element 有权
标题翻译：用于安装发光元件的接线板
公开(公告)号：JP2013232474A
公开(公告)日：2013-11-14
申请号：JP2012102973
申请日：2012-04-27
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： MORI NAOKO , HIRANO SATOSHI , KAMAFUCHI KOJI , HORIUCHI KAZUKI , MORIKAWA KAZUKO
IPC分类号： H01L33/64 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element which has a mounting part of the light emitting element on its surface and sufficiently radiates heat from the mounted light emitting element from a rear surface of a substrate body to the exterior.SOLUTION: A wiring board for mounting a light emitting element includes a first connection conductor 17 and a second connection conductor 18 establishing electrical continuity between pads 11, 12 which are formed on a surface 3 of an insulation substrate 2 separated from each other and pads 15, 16 which are formed on a rear surface 4 of the insulation substrate 2 separated from each other. The wiring board for mounting the light emitting element is provided with: a first through conductor 20 disposed contacting with the front surface pad 11; and a second through conductor 24 which connects the first through conductor 20 with the rear surface pad 15 and has a length in a side surface view that is longer than that of the first through conductor 20. An area of the first through conductor 20 in a plane view, which excludes an area near the surface 3 of the insulation substrate 2, includes a mounting part 10a of the light emitting element 10 positioned on an upper surface of the first surface pad 11 and is larger than an area of the mounting part 10a. The first through conductor 20 overlaps with the first rear surface pad 15 in a projection of the plane view.
摘要翻译：要解决的问题：提供一种用于安装发光元件的布线板，该发光元件在其表面上具有发光元件的安装部分，并且从安装的发光元件从基板主体的后表面向外部充分辐射热量解决方案：用于安装发光元件的布线板包括：第一连接导体17和第二连接导体18，其建立在彼此分离的绝缘基板2的表面3上形成的焊盘11,12之间的电连续性，以及焊盘 15,16形成在彼此分离的绝缘基板2的后表面4上。用于安装发光元件的布线板设置有：与前表面焊盘11接触设置的第一贯通导体20; 以及第二贯通导体24，其将第一贯通导体20与后表面焊盘15连接，并且具有比第一贯穿导体20的长度的侧表面视图中的长度。第一贯通导体20的区域排除绝缘基板2的表面3附近的面的平面图包括位于第一表面焊盘11的上表面上的发光元件10的安装部10a，大于安装部10a的面积。第一通孔导体20在平面图的突起中与第一后表面焊盘15重叠。

5. 发明专利

JP2015002227A 多層配線基板及びその製造方法审中-公开
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2015002227A
公开(公告)日：2015-01-05
申请号：JP2013125267
申请日：2013-06-14
申请人：日本特殊陶業株式会社 , Ngk Spark Plug Co Ltd
发明人： IWATA MUNEYUKI , MIYAMOTO TAKU , NAGAYA YOSHIAKI , IMANISHI YUTAKA , HIRANO SATOSHI , MORI NAOKO
IPC分类号： H05K3/46
摘要：【課題】セラミック配線基板上に配線構造体を位置精度よく積層し、信頼性の高い多層配線基板を提供すること。【解決手段】多層配線基板10は、基板主面41及び基板裏面42を有するセラミック配線基板40と、セラミック配線基板40の基板主面41上に積層される配線構造体20とを備える。配線構造体20は、複数の樹脂絶縁層22,23、配線層25及びビア導体26を備える。樹脂絶縁層22,23は、熱硬化性樹脂からなる第1樹脂層31と、第1樹脂層31の両面に積層され、熱可塑性樹脂からなる第2樹脂層32とにより構成されている。配線構造体20及びセラミック配線基板40には、複数の絶縁樹脂層22,23をそれらの厚さ方向に貫通して先端がセラミック配線基板40内に至る固定孔52が設けられ、固定孔52内に光硬化性樹脂の硬化物からなる充填材53が充填されている。【選択図】図1
摘要翻译：要解决的问题：提供一种具有高可靠性的多层布线板，其中布线结构以高定位精度层压在陶瓷布线板上。解决方案：多层布线板10包括具有板主表面41的陶瓷布线板40 和板背面42以及层叠在陶瓷布线基板40的基板主表面41上的布线结构20.布线结构20包括多个树脂绝缘层22和23，布线层25以及通孔导体26 树脂绝缘层22,23由热固性树脂构成的第一树脂层31和层叠在第一树脂层31的两面上并由热塑性树脂构成的第二树脂层32构成。在布线结构体20和陶瓷布线基板40中，设置贯通多个绝缘树脂层22,23的固定孔52，直到那些顶端到达陶瓷布线板40的内部，并且固定孔 52填充有由光固化树脂的固化产物组成的填充材料53。

6. 发明专利

JP2014049509A Wiring board manufacturing method 有权
标题翻译：接线板制造方法
公开(公告)号：JP2014049509A
公开(公告)日：2014-03-17
申请号：JP2012189330
申请日：2012-08-29
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： MORI NAOKO , IWATA MUNEYUKI , MIYAMOTO TAKU , NAGAYA YOSHIAKI , IMANISHI YUTAKA
IPC分类号： H05K3/06 , H05K1/02 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can form a wiring conductor layer connected to a through conductor with high location accuracy and which can manufacture a wiring board excellent in connection reliability.SOLUTION: A wiring board manufacturing method comprises: forming by processing a surface of a copper foil 47 of a resin film 48, a non-through hole which does not pierce the copper foil 47 as an alignment mark 51; arranging an exposure mask 58 on a dry film 53 in a state of aligning a positioning mark 57 with respect to the alignment mark 51; performing exposure of the dry film 53 through the exposure mask 58 and subsequently performing developing to form an etching resist; and forming a wiring conductor layer by patterning by etching the copper foil 47 and removing a formation part of the alignment mark 51 by etching.
摘要翻译：要解决的问题：提供一种可以形成具有高定位精度连接到通孔的布线导体层并且可以制造具有优异的连接可靠性的布线板的布线板制造方法。解决方案：一种布线板的制造方法，包括：形成通过加工树脂膜48的铜箔47的表面，不穿过铜箔47的非通孔作为对准标记51; 在定位标记57相对于对准标记51对准的状态下，在干膜53上布置曝光掩模58; 通过曝光掩模58进行干膜53的曝光，随后进行显影以形成抗蚀剂; 并通过蚀刻铜箔47进行图案化并通过蚀刻去除对准标记51的形成部分来形成布线导体层。

7. 发明专利

JP2013065793A Wiring board 审中-公开
标题翻译：接线板
公开(公告)号：JP2013065793A
公开(公告)日：2013-04-11
申请号：JP2011204766
申请日：2011-09-20
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： MORI NAOKO , HIRANO SATOSHI , KAMAFUCHI KOJI , YAMAMOTO SHIGEYUKI , HORIUCHI KAZUKI , NAKAGAWA HISATO
IPC分类号： H01L23/12 , H01L23/36 , H01L33/64 , H05K3/46
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To inhibit cracks occurring at a boundary face between an insulation substrate and a thermal via; and improve heat dissipation performance of heat generated by a light-emitting element.SOLUTION: A wiring board 20 comprises an external connection electrode layer 120, a ceramic layer 130 and a wiring layer 140. The ceramic layer 130 is formed out of alumina and borosilicate glass and has a coefficient of thermal conductivity of not more than 6 W/mK. Because a plurality of first thermal vias 132 and a second thermal via 134 having a smaller diameter than the first thermal via 132 are arranged in the ceramic layer 130, heat dissipation performance of heat generated by a light-emitting element 150 is improved in the wiring board 20 using the ceramic layer 130 having the low coefficient of thermal conductivity is improved. The first thermal vias 132 are arranged in a light-emitting element mounting region 150a in a lattice shape and the second thermal via 134 is positioned equally distant from all the adjacent first thermal vias 132.
摘要翻译：要解决的问题：抑制在绝缘基板和热通孔之间的边界面处发生的裂纹; 并且提高由发光元件产生的热的散热性能。解决方案：布线板20包括外部连接电极层120，陶瓷层130和布线层140.陶瓷层130由氧化铝和硼硅酸盐玻璃形成，并且具有不大于 6 W / mK。由于在陶瓷层130中布置有多个第一热通路132和直径小于第一热通路132的第二热通路134，所以在布线中提高了由发光元件150产生的热量的散热性能使用具有低导热系数的陶瓷层130的板20得到改善。第一热通孔132布置在格子形状的发光元件安装区域150a中，并且第二热通孔134位于与所有相邻的第一热通孔132相等的位置。（C）2013，JPO和INPIT

8. 发明专利

JP2003298462A Ceramic board for branching filter device 审中-公开
标题翻译：用于分配过滤装置的陶瓷板
公开(公告)号：JP2003298462A
公开(公告)日：2003-10-17
申请号：JP2002098254
申请日：2002-04-01
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： UCHIDA ATSUSHI , MORI NAOKO
IPC分类号： H01L23/12 , H03H9/25 , H03H9/64 , H03H9/72 , H04B1/50
摘要： PROBLEM TO BE SOLVED: To provide a ceramic board for a branching filter device for improving the isolation between a transceiving signal and a transmission signal, the transceiving signal and a received signal, or the transmission signal and the received signal. SOLUTION: The ceramic board for branching filter device 101 includes a transmission purpose side face conductor 133T through which the transmission signal is transmitted and a received signal purpose side conductor 133R through which the received signal is transmitted at a side of a board side face 104. A line 181 for a phase matching circuit, a first ground level layer 183P placed between the transmission purpose side face conductor 133T and the line 181, and a second ground layer 183Q placed between the received signal purpose side conductor 133R and the line 181 are formed between fifth and sixth ceramic layers 145 and 146. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种用于改善收发信号和发送信号，收发信号和接收信号或发送信号和接收信号之间的隔离的分路滤波器装置的陶瓷板。解决方案：用于分路滤波器装置101的陶瓷板包括传输信号传输的传输目的侧面导体133T和接收信号目的侧导体133R，接收信号在板侧一侧传输用于相位匹配电路的线路181，放置在传输目的侧面导体133T和线路181之间的第一接地层183P和放置在接收信号目的侧导体133R与线路之间的第二接地层183Q 181形成在第五和第六陶瓷层145和146之间。版权所有（C）2004，JPO

9. 发明专利

JP2014075498A Method of manufacturing ceramic substrate 有权
标题翻译：制造陶瓷基板的方法
公开(公告)号：JP2014075498A
公开(公告)日：2014-04-24
申请号：JP2012222655
申请日：2012-10-05
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： MORI NAOKO , HIRANO SATOSHI , HORIUCHI KAZUKI , MORIKAWA KAZUKO
IPC分类号： H05K3/46 , H01L23/12 , H01L23/13 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate including a ceramic substrate body and a heat dissipation via conductor of relative large diameter penetrating the substrate body, capable of dissipating heat generated from a mounted element generating a lot of heat, e.g., a light-emitting element mounted on the upper end face of the heat dissipation via conductor, efficiently to the outside from the back side of the substrate body, and having stabilized electrical conductivity.SOLUTION: A method of manufacturing a ceramic substrate 1 includes the steps of: preparing a molding S1 with a sheet material formed by laminating a plurality of green sheets G1-G3, in which at least one surface (back surface) 4 of a green sheet molding 2a becoming a substrate body 2 having a pair of surfaces 3, 4 is covered with a sheet material 20; forming via holes 12, 13 penetrating the molding S1 with a sheet material in the thickness direction thereof; filling the via holes 12, 13 with a conductor-containing paste 10a becoming a heat dissipation via conductor 10; and peeling the sheet material 20 after drying the conductor-containing paste 10a.
摘要翻译：要解决的问题：提供一种制造陶瓷基板的方法，该陶瓷基板包括陶瓷基板主体和穿过基板主体的相对大直径的散热通孔导体，能够散发由产生大量热量的安装元件产生的热，例如，安装在散热通孔导体的上端面上的发光元件，有效地从基板体的背面向外侧，并具有稳定的导电性。解决方案：陶瓷基板1的制造方法包括：步骤：制备具有通过层叠多个生片G1-G3形成的片材的成型品S1，其中生片成型件2a的至少一个表面（背面）4成为具有一对表面的基片主体2 3，4被片材20覆盖; 在片材的厚度方向上形成贯穿成形体S1的通孔12,13; 用通过导体10的导体的糊状物10a填充通孔12,13，成为通过导体10的散热; 并且在干燥含导体的浆料10a之后剥离片材20。

10. 发明专利

JP2014033101A Wiring board and manufacturing method therefor 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2014033101A
公开(公告)日：2014-02-20
申请号：JP2012173120
申请日：2012-08-03
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： MORI NAOKO , KAMAFUCHI KOJI , KATO TATSUYA , BABA MAKOTO , YAMADA TOMOHIDE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a technique for suppressing occurrence of negative warp in a wiring board after firing.SOLUTION: In a wiring board, the diameters of through conductors included in the ceramic insulation layer of the same layer have the same size entirely, and the diameter of a through conductor included in at least one of a plurality of ceramic insulation layers has a size different from that of a through conductor included in the ceramic insulation layer of other layer. When the thickness of the wiring board in the lamination direction is divided into two, and the upper side is defined as upper layer, the lower side is defined as lower layer, the total of volume of the wiring layer included in the upper layer is defined as Vc1 (mm), the total of volume of the through conductors included in the upper layer is defined as Vp1 (mm), the total of volume of the wiring layer included in the lower layer is defined as Vc2 (mm), and the total of volume of the through conductors included in the lower layer is defined as Vp2 (mm), following relational expression is satisfied; Vc1+Vp1≤Vc2+Vp2.
摘要翻译：要解决的问题：提供一种抑制烧结后的布线板发生负翘曲的技术。解决方案：在布线板中，包含在同一层的陶瓷绝缘层中的贯通导体的直径完全相同，并且包含在多个陶瓷绝缘层中的至少一个陶瓷绝缘层中的贯通导体的直径的尺寸与包含在其它层的陶瓷绝缘层中的贯通导体的尺寸不同。当层叠方向上的布线板的厚度分为两层，上侧被定义为上层时，下侧被定义为下层，限定上层中包含的布线层的总体积作为Vc1（mm），包含在上层中的贯通导体的总体积定义为Vp1（mm），下层中包含的布线层的总体积定义为Vc2（mm），并且包含在下层中的贯通导体的总体积被定义为Vp2（mm），满足关系式; VC1 +Vp1≤Vc2+ Vp2的。

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